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11.发明授权公开(公告)号：US09090783B2
公开(公告)日：2015-07-28
申请号：US12707102
申请日：2010-02-17
CPC分类号： C09D5/32 , B23K26/40 , B23K2101/40 , B23K2103/50 , H01L21/67092
摘要： A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent is coated on a surface of a wafer, which is to be processed, and is then dried to form a protective film. Laser dicing through the protective film produces chips from the wafer. As a result, deposition of debris can be effectively prevented on the entire face of the chips, including their peripheral edge portions.
摘要翻译： 根据本发明的用于激光切割的保护膜剂包括溶解在其中的水溶性树脂和至少一种选自水溶性染料，水溶性着色剂 ，和水溶性紫外线吸收剂。 将保护膜剂涂布在待加工的晶片的表面上，然后干燥以形成保护膜。 通过保护膜的激光切割从晶片产生芯片。 结果，可以在芯片的整个表面（包括它们的周缘部分）上有效地防止碎屑沉积。
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12.发明授权Method of detecting condensing spot position in laser beam processing apparatus 有权检测激光束处理装置中聚光点位置的方法公开(公告)号：US08957347B2
公开(公告)日：2015-02-17
申请号：US13617046
申请日：2012-09-14
IPC分类号： H01L21/30 , H01L21/304 , B23K26/00 , B23K26/04 , B23K26/40
CPC分类号： B23K26/048 , B23K26/00 , B23K26/0006 , B23K26/40 , B23K2103/50 , B23K2103/56 , H01L21/30 , H01L21/304 , H01L21/3043 , H01L2221/00
摘要： A method of detecting a condensing spot position in a laser beam processing apparatus, including: a detection position setting step of setting a plurality of Z-axis directional positions in a range from a starting point to an ending point of detection positions into which the condenser is positioned; a laser beam processed groove forming step of sequentially positioning the condenser into the detection positions in the range from the starting point to the ending point, performing a predetermined interval indexing feeding by operating indexing feeding means each time the detection position for the condenser is changed, and forming a laser beam processed groove of a predetermined length in the plate-shaped body at each of the detection positions for the condenser; and a laser beam processed groove imaging step of imaging the laser beam processed grooves formed in the plate-shaped body by imaging means.
摘要翻译： 一种检测激光束处理装置中的聚光点位置的方法，包括：检测位置设定步骤，在从所述冷凝器的检测位置的起始点到终点的范围内设定多个Z轴方向位置 定位 激光束处理槽形成步骤，将冷凝器顺序地定位在从起点到终点的范围内的检测位置，每当改变冷凝器的检测位置时，通过操作分度输送装置执行预定的间隔分度进给， 以及在所述冷凝器的每个检测位置处，在所述板状体中形成预定长度的激光束处理槽; 以及激光束处理槽成像步骤，通过成像装置对形成在板状体中的激光束处理槽进行成像。
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13.发明授权公开(公告)号：US07678959B2
公开(公告)日：2010-03-16
申请号：US11711111
申请日：2007-02-27
IPC分类号： A61F15/00
CPC分类号： A61F13/0253 , A61F13/0209 , A61F13/0226 , A61F2013/00327 , A61F2013/00412 , A61F2013/00582 , Y10T428/24355
摘要： The present invention relates to a film base material for an adhesive skin patch, which includes an elastomer film unevenly having unevenness on at least one surface thereof, in which, in one unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the longest among the plurality of unevenness, the distance is within the range of from 1 to 5 μm; in another unevenness in which the distance perpendicular to the surface of the elastomer film between the top of the unevenness and the bottom thereof is the shortest among the plurality of unevenness, the distance is within the range of from 0.1 to 0.9 μm; and the 10-point average roughness of the surface is within the range of from 0.5 μm to 3 μm, and which is decreased in glossy texture on the surface thereof and inconspicuous when it is applied to the skin or the like; and the adhesive skin patch including the film base material.
