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公开(公告)号：US09966178B2
公开(公告)日：2018-05-08
申请号：US15049639
申请日：2016-02-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Youn-Soo Seo , Myung-Sam Kang , Jin-Soo Kim , Young-Gwan Ko , Woon-Chul Choi , In-Seok Kim , Hye-Yeon Cha
CPC classification number: H01F27/255 , H01F17/0013 , H01F27/324 , H01F41/046 , H01F2017/048
Abstract: Chip electronic component and manufacturing method thereof disclosed. An example aspect provides a chip electronic component. The chip electronic component includes a magnetic body including a magnetic material, a coil part embedded in the magnetic body and formed to be connected to a first coil conductor and a second coil conductor, an insulating layer covering the first coil conductor and the second coil conductor, and a magnetic layer formed on the insulating layer.
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公开(公告)号：US20160293320A1
公开(公告)日：2016-10-06
申请号：US15003925
申请日：2016-01-22
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： In-Seok Kim , Yong-Jin Park , Young-Gwan Ko , Youn-Soo Seo , Myung-Sam Kang , Tae-Hong Min
CPC classification number: H01F27/32 , H01F17/0013 , H01F27/255 , H01F41/041
Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.
Abstract translation: 公开了一种电感器件及其制造方法。 电感器件包括绝缘层，形成在绝缘层的两个相对表面上的线圈图案，在线圈图案上形成有不同绝缘材料的第一绝缘膜和第二绝缘膜，以及形成为包围绝缘层的磁性构件 线圈图案和第一和第二绝缘膜。 通过在电感线圈上形成具有高粘合强度和断裂强度的薄双重绝缘膜，可以提高电感器件的Ls特性并增加电感。
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公开(公告)号：US10064291B2
公开(公告)日：2018-08-28
申请号：US14981378
申请日：2015-12-28
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko , Min-Jae Seong
CPC classification number: H05K3/4602 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2924/15311 , H01L2924/3511 , H05K1/0203 , H05K1/0206 , H05K1/0207 , H05K1/181 , H05K1/185
Abstract: A circuit board and a method of manufacturing the same are disclosed. The circuit board includes an insulating part, a thermally conductive structure comprising a first structure and a second structure, and an insulator configured to insulate the first structure from the second structure, wherein the first structure and the second structure are composed of thermally conductive material, and at least a part of the thermally conductive structure is inserted to the insulating part.
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公开(公告)号：US10021785B2
公开(公告)日：2018-07-10
申请号：US14966442
申请日：2015-12-11
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Myung-Sam Kang , Young-Gwan Ko , Sang-Hoon Kim , Kang-Wook Bong , Hye-Won Jung , Yong-Wan Ji
CPC classification number: H05K1/113 , H05K3/0023 , H05K3/4069 , H05K3/4644 , H05K2203/0502 , H05K2203/0514
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.
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公开(公告)号：US09832866B2
公开(公告)日：2017-11-28
申请号：US15196857
申请日：2016-06-29
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seok-Hwan Ahn , Mi-Sun Hwang , Young-Gwan Ko , Jong-Seok Bae , Myung-Sam Kang
CPC classification number: H05K1/0298 , H05K1/0271 , H05K1/09 , H05K1/115 , H05K1/165 , H05K3/007 , H05K3/0076 , H05K3/12 , H05K3/4007 , H05K3/4617 , H05K3/4623 , H05K2201/09136 , H05K2201/09509 , H05K2201/09563 , H05K2201/09672 , H05K2203/043
Abstract: A multilayered substrate includes unit substrates laminated in a direction of thickness thereof, and the unit substrates include a photosensitive insulating layer, a conductive pattern disposed in the photosensitive insulating layer, and a bump penetrating into the photosensitive insulating layer and providing an interlayer connection to the conductive pattern.
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Patent Agency Ranking
公开(公告)号：US09832856B2
公开(公告)日：2017-11-28
申请号：US15002720
申请日：2016-01-21
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko
CPC classification number: H05K1/0204 , H05K1/0207 , H05K1/0218 , H05K1/0271 , H05K3/4608 , H05K2201/0323 , H05K2201/0338 , H05K2201/066 , H05K2201/10416
Abstract: Disclosed are a circuit board and a method of manufacturing the same. The circuit board includes an insulating part, a heat-transfer body disposed in the insulating part, the heat-transfer body including a thermally conductive material formed in a column shape, and a function hole penetrating the heat-transfer body between a top surface and a bottom surface of the heat-transfer body.
