Abstract:
An integrated circuit includes SOI-type MOS transistors on insulator, with a first well capable of being biased located under the insulator. The first wells are doped with a first conductivity type. Each first well includes, under the insulator of each transistor, a back gate region that is more heavily doped than the first well. The first wells are separated from each other by inclusion in in a second well that is also capable of being biased. The second well is doped with a second conductivity type.
Abstract:
A semiconductor device for protection from electrostatic discharge includes a number of modules for protection from electrostatic discharge. Each module includes a thyristor having terminals and a gate, and a diode coupled in antiparallel to the terminals of the thyristor. Each module is sized to share a saturation current with neighboring modules when an electrostatic discharge current is received. A resistive network couples modules between two terminals. A triggering circuit includes a common triggering output that is coupled to the gate of the thyristor of each module and a common buried semiconductor layer contacts each module.
Abstract:
A semiconductor device for protection from electrostatic discharge includes a number of modules for protection from electrostatic discharge. Each module includes a thyristor having terminals and a gate, and a diode coupled in antiparallel to the terminals of the thyristor. Each module is sized to share a saturation current with neighboring modules when an electrostatic discharge current is received. A resistive network couples modules between two terminals. A triggering circuit includes a common triggering output that is coupled to the gate of the thyristor of each module and a common buried semiconductor layer contacts each module.
Abstract:
At least three electrically conducting blocks are disposed within an isolating region; and at least two of them are mutually separated and capacitively coupled by a part of the isolating region. At least two of them, being semiconductor, have opposite types of conductivity or identical types of conductivity, but with different concentrations of dopants, and these are in mutual contact by one of their sides. The mutual arrangement of these blocks within the isolating region, their type of conductivity and their concentration of dopants form at least one electronic module. Some of the blocks define input and output blocks.
Abstract:
A cell includes a Z2-FET-type structure that is formed with two front gates extending over an intermediate region between an anode region and a cathode region. The individual front gates of the two front gates are spaced apart by a distance that is shorter than 40% of a width of each individual front gate.
Abstract:
An electronic device includes a module that delivers a positive temperature coefficient output voltage at an output terminal. A thermistor includes a first MOS transistor operating in weak inversion mode and having a negative temperature coefficient drain-source resistance and whose source is coupled to the output terminal. A current source coupled to the output terminal operates to impose the drain-source current of the first transistor.
Abstract:
An integrated device, for generating a random signal, includes: a first terminal; a pulse signal generator configured to generate a current pulse train on the first terminal; and a first control circuit coupled to the first terminal and configured to convert the current pulse train into a voltage signal randomly including voltage pulses greater than a threshold, the random signal containing the voltage pulses greater than the threshold.
Abstract:
An electronic device includes a module that delivers a positive temperature coefficient output voltage at an output terminal. A thermistor includes a first MOS transistor operating in weak inversion mode and having a negative temperature coefficient drain-source resistance and whose source is coupled to the output terminal. A current source coupled to the output terminal operates to impose the drain-source current of the first transistor.
Abstract:
An ESD protection device includes a MOS transistor connected between a first terminal and a second terminal and having a gate region, source/drain region and a well region electrically coupled by a resistive-capacitive circuit configured to control turn on of the MOS transistor in response to an ESD event. The resistive-capacitive circuit has a common part with at least one of the source, gate or drain regions of the MOS transistor and includes a capacitive element and a resistive element. A first electrode of the capacitive element is formed by the resistive element and a second electrode of the capacitive element is formed by at least a portion of a semiconductor film within which the source/drain region is formed.
Abstract:
An integrated circuit is produced on a bulk semiconductor substrate in a given CMOS technology and includes a semiconductor device for protection against electrostatic discharges. The semiconductor device has a doublet of floating-gate thyristors coupled in parallel and head-to-tail. Each thyristor has a pair of electrode regions. The two thyristors respectively have two separate gates and a common semiconductor gate region. The product of the current gains of the two transistors of each thyristor is greater than 1. Each electrode region of at least one of the thyristors has a dimension, measured perpendicularly to the spacing direction of the two electrodes of the corresponding pair, which is adjusted so as to impart to the thyristor an intrinsic triggering voltage less than the breakdown voltage of a transistor to be protected, and produced in the CMOS technology.