摘要翻译： 本发明涉及一种用于粘合性皮肤贴剂的薄膜基材，其包括在其至少一个表面上不均匀地具有不均匀性的弹性体膜，其中在垂直于弹性体膜表面之间的距离 凹凸的顶部和底部是多个凹凸中最长的距离，在1〜5μm的范围内; 在垂直于弹性体膜的表面之间的凹凸的顶部与其底部之间的距离在多个凹凸之中最短的另一个凹凸中，该距离在0.1至0.9μm的范围内; 并且表面的10点平均粗糙度在0.5μm至3μm的范围内，并且其表面上的光泽质地减小并且当其施加到皮肤等时不显眼; 以及包括膜基材的粘合性皮肤贴剂。
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公开(公告)号：US20060197260A1
公开(公告)日：2006-09-07
申请号：US11365833
申请日：2006-03-02
CPC分类号： H01L24/83 , B23K26/10 , B23K2103/42 , B23K2103/50 , H01L21/6835 , H01L21/6836 , H01L21/78 , H01L24/27 , H01L24/29 , H01L2221/68327 , H01L2221/68336 , H01L2224/2919 , H01L2224/83191 , H01L2224/8385 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01033 , H01L2924/01074 , H01L2924/0665 , H01L2924/07802 , H01L2924/00 , H01L2924/3512
摘要： A laser processing method for melt-dividing an adhesive film for die bonding affixed to the back surface of a semiconductor wafer which has been separated into a plurality of semiconductor chips and which is put on an extensible dicing tape mounted on an annular frame along dividing grooves for separating the plurality of semiconductor chips from one another, comprising the steps of a tape expanding step for expanding the dicing tape affixed to the semiconductor wafer to increase the width of the dividing grooves for separating the plurality of semiconductor chips from one another; and an adhesive film melt-dividing step for melt-dividing the adhesive film along the dividing grooves by applying a laser beam to the adhesive film along the dividing grooves in a state where the width of the dividing grooves for separating the plurality of semiconductor chips from one another has been increased.
摘要翻译： 一种激光加工方法，用于将分离成多个半导体芯片的半导体晶片的背面固定在芯片接合用粘合膜上进行熔融分割，并将其放置在沿着分隔槽安装在环形框架上的可延伸切割带 用于将多个半导体芯片彼此分离，包括以下步骤：扩展步骤，用于扩展固定到半导体晶片上的切割胶带，以增加用于将多个半导体芯片彼此分离的分隔槽的宽度; 以及粘合膜熔融分离步骤，用于在分离多个半导体芯片的分隔槽的宽度的状态下沿着分隔槽将粘合膜施加激光束，沿着分割槽熔融分割粘合剂膜 彼此已经增加了。
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15.发明授权Lightguide having trapezoidally-shaped main body with a level surface at an angle to a rear surface 有权具有梯形主体的光导，其具有与后表面成一定角度的水平表面公开(公告)号：US06215936B1
公开(公告)日：2001-04-10
申请号：US09147594
申请日：1999-01-29
IPC分类号： G02B634
CPC分类号： G02B6/0036 , G02B6/00 , G02B6/0001 , G02B6/0061 , G02B6/0065 , Y10S385/901
摘要： A transparent lightguide (3) which guide light at least from one side end plane is characterized in that a large number of speckled, solid-line shaped or broken-line shaped protruding patterns whose cross-sectional width W (&mgr;m) at a cross section perpendicular to the axis of a linear light source is 10≦W≦200 are arranged on a light emitting surface at a low density in a region close to the linear light source and at a high density in a region far from the linear light source so as to make the luminance distribution of the light emitted from the light emitting surface approximately uniform. Here, the cross section of the protruding pattern is preferable to be approximately trapezoidal while having a straight part partially and the ratio H/W to be 0.2≦H/W≦1.0, where W and H denote cross-sectional width and height of the protruding pattern, respectively, or the cross section of the protruding pattern is preferable to be approximately circular-arc and the ratio H/W to be 0.2≦H/W≦0.5, where W and H denote cross-sectional width and height of the protruding pattern, respectively.
