Method for testing a photonic integrated circuit including a device under test
    11.
    发明授权
    Method for testing a photonic integrated circuit including a device under test 有权
    包括被测设备的光子集成电路的测试方法

    公开(公告)号:US09453723B1

    公开(公告)日:2016-09-27

    申请号:US14754747

    申请日:2015-06-30

    CPC classification number: G01B11/27 G01R31/31728 G02B6/12019

    Abstract: A method is for testing a photonic integrated circuit (IC) that includes a test structure having a test optical splitter, a test optical input, and first and second test optical outputs. A device under test (DUT) is coupled between the first test optical output and the first output of the test optical splitter. The deembedding structure includes a deembedding optical splitter, a deembedding optical input and first and second deembedding optical outputs. The method includes coupling a test probe device to the test optical inputs and outputs and the deembedding optical inputs and outputs and operating the test probe device to make at least one test measurement related to the DUT and at least one deembedding measurement. The at least one test measurement is processed with the at least one deembedding measurement to determine whether the DUT is acceptable and independent of alignment error.

    Abstract translation: 一种用于测试包括具有测试光分路器,测试光输入以及第一和第二测试光输出的测试结构的光子集成电路(IC)的方法。 被测设备(DUT)耦合在第一测试光输出端和测试光分路器的第一输出端之间。 该装饰结构包括一个嵌入式光分路器,一个嵌入式光输入端和第一和第二嵌入式光输出端。 该方法包括将测试探针装置耦合到测试光输入和输出以及去嵌入光输入和输出,并操作测试探针装置以进行至少一个与DUT相关的测试测量和至少一个去镶嵌测量。 用至少一个去镶嵌测量来处理至少一个测试测量,以确定DUT是否可接受并且不依赖于对准误差。

    Photonic system and method for its manufacture

    公开(公告)号:US12019293B2

    公开(公告)日:2024-06-25

    申请号:US17932623

    申请日:2022-09-15

    Abstract: A photonic system includes a first photonic circuit having a first face and a second photonic circuit having a second face. The first photonic circuit comprises first wave guides, and, for each first wave guide, a second wave guide covering the first wave guide, the second wave guides being in contact with the first face and placed between the first face and the second face, the first wave guides being located on the side of the first face opposite the second wave guides. The second photonic circuit comprises, for each second wave guide, a third wave guide covering the second wave guide. The first photonic circuit comprises first positioning devices projecting from the first face and the second photonic circuit comprises second positioning devices projecting from the second face, at least one of the first positioning devices abutting one of the second positioning devices in a first direction.

    Optical signal splitter
    17.
    发明授权

    公开(公告)号:US10401571B2

    公开(公告)日:2019-09-03

    申请号:US15971665

    申请日:2018-05-04

    Abstract: The disclosure relates to an optical splitter including two waveguides on either side of an axis. Each waveguide includes a first segment and a second segment that are closer to the axis than the rest of the waveguide. The first segments are optically coupled and the second segments are optically coupled. Each guide includes between the first and second segment, starting from the first segment, a first curved section including in succession a curvature the concavity of which is turned the side opposite the axis then a curvature the concavity of which is turned towards the axis, and starting from the second segment a second curved section including in succession a curvature the concavity of which is turned the side opposite the axis then a curvature the concavity of which is turned towards the axis. The first curved sections of the two waveguides are curved differently.

    METHOD FOR CHARACTERIZATION OF PHOTONIC DEVICES, AND ASSOCIATED DEVICE

    公开(公告)号:US20190094107A1

    公开(公告)日:2019-03-28

    申请号:US16188537

    申请日:2018-11-13

    Abstract: An intermediate signal is separated into a first sub-signal and a second sub-signal according to a separation coefficient having a known real value. The first sub-signal is delivered to a first photonic circuit containing at least one photonic device to be characterized and a first photonic part. The second sub-signal is delivered to a second photonic circuit containing a second photonic part having a same transfer function as the first photonic part but lacking the at least one photonic device. Optical output signals from the first and second photonic circuits are converted into first and second electrical signals. Losses of the at least one photonic device are determined from processing the electrical signals and from the known real value of the separation coefficient.

Patent Agency Ranking