公开(公告)号：US10362667B2

公开(公告)日：2019-07-23

申请号：US15594085

申请日：2017-05-12

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong Min ,  Myung-Sam Kang ,  Jung-Han Lee ,  Young-Gwan Ko

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/46 ,  H05K1/11

Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.

公开(公告)号：US10102964B2

公开(公告)日：2018-10-16

申请号：US14951112

申请日：2015-11-24

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Jin-Soo Kim ,  Myung-Sam Kang ,  Kwang-Il Park ,  Young-Gwan Ko ,  Youn-Soo Seo ,  Woon-Chul Choi ,  Hye-Yeon Cha

IPC: H01F5/00 ,  H01F27/28 ,  H01F27/29 ,  H01F17/00 ,  H01F17/04 ,  H01F41/04 ,  H01F41/10

Abstract: A coil electronic component includes: a magnetic body comprising a magnetic material; a coil part embedded inside the magnetic body; and a magnetic layer disposed on a surface of the magnetic body.

公开(公告)号：US09992865B2

公开(公告)日：2018-06-05

申请号：US15045544

申请日：2016-02-17

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Tae-Hong Min ,  Myung-Sam Kang ,  Young-Gwan Ko ,  Min-Jae Seong

IPC: H05K7/00 ,  H05K1/02 ,  H01L23/13 ,  H01L23/498 ,  H01L23/00 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/0298 ,  H01L23/13 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/00 ,  H05K1/113 ,  H05K3/4608 ,  H05K2201/0195 ,  H05K2201/0367 ,  H05K2201/09672 ,  H05K2201/09872 ,  H05K2201/10674

Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.