公开(公告)号：US20180337148A1

公开(公告)日：2018-11-22

申请号：US15941334

申请日：2018-03-30

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Yong Ho BAEK ,  Doo Il KIM ,  Young Sik HUR ,  Jung Hyun CHO ,  Won Wook SO

IPC: H01L23/66 ,  H01L25/065 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L23/3121 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1421 ,  H01L2924/15311 ,  H01L2924/00

Abstract: A composite antenna substrate and semiconductor package module includes: a fan-out semiconductor package including a semiconductor chip, an encapsulant encapsulating at least portions of the semiconductor chip, and a connection member including a redistribution layer electrically connected to connection pads; and an antenna substrate including an antenna member including antenna patterns, ground patterns, and feed lines, and a wiring member disposed below the antenna member and including wiring layers including feeding patterns electrically connected to the feed lines.

公开(公告)号：US20220166149A1

公开(公告)日：2022-05-26

申请号：US17361789

申请日：2021-06-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD. ,  Research & Business Foundation SUNGKYUNKWAN UNIVERSITY

Inventor： Won Wook SO ,  Jeongki RYOO ,  Woncheol LEE ,  Youngsik HUR ,  Keum Cheol HWANG ,  Nam Heung KIM ,  Yong-serk KIM

IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q5/307

Abstract: An antenna device is provided. The antenna device includes a first antenna patch configured to transmit and receive an RF signal in a first frequency bandwidth and disposed a first dielectric layer; a second antenna patch disposed on a second dielectric layer and coupled to the first antenna patch; a third antenna patch disposed on a third dielectric layer and coupled to the second antenna patch; and a fourth antenna patch configured to transmit and receive an RF signal in the second frequency bandwidth, wherein the second antenna patch includes a plurality of first sub-antenna patches that do not overlap the first antenna patch, and the third antenna patch includes a plurality of second sub-antenna patches that overlap the first sub-antenna patches.

公开(公告)号：US20220123479A1

公开(公告)日：2022-04-21

申请号：US17231345

申请日：2021-04-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD. ,  Research & Business Foundation SUNGKYUNKWAN UNIVERSITY

Inventor： Won Wook SO ,  Jeongki RYOO ,  Woncheol LEE ,  Youngsik HUR ,  Keum Cheol HWANG ,  Nam Heung KIM ,  Yong-serk KIM

IPC: H01Q21/06 ,  H01Q9/04 ,  H01Q5/371

Abstract: An antenna apparatus includes: a ground plane including first sides parallel to a first direction and second sides parallel to a second direction, on a plane formed in the first and second directions; a dielectric layer disposed on the ground plane in a third direction; an antenna patch overlapping the ground plane in the third direction; and vias connected to the ground plane and passing through at least a portion of the dielectric layer. Edges of the vias at least partially overlap the first sides of the ground plane in the third direction.

公开(公告)号：US20210337652A1

公开(公告)日：2021-10-28

申请号：US17372032

申请日：2021-07-09

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Wook SO ,  Doo Il KIM ,  Young Sik HUR

IPC: H05K1/02 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01Q1/38 ,  H05K1/14 ,  H01L23/552 ,  H05K1/18 ,  H01L23/00

Abstract: A printed circuit board assembly includes a first printed circuit board, a second printed circuit board disposed on the first printed circuit board and including an antenna pattern, a third printed circuit board disposed on the first printed circuit board, one or more first electronic components disposed between the first and the second printed circuit board and electrically connected to at least one of the first and the second printed circuit board, one or more second electronic components disposed between the first and the third printed circuit board, and electrically connected to at least one of the first and the third printed circuit board, a first interposer substrate electrically connecting the first printed circuit board and the second printed circuit board to each other, and a second interposer substrate electrically connecting the first printed circuit board and the third printed circuit board to each other.

