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公开(公告)号：US20160293320A1
公开(公告)日：2016-10-06
申请号：US15003925
申请日：2016-01-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： In-Seok Kim , Yong-Jin Park , Young-Gwan Ko , Youn-Soo Seo , Myung-Sam Kang , Tae-Hong Min
CPC classification number: H01F27/32 , H01F17/0013 , H01F27/255 , H01F41/041
Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.
Abstract translation: 公开了一种电感器件及其制造方法。 电感器件包括绝缘层，形成在绝缘层的两个相对表面上的线圈图案，在线圈图案上形成有不同绝缘材料的第一绝缘膜和第二绝缘膜，以及形成为包围绝缘层的磁性构件 线圈图案和第一和第二绝缘膜。 通过在电感线圈上形成具有高粘合强度和断裂强度的薄双重绝缘膜，可以提高电感器件的Ls特性并增加电感。
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公开(公告)号：US11272613B2
公开(公告)日：2022-03-08
申请号：US16674460
申请日：2019-11-05
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Ju-Ho Kim
Abstract: A printed circuit board includes: a laminate including a core layer and insulating layers stacked on first and second sides of the core layer; and a first antenna formed on a surface of the laminate. A thickness of the core layer is greater than a thickness of one of the insulating layers. A dielectric constant of the core layer is higher than a dielectric constant of the one of the insulating layers.
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公开(公告)号：US09655229B2
公开(公告)日：2017-05-16
申请号：US14938900
申请日：2015-11-12
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2924/15311 , H05K1/0203 , H05K1/0207 , H05K1/0231 , H05K1/185 , H05K3/445 , H05K3/4602 , H05K3/4608 , H05K2201/0323 , H05K2201/09136 , H05K2201/10015 , H05K2201/10416 , H05K2201/10636 , Y02P70/611
Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.
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公开(公告)号：US11122694B2
公开(公告)日：2021-09-14
申请号：US16676493
申请日：2019-11-07
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Ju-Ho Kim
IPC: H05K1/02 , H05K1/03 , H05K1/09 , H05K1/11 , H05K1/14 , H05K1/18 , H05K3/00 , H05K3/22 , H05K3/32 , H05K3/40 , H05K3/46 , G06K19/077
Abstract: A printed circuit board including: a laminate having a plurality of stacked insulating layers including a rigid insulating layer; a flexible insulating layer having a partial region that overlaps and is in contact with at least one of the insulating layers and a remaining region disposed outside of the laminate; and a first antenna disposed on a surface of the laminate.
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Patent Agency Ranking
公开(公告)号：US10064291B2
公开(公告)日：2018-08-28
申请号：US14981378
申请日：2015-12-28
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko , Min-Jae Seong
CPC classification number: H05K3/4602 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2924/15311 , H01L2924/3511 , H05K1/0203 , H05K1/0206 , H05K1/0207 , H05K1/181 , H05K1/185
Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.
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公开(公告)号：US09832856B2
公开(公告)日：2017-11-28
申请号：US15002720
申请日：2016-01-21
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko
CPC classification number: H05K1/0204 , H05K1/0207 , H05K1/0218 , H05K1/0271 , H05K3/4608 , H05K2201/0323 , H05K2201/0338 , H05K2201/066 , H05K2201/10416
Abstract: Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer body disposed in the insulating part, the heat-transfer body including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer body between a top surface and a bottom surface of the heat-transfer body.
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公开(公告)号：US11769622B2
公开(公告)日：2023-09-26
申请号：US16233178
申请日：2018-12-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： In-Seok Kim , Yong-Jin Park , Young-Gwan Ko , Youn-Soo Seo , Myung-Sam Kang , Tae-Hong Min
IPC: H01F27/32 , H01F17/00 , H01F41/04 , H01F27/255
CPC classification number: H01F27/32 , H01F17/0013 , H01F27/255 , H01F41/041
Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.
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公开(公告)号：US10362667B2
公开(公告)日：2019-07-23
申请号：US15594085
申请日：2017-05-12
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae-Hong Min , Myung-Sam Kang , Jung-Han Lee , Young-Gwan Ko
Abstract: A circuit board is disclosed. In addition to insulating layers, the circuit board includes a structure for heat transfer that includes a first layer that is formed of graphite or graphene, a second layer that is formed of metallic material and disposed on one surface of the first layer, and a third layer that is formed of metallic material and disposed on the other surface of the first layer, and at least a portion of the structure for heat transfer is inserted into an insulation layer. Such a circuit board provides improved heat management. Also disclosed is a method of manufacturing the circuit board.
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公开(公告)号：US09992865B2
公开(公告)日：2018-06-05
申请号：US15045544
申请日：2016-02-17
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko , Min-Jae Seong
CPC classification number: H05K1/0298 , H01L23/13 , H01L23/49822 , H01L23/49827 , H01L24/00 , H05K1/113 , H05K3/4608 , H05K2201/0195 , H05K2201/0367 , H05K2201/09672 , H05K2201/09872 , H05K2201/10674
Abstract: A circuit board and an assembly including the circuit board are provided. The circuit board includes a first insulation layer, a first conductive pattern disposed on the first insulation layer, an insulation film disposed on the first conductive pattern, and a second conductive pattern disposed on the insulation film. The insulation film includes an insulation thin film contacting the first conductive pattern, and a function film disposed on the insulation thin film and contacting the second conductive pattern.
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