Microelectromechanical mirror device with piezoelectric actuation, having an improved structure

    公开(公告)号:US11353694B2

    公开(公告)日:2022-06-07

    申请号:US17121961

    申请日:2020-12-15

    Abstract: A microelectromechanical mirror device has a fixed structure defining a cavity. A tiltable structure carrying a reflecting surface is elastically suspended above the cavity with a main extension in a horizontal plane. Elastic elements are coupled to the tiltable structure and at least one first pair of driving arms, which carry respective regions of piezoelectric material, are biasable to cause rotation of the tiltable structure about at least one first axis of rotation parallel to a first horizontal axis of the horizontal plane. The driving arms are elastically coupled to the tiltable structure on opposite sides of the first axis of rotation and are interposed between the tiltable structure and the fixed structure. The driving arms have a thickness, along an orthogonal axis transverse to the horizontal plane, smaller than a thickness of at least some of the elastic elements coupled to the tiltable structure.

    Microelectromechanical device having a structure tiltable by piezoelectric actuation about two rotation axes

    公开(公告)号:US12222492B2

    公开(公告)日:2025-02-11

    申请号:US17487166

    申请日:2021-09-28

    Abstract: A microelectromechanical device includes a fixed structure having a frame defining a cavity, a tiltable structure elastically suspended above the cavity with main extension in a horizontal plane, a piezoelectrically driven actuation structure which can be biased to cause a desired rotation of the tiltable structure about a first and second rotation axes, and a supporting structure integral with the fixed structure and extending in the cavity starting from the frame. Lever elements are elastically coupled to the tiltable structure at a first end by elastic suspension elements and to the supporting structure at a second end by elastic connecting elements which define a lever rotation axis. The lever elements are elastically coupled to the actuation structure so that their biasing causes the desired rotation of the tiltable structure about the first and second rotation axes.

    Angular piezoelectric actuator for a MEMS shutter and manufacturing method thereof

    公开(公告)号:US12117605B2

    公开(公告)日:2024-10-15

    申请号:US17355861

    申请日:2021-06-23

    Abstract: A MEMS actuator includes a main body having a central portion, couplable to a substrate, and a peripheral portion suspended over the substrate when the central portion is coupled to the substrate. The peripheral portion has a deformable structure extending around the central portion, and forming successively arranged membranes. The MEMS actuator includes bearing structures and corresponding piezoelectric actuators. The bearing structures are fixed at their top to the deformable structure and laterally delimit corresponding cavities, each having a lateral opening facing the central portion of the main body and closed at the top by a membrane. A fixed part of the membrane is fixed to the underlying bearing structure and a suspended part is laterally offset with respect to the underlying bearing structure. The piezoelectric actuators are controllable to cause deformation of the corresponding membrane and rotation of the bearing structures around the central portion of the main body.

    Resonant MEMS device having a tiltable, piezoelectrically controlled micromirror

    公开(公告)号:US11933966B2

    公开(公告)日:2024-03-19

    申请号:US17715639

    申请日:2022-04-07

    CPC classification number: G02B26/0858 B81B3/0021 B81B2201/042

    Abstract: Disclosed herein is a method of making a microelectromechanical (MEMS) device. The method includes, in a single structural layer, affixing a tiltable structure to an anchorage portion with first and second supporting arms extending between the anchorage portion and opposite sides of the tiltable structure, and forming first and second resonant piezoelectric actuation structures extending between a constraint portion of the first supporting arm and the anchorage portion, on opposite sides of the first supporting arm. The method further includes coupling a handling wafer underneath the structural layer to define a cavity therebetween, and forming a passivation layer over the structural layer, the passivation layer having contact openings defined therein for routing metal regions for electrical coupling to respective electrical contact pads, the electrical contact pads being electrically connected to the first and second resonant piezoelectric actuation structures.

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