公开(公告)号：US20210119321A1

公开(公告)日：2021-04-22

申请号：US17132224

申请日：2020-12-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Il KIM ,  Won Wook SO ,  Young Sik HUR ,  Jung Chul GONG

IPC: H01Q1/22 ,  H01L23/31 ,  H01L23/538 ,  H01L23/66 ,  H01L23/00

Abstract: An antenna module includes an antenna substrate, a first semiconductor package, disposed on the antenna substrate, including a first connection member including one or more first redistribution layers, electrically connected to the antenna substrate, and a first semiconductor chip disposed on the first connection member, and a second semiconductor package, disposed on the antenna substrate to be spaced apart from the first semiconductor package, including a second connection member including one or more second redistribution layers, electrically connected to the antenna substrate, and a second semiconductor chip disposed on the second connection member. The first semiconductor chip and the second semiconductor chip are different types of semiconductor chips.

公开(公告)号：US20190221917A1

公开(公告)日：2019-07-18

申请号：US16105435

申请日：2018-08-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Doo Il KIM ,  Yong Ho BAEK ,  Won Wook SO ,  Young Sik HUR

IPC: H01Q1/22 ,  H01Q9/04 ,  H01Q1/50 ,  H01Q19/10 ,  H01L23/66 ,  H01L23/31 ,  H01L25/16 ,  H01L23/00

CPC classification number: H01Q1/2283 ,  H01L21/4857 ,  H01L23/3121 ,  H01L23/5383 ,  H01L23/5386 ,  H01L23/66 ,  H01L24/16 ,  H01L24/24 ,  H01L25/16 ,  H01L2223/6616 ,  H01L2223/6677 ,  H01L2224/16227 ,  H01L2224/24265 ,  H01L2924/1421 ,  H01Q1/50 ,  H01Q9/0407 ,  H01Q19/10

Abstract: An antenna module includes a connection member including at least one wiring layer and at least one insulating layer; an integrated circuit (IC) disposed on a first surface of the connection member and electrically connected to at least one wiring layer; and an antenna package disposed on a second surface of the connection member, and including a dielectric layer, a plurality of antenna members, and a plurality of feed vias, wherein the antenna package further includes a chip antenna including a dielectric body and first and second electrodes, respectively disposed on first and second surfaces of the dielectric body, wherein the chip antenna is disposed to be spaced apart from the plurality of feed vias within the dielectric layer so that at least one of the first electrode or the second electrode is electrically connected to a corresponding wire of the at least one wiring layer.

公开(公告)号：US20190058241A1

公开(公告)日：2019-02-21

申请号：US15970307

申请日：2018-05-03

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Wook SO ,  Yong Ho BAEK ,  Doo Il KIM ,  Young Sik HUR

IPC: H01Q1/22 ,  H01L21/48 ,  H01L23/00 ,  H01L23/66 ,  H01L23/498 ,  H01Q1/48

Abstract: A fan-out semiconductor package includes: a core member including a plurality of insulating layers and a plurality of wiring layers and having a blind cavity penetrating through a portion of the plurality of insulating layers; a semiconductor chip disposed in the blind cavity; an encapsulant encapsulating at least portions of the core member and an active surface of the semiconductor chip and filling at least portions of the blind cavity; and a connection member disposed on the core member and an active surface of the semiconductor chip and including a redistribution layer connected to the connection pads. The plurality of wiring layers include antenna patterns and ground patterns, the antenna patterns and the ground patterns are disposed on different levels, and the antenna patterns are connected to the connection pads through the redistribution layer.

公开(公告)号：US20190057944A1

公开(公告)日：2019-02-21

申请号：US15958573

申请日：2018-04-20

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Won Wook SO ,  Yong Ho BAEK ,  Doo Il KIM ,  Young Sik HUR

IPC: H01L23/66 ,  H01Q1/22 ,  H01L23/31 ,  H01L23/00

Abstract: A fan-out semiconductor package includes: a core member having a through-hole; a semiconductor chip disposed in the through-hole; an encapsulant encapsulating at least portions of the core member and the semiconductor chip; and a connection member disposed on the core member and an active surface of the semiconductor chip and including a redistribution layer connected to the connection pads. The core member includes a plurality of wiring layers disposed on different levels, a dielectric is disposed between the plurality of wiring layers of the core member, one of the plurality of wiring layers includes an antenna pattern, the other of the plurality of wiring layers includes a ground pattern, and the antenna pattern is connected to the connection pads through the redistribution layer in a signal manner.