摘要翻译： 至少从一个侧端引导光的透明光导（3）的特征在于，在横截面处的横截面宽度W（mum）的大量斑点状，实线形或虚线形的突出图案 垂直于线性光源的轴的10 <= W <= 200在靠近线性光源的区域以低密度布置在发光表面上，并且在远离线性光的区域中以高密度布置 源，使得从发光表面发射的光的亮度分布近似均匀。 这里，突出图案的截面优选为大致梯形，同时具有部分直线部分，并且比率H / W为0.2 <= H / W <= 1.0，其中W和H表示横截面宽度和高度 或突出图案的横截面优选为大致圆弧，比率H / W为0.2 <= H / W <= 0.5，其中W和H表示横截面宽度 和突出图案的高度。
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公开(公告)号：US09320354B2
公开(公告)日：2016-04-26
申请号：US14566231
申请日：2014-12-10
申请人： Toshiyuki Yoshikawa
发明人： Toshiyuki Yoshikawa
CPC分类号： A47B61/04 , A47B47/0075 , A47B61/003
摘要： The invention provides a shoe storage apparatus capable of saving space when stored, wherein a shoe storage apparatus includes a leg to be disposed on an installation surface, and an upper panel which has a base end portion to be supported by the leg and a tip end portion on the side opposite to the base end portion, and is disposed at a distance from the installation surface in a state where the base end portion is supported by the leg, and on which one shoe of a pair of shoes can be placed, and the upper panel is constituted to be detachable from the leg.
摘要翻译： 本发明提供了一种能够在储存时节省空间的鞋存储装置，其中，鞋存储装置包括要设置在安装表面上的支脚，以及具有由腿支撑的基端部的上板， 在与基端部相对的一侧的部分上，在基端支撑在腿部的状态下与安装面一定距离配置，并且可以在其上放置一对鞋的一个鞋， 上板被构造成可从腿部拆卸。
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公开(公告)号：US07399682B2
公开(公告)日：2008-07-15
申请号：US11147245
申请日：2005-06-08
IPC分类号： H01L21/66 , H01L21/00 , H01L21/30 , H01L21/469
CPC分类号： H01L21/78 , B23K26/16 , H01L33/0095
摘要： A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.
摘要翻译： 一种用于通过沿着形成在晶片上的街道施加激光束来进行处理的晶片处理方法，包括以与晶片的处理表面的法线成规定倾斜角的入射角施加激光束的步骤，同时 晶片沿着激光束施加侧的一端到另一端的一条街道以与晶片的处理表面成锐角的方式进行加工。
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公开(公告)号：US07179723B2
公开(公告)日：2007-02-20
申请号：US10986371
申请日：2004-11-12
IPC分类号： H01L21/301
CPC分类号： H01L21/78 , B23K26/18 , B23K26/364 , H01L21/67092
摘要： A laser beam processing method for processing a wafer by applying a laser beam to a predetermined area, comprising the steps of forming a resin film which absorbs a laser beam, on the surface to be processed of the wafer; applying a laser beam to the surface to be processed of the wafer through the resin film; and removing the resin film after the laser beam application step.
摘要翻译： 一种用于通过将激光束施加到预定区域来处理晶片的激光束处理方法，包括以下步骤：在晶片的待处理表面上形成吸收激光束的树脂膜; 通过树脂膜将激光束施加到待加工晶片的表面; 并且在激光束施加步骤之后去除树脂膜。
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公开(公告)号：USD525656S1
公开(公告)日：2006-07-25
申请号：US29177139
申请日：2003-03-04
申请人： Toshiyuki Yoshikawa
设计人： Toshiyuki Yoshikawa
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公开(公告)号：US20050277270A1
公开(公告)日：2005-12-15
申请号：US11147245
申请日：2005-06-08
IPC分类号： B23K26/00 , B23K26/08 , B23K26/16 , B23K26/18 , B23K101/40 , H01L21/301 , H01L21/78
CPC分类号： H01L21/78 , B23K26/16 , H01L33/0095
摘要： A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer is processing-fed along a street from one end to the other end on the side of the laser beam application at an acute angle to the processing surface of the wafer.
摘要翻译： 一种用于通过沿着形成在晶片上的街道施加激光束来进行处理的晶片处理方法，包括以与晶片的处理表面的法线成规定倾斜角的入射角施加激光束的步骤，同时 晶片沿着激光束施加侧的一端到另一端的一条街道以与晶片的处理表面成锐角的方式进行加工。
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