ELECTRONIC DEVICE INCLUDING MMWAVE ANTENNA MODULE

    公开(公告)号:US20210249760A1

    公开(公告)日:2021-08-12

    申请号:US17168321

    申请日:2021-02-05

    Abstract: According to certain embodiments, an electronic device comprises: a window forming at least a portion of a front surface of the electronic device; a cover forming at least a portion of a rear surface of the electronic device; a bracket disposed between the window and the cover; a printed circuit board supported by the bracket and disposed between the window and the cover; a shield can disposed on the printed circuit board covering a designated area of the printed circuit board; at least one communication processor disposed on the printed circuit board; and a mmWave antenna module connected to the printed circuit board, and electrically connected with the at least one communication processor via the printed circuit board, wherein the mmWave antenna module is disposed on the shield can and configured to transfer heat to the shield can.

    ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE

    公开(公告)号:US20190364695A1

    公开(公告)日:2019-11-28

    申请号:US16515275

    申请日:2019-07-18

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

    WEARABLE DEVICE INCLUDING HEAT DISSIPATION STRUCTURE

    公开(公告)号:US20250107035A1

    公开(公告)日:2025-03-27

    申请号:US18830384

    申请日:2024-09-10

    Abstract: According to an embodiment, a wearable device includes: a frame including at least one inlet, a printed circuit board disposed in the frame, an electronic component disposed on the printed circuit board, and a shield can, disposed on the printed circuit board, at least partially surrounding the electronic component. The wearable device includes a housing, coupled with the shield can. The wearable device includes an actuator facing the housing. The actuator is configured to move air received through the at least one inlet toward the housing.

    ELECTRONIC DEVICE INCLUDING SHEILDING STRUCTURE

    公开(公告)号:US20230156989A1

    公开(公告)日:2023-05-18

    申请号:US17986242

    申请日:2022-11-14

    Abstract: The disclosure relates to an electronic device including: a circuit board; a first component disposed on the circuit board; a shield can disposed to surround at least a part of the first component and including an opening; and a nanofiber film disposed on the shield can to cover the opening, wherein the nanofiber film includes a first layer, a second layer, and a third layer sequentially laminated in a first direction, the first layer or the third layer having a lower electrical resistance value than an electrical resistance value of the second layer in a second direction different from the first direction, and the second layer has a lower electrical resistance value than an electrical resistance value of the first layer or the third layer in the first direction.

    ELECTRONIC DEVICE INCLUDING NOISE INDUCING STRUCTURE

    公开(公告)号:US20220173500A1

    公开(公告)日:2022-06-02

    申请号:US17457989

    申请日:2021-12-07

    Abstract: According to various embodiments, an electronic device includes: a housing including a conductive part; an antenna module, including a substrate including a first substrate surface, a second substrate surface facing a direction opposite a direction of the first substrate surface, and a substrate side surrounding a space between the first substrate surface and the second substrate surface, at least one antenna element disposed in the substrate, wireless communication circuitry disposed in the substrate and configured to transmit and/or receive a radio signal in the direction toward which the first substrate surface is directed through the at least one antenna element, a protection member disposed on the second substrate surface, and a conductive shield layer disposed on at least an external surface of the protection member, as an antenna module disposed in an internal space of the housing; a conductive member disposed in at least a part of the conductive part and having at least a partial area thereof facing at least a part of the conductive shield layer; and a noise induction layer disposed between the antenna module and the conductive member to form a capacitor structure having a specified capacitance value between the conductive shield layer and the conductive member. Noise induced from the antenna module may be induced toward the conductive part through the capacitor structure.

    ELECTRONIC DEVICE INCLUDING HEAT RADIATING MEMBER

    公开(公告)号:US20220163809A1

    公开(公告)日:2022-05-26

    申请号:US17533209

    申请日:2021-11-23

    Abstract: A wearable electronic device is disclosed, including: a housing including a first surface facing a same direction as a gaze of a user, a second surface facing in a second direction towards a face of the user, and a side surface surrounding a space defined between the two surfaces, a first and second light output device disposed in the housing and configured to output an image, a printed circuit board at least partially disposed between the first and second light output device, and including at least one electronic component, a supportive frame, a battery disposed between the frame and the second surface, and a first heat radiating member disposed between the frame and the battery.

    ELECTRONIC DEVICE HAVING HEAT COLLECTION/DIFFUSION STRUCTURE

    公开(公告)号:US20210055059A1

    公开(公告)日:2021-02-25

    申请号:US17094293

    申请日:2020-11-10

    Abstract: An electronic device having an improved heating state is disclosed. The disclosed electronic device can comprise: a housing including a first surface facing a first direction, and a second surface facing a second direction opposite to the first direction; a printed circuit board inserted between the first surface and the second surface; an electronic component disposed on the printed circuit board; a shielding structure mounted on the printed circuit board, and including a conductive structure for at least partially surrounding the electronic device; and a heat pipe including a first end portion and a second end portion, wherein the first end portion is thermally coupled to a portion of the shielding structure, and the first end portion is disposed closer to the shielding structure than the second end portion. Additionally, other examples are possible.

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