公开(公告)号：US12144238B2

公开(公告)日：2024-11-12

申请号：US18191135

申请日：2023-03-28

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Geunwoo Yug ,  Myeongseok Jeong ,  Soobum Park ,  Junghwa You ,  Ilyoung Jeong

IPC: H10K71/00 ,  H10K50/86 ,  H10K59/12 ,  H10K59/40 ,  H10K71/80 ,  H10K77/10 ,  H10K102/00

Abstract: A method of manufacturing a display apparatus includes separating a mother substrate that includes a plurality of connected unit display apparatuses into a plurality of separated unit display apparatuses. Each separated unit display apparatus includes a display panel and at least one supporting unit attached below the display panel. The display panel includes a display substrate that has a pad area on which are disposed a plurality of pads and a thin film encapsulation layer on the display substrate. The method further includes consecutively cutting the display panel and the at least one supporting unit of each separated unit display apparatus along cutting lines in the pad area, where a first cut surface of the pad area of the display substrate and a second cut surface of the at least one supporting unit are respectively cut at different angles.

公开(公告)号：US20180133842A1

公开(公告)日：2018-05-17

申请号：US15814231

申请日：2017-11-15

Applicant: Samsung Display Co., Ltd.

Inventor： Ilyoung Jeong ,  Gyoowan Han ,  Jaeil Kim ,  Kuhyun Kang ,  Soobum Park

IPC: B23K26/38 ,  B23K26/04 ,  B23K26/0622

CPC classification number: B23K26/38 ,  B23K26/03 ,  B23K26/04 ,  B23K26/0622 ,  B23K26/082 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/402 ,  B23K2103/54 ,  C03B33/04 ,  C03B33/091

Abstract: A laser cutting apparatus and a laser cutting method are provided. A laser cutting method includes: preparing an object on a stage; cutting the object into a set shape by relatively moving and irradiating a laser beam along the set shape with respect to the object; and performing uniform heating compensation to reduce accumulation of thermal energy of the laser beam resulting from a change of speed at a shift point where a travelling direction of the laser beam with respect to the object changes.

公开(公告)号：US09755192B2

公开(公告)日：2017-09-05

申请号：US14967090

申请日：2015-12-11

Applicant: Samsung Display Co., Ltd.

Inventor： Junghwa You ,  Taeyong Kim ,  Hyojin Kim ,  Ilyoung Jeong ,  Gyoowan Han ,  Jekil Ryu ,  Jinho Lee

IPC: H01L21/00 ,  H01L51/56 ,  B23K26/38 ,  B23K26/0622 ,  B23K26/18 ,  B23K26/06 ,  B23K26/40 ,  B23K26/402 ,  H01L51/52 ,  B23K103/00

CPC classification number: H01L51/56 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  H01L51/5253 ,  H01L2251/566

Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

公开(公告)号：US20160315293A1

公开(公告)日：2016-10-27

申请号：US14967090

申请日：2015-12-11

Applicant: Samsung Display Co., Ltd.

Inventor： Junghwa You ,  Taeyong Kim ,  Hyojin Kim ,  Ilyoung Jeong ,  Gyoowan Han ,  Jekil Ryu ,  Jinho Lee

IPC: H01L51/56 ,  B23K26/18 ,  B23K26/0622 ,  H01L51/52 ,  B23K26/38

CPC classification number: H01L51/56 ,  B23K26/0608 ,  B23K26/0624 ,  B23K26/18 ,  B23K26/38 ,  B23K26/40 ,  B23K26/402 ,  B23K2103/00 ,  B23K2103/42 ,  B23K2103/50 ,  H01L51/5253 ,  H01L2251/566

Abstract: A method of cutting a substrate includes: forming a first protective layer on a first surface of the substrate; forming a removal area where a portion of the first protective layer is removed by irradiating the first protective layer at the portion of the first protective layer with a first laser beam; and forming a cutting area by removing a portion of the substrate by irradiating the substrate with a second laser beam at the removal area, after irradiating the first protective layer with the first laser beam.

Abstract translation: 切割基板的方法包括：在所述基板的第一表面上形成第一保护层; 通过用第一激光束照射所述第一保护层的所述第一保护层，形成除去所述第一保护层的一部分的去除区域; 以及在用所述第一激光束照射所述第一保护层之后，通过在所述去除区域处用第二激光束照射所述基板来去除所述基板的一部分而形成切割区域。