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公开(公告)号:USD1035643S1
公开(公告)日:2024-07-16
申请号:US29730115
申请日:2020-04-01
Applicant: Samsung Electronics Co., Ltd.
Designer: Dongseok Lee , Junghyun Park , Iksang Kim
Abstract: FIG. 1 is a top perspective view of a notebook computer showing our new design;
FIG. 2 is a front elevation view thereof;
FIG. 3 is a rear elevation view thereof;
FIG. 4 is a left side elevation view thereof;
FIG. 5 is a right side elevation view thereof;
FIG. 6 is a top plan view thereof;
FIG. 7 is a bottom plan view thereof;
FIG. 8 is a bottom perspective view thereof;
FIG. 9 is an enlarged view of the portion 9 delineated in FIG. 1;
FIG. 10 is an enlarged view of the portion 10 delineated in FIG. 2;
FIG. 11 is an enlarged view of the potion 11 delineated in FIG. 3;
FIG. 12 is an enlarged view of the potion 12 delineated in FIG. 4;
FIG. 13 is an enlarged view of the potion 13 delineated in FIG. 6;
FIG. 14 is an enlarged view of the potion 14 delineated in FIG. 7; and,
FIG. 15 is an enlarged view of the potion 15 delineated in FIG. 8.
The evenly-dashed broken lines in the drawings illustrate portions of the notebook computer that form no part of the claimed design. The dot-dash broken lines delineating portions of the claimed design that are shown in enlargements form no part of the claimed design.-
公开(公告)号:US20230395674A1
公开(公告)日:2023-12-07
申请号:US18236823
申请日:2023-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongho Jeon , Sekoo Kang , Keunhee Bai , Dongseok Lee
IPC: H01L29/423 , H01L29/40
CPC classification number: H01L29/4236 , H01L29/42364 , H01L29/401
Abstract: A semiconductor device includes first and second gate structures respectively on first and second active regions and an insulating layer between the first and second active regions and a separation structure between a first end portion of the first gate structure and a second end portion of the second gate structure and extending into the insulating layer. The separation structure includes a lower portion, an intermediate portion, and an upper portion, a maximum width of the intermediate portion in the first direction is greater than a maximum width of the lower portion in the first direction, and the maximum width of the intermediate portion is greater than a maximum width of the upper portion in the first direction.
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公开(公告)号:USD916075S1
公开(公告)日:2021-04-13
申请号:US29660940
申请日:2018-08-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Seungho Jung , Junghyun Park , Iksang Kim , Dongseok Lee
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公开(公告)号:US20200381526A1
公开(公告)日:2020-12-03
申请号:US16820302
申请日:2020-03-16
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongho Jeon , Sekoo Kang , Keunhee Bai , Dongseok Lee
IPC: H01L29/423 , H01L29/40
Abstract: A semiconductor device including a gate structure and a separation structure is provided. The semiconductor device includes: first and second active regions; an insulating layer between the first and second active regions; a first gate structure on the first active region and the insulating layer, the first gate structure having a first end portion on the insulating layer; a second gate structure on the second active region and the insulating layer, the second gate structure having a second end portion facing the first end portion in a first direction, the second gate structure on the insulating layer; and a separation structure between the first end portion and the second end portion and extending into the insulating layer. The separation structure includes a lower portion, an intermediate portion, and an upper portion, a maximum width of the intermediate portion in the first direction is greater than a maximum width of the lower portion in the first direction, and the maximum width of the intermediate portion is greater than a maximum width of the upper portion in the first direction.
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公开(公告)号:US09087789B2
公开(公告)日:2015-07-21
申请号:US13728277
申请日:2012-12-27
Applicant: Samsung Electronics Co., Ltd.
Inventor: HanNa Cho , Dongseok Lee , Jungpyo Hong
IPC: H01L21/00 , H01L21/308 , H01L21/04 , H01L21/033 , H01L21/311 , H01L21/3213 , H01L29/66 , H01L27/115 , H01L49/02
CPC classification number: H01L21/308 , H01L21/0337 , H01L21/04 , H01L21/31144 , H01L21/32137 , H01L27/11582 , H01L28/90 , H01L29/66545 , H01L29/66825
Abstract: Methods of manufacturing a semiconductor device are provided. The method may include forming an etch target layer on a substrate, forming a carbon layer doped with boron on the etch target layer, a top end portion of the carbon layer having a different boron concentration from a bottom end portion of the carbon layer, patterning the carbon layer to form at least one opening exposing the etch target layer, and etching the exposed etch target layer using the carbon layer as an etch mask.
Abstract translation: 提供制造半导体器件的方法。 该方法可以包括在衬底上形成蚀刻目标层,在蚀刻目标层上形成掺杂有硼的碳层,碳层的顶部部分与碳层的底端部分具有不同的硼浓度,图案化 所述碳层形成暴露所述蚀刻目标层的至少一个开口,以及使用所述碳层作为蚀刻掩模蚀刻所述暴露的蚀刻目标层。
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公开(公告)号:US12113112B2
公开(公告)日:2024-10-08
申请号:US18236823
申请日:2023-08-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongho Jeon , Sekoo Kang , Keunhee Bai , Dongseok Lee
IPC: H01L29/423 , H01L29/40
CPC classification number: H01L29/4236 , H01L29/401 , H01L29/42364
Abstract: A semiconductor device includes first and second gate structures respectively on first and second active regions and an insulating layer between the first and second active regions and a separation structure between a first end portion of the first gate structure and a second end portion of the second gate structure and extending into the insulating layer. The separation structure includes a lower portion, an intermediate portion, and an upper portion, a maximum width of the intermediate portion in the first direction is greater than a maximum width of the lower portion in the first direction, and the maximum width of the intermediate portion is greater than a maximum width of the upper portion in the first direction.
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公开(公告)号:US20220102516A1
公开(公告)日:2022-03-31
申请号:US17548826
申请日:2021-12-13
Applicant: Samsung Electronics Co., Ltd.
Inventor: Yongho Jeon , Sekoo Kang , Keunhee Bai , Dongseok Lee
IPC: H01L29/423 , H01L29/40
Abstract: A semiconductor device includes first and second gate structures respectively on first and second active regions and an insulating layer between the first and second active regions and a separation structure between a first end portion of the first gate structure and a second end portion of the second gate structure and extending into the insulating layer. The separation structure includes a lower portion, an intermediate portion, and an upper portion, a maximum width of the intermediate portion in the first direction is greater than a maximum width of the lower portion in the first direction, and the maximum width of the intermediate portion is greater than a maximum width of the upper portion in the first direction.
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公开(公告)号:USD829710S1
公开(公告)日:2018-10-02
申请号:US29618275
申请日:2017-09-20
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Designer: Hoyoung Seoc , Dongseok Lee , Iksang Kim
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