公开(公告)号：US09390988B2

公开(公告)日：2016-07-12

申请号：US13630872

申请日：2012-09-28

Applicant: STMicroelectronics (Malta) Ltd

Inventor： Mark A. Azzopardi ,  Kevin Formosa ,  Ivan Ellul

IPC: B32B1/02 ,  B32B15/01 ,  H05K5/03 ,  B23K1/20 ,  H01L23/10 ,  B81C1/00

CPC classification number: H01L23/10 ,  B81C1/00269 ,  B81C2203/019 ,  H01L2924/0002 ,  H01L2924/16152 ,  Y10T428/1241 ,  Y10T428/13 ,  H01L2924/00

Abstract: One embodiment discloses a method for soldering a cap for an integrated electronic device to a support layer, including the steps of: providing a support layer; providing a cap including a core of a first material and a coating layer of a second material, the first and second material being respectively wettable and non-wettable with respect to a solder, the coating layer being arranged so as to expose a surface of the core; coupling the cap with the support layer; and soldering the surface of the core to the support layer, by means of the solder.

Abstract translation: 一个实施例公开了一种用于将集成电子设备的盖焊接到支撑层的方法，包括以下步骤：提供支撑层; 提供包括第一材料的芯和第二材料的涂层的盖，所述第一和第二材料分别相对于焊料可润湿和不可湿润，所述涂层被布置为暴露所述第一材料的表面 核心; 将盖与支撑层联接; 并通过焊料将芯的表面焊接到支撑层。

公开(公告)号：US09257372B2

公开(公告)日：2016-02-09

申请号：US14032075

申请日：2013-09-19

Applicant: STMicroelectronics (Malta) Ltd ,  STMicroelectronics Pte Ltd

Inventor： Roseanne Duca ,  Kim-Yong Goh ,  Xueren Zhang ,  Kevin Formosa

IPC: H01L23/495 ,  H01L21/56 ,  G01P1/02 ,  H01L23/31 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01L23/49541 ,  G01P1/023 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3107 ,  H01L2224/45147 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2924/1815 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/09781 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2224/45099

Abstract: A surface mount package of a semiconductor device, has: an encapsulation, housing at least one die including semiconductor material; and electrical contact leads, protruding from the encapsulation to be electrically coupled to contact pads of a circuit board; the encapsulation has a main face designed to face a top surface of the circuit board, which is provided with coupling features designed for mechanical coupling to the circuit board to increase a resonant frequency of the mounted package. The coupling features envisage at least a first coupling recess defined within the encapsulation starting from the main face, designed to be engaged by a corresponding coupling element fixed to the circuit board, thereby restricting movements of the mounted package.

Abstract translation: 半导体器件的表面贴装封装具有：封装，容纳至少一个包含半导体材料的管芯; 以及电接触引线，从封装凸出以电耦合到电路板的接触焊盘; 封装具有设计成面向电路板的顶表面的主面，该主面具有设计成用于机械耦合到电路板的耦合特征，以增加安装封装的谐振频率。 耦合特征设想至少一个第一耦合凹槽，其限定在从主面开始的封装内，被设计成由固定到电路板的对应耦合元件接合，从而限制安装的封装的移动。

公开(公告)号：US09253579B2

公开(公告)日：2016-02-02

申请号：US13648213

申请日：2012-10-09

Applicant: STMicroelectronics (Malta) Ltd

Inventor： Kevin Formosa

IPC: H01L23/12 ,  H01L23/02 ,  H01L21/00 ,  H04R19/00 ,  B81B7/00

CPC classification number: B81B7/0074 ,  B81B7/0061 ,  B81B2201/0257 ,  B81B2207/012 ,  B81C1/00309 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/4824 ,  H04R19/005 ,  H04R19/04 ,  H04R31/00 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A packaged MEMS device, wherein at least two support structures are stacked on each other and are formed both by a support layer and a wall layer coupled to each other and delimiting a respective chamber. The chamber of the first support structure is upwardly delimited by the support layer of the second support structure. A first and a second dice are accommodated in a respective chamber, carried by the respective support layer of the first support structure. The support layer of the second support structure has a through hole allowing wire connections to directly couple the first and the second dice. A lid substrate, coupled to the second support structure, closes the chamber of the second support structure.

Abstract translation: 一种封装的MEMS器件，其中至少两个支撑结构彼此堆叠并且由支撑层和彼此耦合并限定相应室的壁层形成。 第一支撑结构的腔室由第二支撑结构的支撑层向上限定。 第一和第二骰子容纳在由第一支撑结构的相应支撑层承载的相应的腔室中。 第二支撑结构的支撑层具有允许电线连接直接耦合第一和第二裸片的通孔。 耦合到第二支撑结构的盖基板封闭第二支撑结构的室。