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公开(公告)号：US10455708B2
公开(公告)日：2019-10-22
申请号：US15810343
申请日：2017-11-13
Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
Inventor： Seok-Hwan Ahn , Mi-Sun Hwang , Young-Gwan Ko , Jong-Seok Bae , Myung-Sam Kang
IPC: H05K1/00 , H05K1/11 , H05K3/24 , H05K3/46 , H01L21/02 , H01L21/48 , H01L23/48 , H01L23/58 , H05K1/09 , H05K3/06 , H05K1/02 , H05K1/16 , H05K3/00
Abstract: A multilayered substrate in accordance with an aspect of the present disclosure may include an insulating layer, a conductive pattern embedded, at least partially, in the insulating layer, and a bump being electrically connected to the conductive pattern and penetrating the insulating layer. The bump may include a low melting point metal layer having a melting point lower than a melting point of the conductive pattern and a high melting point metal layer having a melting point higher than the melting point of the low melting point metal layer and having a latitudinal cross-sectional area smaller than a latitudinal cross-sectional area of the low melting point metal layer.
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公开(公告)号：US09655229B2
公开(公告)日：2017-05-16
申请号：US14938900
申请日：2015-11-12
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Tae-Hong Min , Myung-Sam Kang , Young-Gwan Ko
CPC classification number: H05K1/0206 , H01L2224/04105 , H01L2224/12105 , H01L2224/16227 , H01L2224/2518 , H01L2924/15311 , H05K1/0203 , H05K1/0207 , H05K1/0231 , H05K1/185 , H05K3/445 , H05K3/4602 , H05K3/4608 , H05K2201/0323 , H05K2201/09136 , H05K2201/10015 , H05K2201/10416 , H05K2201/10636 , Y02P70/611
Abstract: A circuit board includes a first thermally conductive structure comprising a cavity or a recess portion. At least a portion of the first thermally conductive structure is inserted into an insulating part. An electronic device comprising a portion thereof inserted in the cavity or the recess portion.
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公开(公告)号：US09554466B2
公开(公告)日：2017-01-24
申请号：US14966518
申请日：2015-12-11
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： Myung-Sam Kang , Young-Gwan Ko , Sang-Hoon Kim , Kang-Wook Bong , Hye-Won Jung , Yong-Wan Ji
CPC classification number: H05K1/115 , H05K1/0326 , H05K1/0346 , H05K3/0023 , H05K3/426 , H05K3/428 , H05K2201/0129 , H05K2201/0154 , H05K2201/09827 , H05K2201/09854 , H05K2203/1476
Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.
Abstract translation: 提供一种印刷电路板及其制造方法。 印刷电路板包括绝缘层，其包括第一树脂层和第二树脂层，设置在绝缘层的上表面和下表面上的电路层，以及通孔，被配置为将形成在上表面上的电路层连接到电路层 形成在下表面上，第二树脂层通过第一树脂层从第一树脂层的上表面延伸到第一树脂层的下表面，以接触通孔的侧表面。
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公开(公告)号：US11769622B2
公开(公告)日：2023-09-26
申请号：US16233178
申请日：2018-12-27
Applicant: Samsung Electro-Mechanics Co., Ltd.
Inventor： In-Seok Kim , Yong-Jin Park , Young-Gwan Ko , Youn-Soo Seo , Myung-Sam Kang , Tae-Hong Min
IPC: H01F27/32 , H01F17/00 , H01F41/04 , H01F27/255
CPC classification number: H01F27/32 , H01F17/0013 , H01F27/255 , H01F41/041
Abstract: Disclosed is an inductor device and method of manufacturing the same. The inductor device includes an insulating layer, a coil pattern formed on two opposing surfaces of the insulating layer, a first insulating film and a second insulating film formed with different insulating materials on the coil pattern, and a magnetic member formed to enclose the insulating layer, the coil pattern and the first and the second insulating films. By forming thin dual insulating films having a high adhesive strength and breaking strength on an inductor coil, it is possible to improve Ls characteristics of the inductor device and increase the inductance.
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