Abstract:
Disclosed herein are an electrostatic discharge protection device including: a substrate; a pair of electrodes formed on the substrate so as to be spaced apart from each other; and an insulating layer formed on the electrodes, wherein each of the electrodes has a shape in which it protrudes from a cross section thereof toward a surface thereof, and a manufacturing method thereof, and a composite electronic component including the same.
Abstract:
The present invention relates to a method of manufacturing a coil element and a coil element, which include a process of forming, aligning, and coupling a first auxiliary layer and a second auxiliary layer of which coil portions formed of a plating pattern are disposed on a substrate or an insulating layer, and it is possible to overcome limitations due to collapse or deformation of a photoresist pattern even when forming a fine-pitch fine conductor coil with a high aspect ratio by applying a plating method using a photoresist pattern.
Abstract:
The present invention relates to a common mode filter and a method of manufacturing the same. In order to implement a common mode filter with low shrinkage, high substrate sintered density, and high strength, the present invention provides a common mode filter including: a lower substrate; an insulating layer having a conductor pattern inside and provided on the lower substrate; an upper substrate provided on the insulating layer; and a ferrite core made of ferrite and provided in the center of the insulating layer, the lower substrate, and the upper substrate by penetrating the insulating layer, the lower substrate, and the upper substrate, and a method of manufacturing the same.
Abstract:
Embodiments of the invention provide a touch sensor and a method for manufacturing the touch sensor. The touch sensor, according to various embodiments of the invention, includes a base substrate, and an electrode pattern formed on the base substrate. The electrode pattern includes a first base layer stacked on the base substrate, a second electrode layer stacked on the first base layer, and a third protective layer stacked on the second electrode layer so as to enclose both side surfaces of the second electrode layer.
Abstract:
Disclosed herein is an inductor element having an internal electrode in which a first plating layer and a second plating layer having a coil shape are embedded, the inductor element including: a first plating layer formed on a support member; an insulating layer covering the first plating layer and provided with an opening which exposes an upper surface of the first plating layer; and a second plating layer filled in the opening, whereby the inductor element in which the internal electrode having a high aspect ratio is embedded is implemented.
Abstract:
Disclosed herein is a common mode filter including: a magnetic substrate; an electrode layer disposed on one surface of the magnetic substrate and formed of a coil electrode and an insulating resin enclosing the coil electrode; and an uneven layer disposed between the magnetic substrate and the electrode and formed of a groove and a projection, wherein a part of the insulating resin is depressed between the groove of the uneven layer, whereby an adhesion between the magnetic substrate and the insulating resin is increased.
Abstract:
There is provided a power inductor including a coil supporting layer having a through-hole, first and second coil layers formed in a spiral shape on both surfaces of the coil supporting layer, an inductor body having the coil supporting layer and the first and second coil layers buried therein so that end portions of the first and second coil layers are exposed through both end surfaces thereof, and first and second external electrodes formed on both end surfaces of the inductor body, to be connected to the exposed end portions of the first and second coil layers, respectively, wherein in the inductor body, a core formed in the through-hole is formed of a magnetic material including spherical metal powder particles, and upper and lower cover parts are formed of a magnetic material including flake shaped metal powder particles.
Abstract:
Disclosed herein is a common mode filter. The common mode filter includes a main body that includes a coil electrode, first and second external electrodes connected with both ends of the coil electrode, respectively, and a ground electrode, and an electro static discharge (ESD) protection layer that includes a switching member formed therein, and is provided on any one surface of the main body. Here, one end of the coil electrode is connected with the second external electrode, the other end thereof is connected with the first external electrode through the switching member, and the switching member is disconnected from the coil electrode in accordance with a switching operation when a surge current is applied and connected with the ground electrode. Therefore, it is possible to protect the common mode filter from a surge current by ESD.
Abstract:
Disclosed herein are a multilayer inductor including a protecting layer including an inorganic filler having different stretching ratios in traverse and mechanical directions or an inorganic filler coated with a color former, and a protecting layer composition of a multilayer inductor, including 10 to 30 parts by weight of an inorganic filler having different stretching ratios in traverse and mechanical directions, and 10 to 30 parts by weight of a dispersant, based on 100 parts by weight of an epoxy resin, so that thermal deformation of an inductor chip can be reduced by including the inorganic filler having different stretching ratios in traverse and machine directions in the outermost insulating layer of the multilayer inductor, thereby reducing change in external appearance due to heat, thereby providing a multilayer inductor securing reliability.
Abstract:
Disclosed herein is a common mode noise filter independently including ferrite powder having pores formed in a surface thereof or including at least two kinds of ferrite powder having different particle sizes as a magnetic layer.According to the present invention, the adhesive strength between the polymer binder and the ferrite powder that are included in the magnetic layer is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact.