公开(公告)号：US20240196555A1

公开(公告)日：2024-06-13

申请号：US18442621

申请日：2024-02-15

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hangyu HWANG ,  Yoonhee LEE

IPC: H05K5/04 ,  B29C37/00 ,  B29C65/48 ,  B29C65/64 ,  B29C65/70 ,  B29C65/72 ,  B29L31/34 ,  H04M1/02 ,  H05K5/00

CPC classification number: H05K5/04 ,  B29C37/0025 ,  B29C65/48 ,  B29C65/64 ,  B29C65/70 ,  B29C65/72 ,  H04M1/0249 ,  H05K5/0086 ,  B29K2995/0093 ,  B29L2031/3481

Abstract: An electronic device including a housing defining an outer surface of the electronic device. The housing includes metal regions comprising a surface treatment layer defining the outer surface at the metal regions, and an insulation region which is between the metal regions and coupled to each of the metal regions. The insulation region includes a polymer material portion, and a coating layer which is on the polymer material portion and defines the outer surface at the insulation region. The coating layer comprising a polymer matrix and siloxane.

公开(公告)号：US20230250280A1

公开(公告)日：2023-08-10

申请号：US18118453

申请日：2023-03-07

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  HANWHA COMPOUND CORPORATION

Inventor： Hangyu HWANG ,  Pranveer Singh RATHORE ,  Kyungrae KIM ,  Changyun SHIN ,  Sambong JEONG ,  Gukhyun HAN ,  Bongjoon KIM ,  Jinsoo LEE

IPC: C08L77/10 ,  C08L23/18 ,  G06F1/16

CPC classification number: C08L77/10 ,  C08L23/18 ,  G06F1/1633 ,  C08L2203/206 ,  C08L2207/20

Abstract: Polymer compositions include a recycled polyamide and an electronic device and a protective case for an electronic device including the same. The polymer composition according to various embodiments of the present disclosure may include a recycled polyamide, a new polyamide including at least one polyamide component, a glycidyl group-modified ethylene-octene-based copolymer, and an inorganic filler. In some embodiments, the recycled polyamide may include a polyamide collected from marine plastic waste.

公开(公告)号：US20230141690A1

公开(公告)日：2023-05-11

申请号：US17894543

申请日：2022-08-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seungchang BAEK ,  Hyeongsam SON ,  Changhyeok SHIN ,  Yoonhee LEE ,  Junghyun IM ,  Sungho CHO ,  Jungwoo CHOI ,  Hangyu HWANG ,  Minwoo YOO

IPC: H05K5/02

CPC classification number: H05K5/0217 ,  H05K5/0247 ,  H05K5/0018

Abstract: An electronic device is provided. The electronic device includes a display, a frame structure including a first conductive member defining an external appearance of the electronic device and operated as an antenna element of the electronic device, a second conductive member coupled and electrically connected to the first conductive member, and a nonconductive member that supports the display together with the second conductive member, a bonding layer including a first layer at least partially disposed between the first conductive member and the nonconductive member, and a second layer at least partially disposed between the second conductive member and the nonconductive member, and at least one conductive connection member disposed at a portion, at which the first conductive member and the second conductive member are coupled to each other, and contacting the first conductive member and the second conductive member.

公开(公告)号：US20230090870A1

公开(公告)日：2023-03-23

申请号：US17861387

申请日：2022-07-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngjong SHIN ,  Hangyu HWANG ,  Changsu KIM ,  Hyeonwoo LEE ,  Sungho CHO ,  Jeonga KANG ,  Hyunsuk CHOI

IPC: H05K5/02 ,  H05K5/00 ,  G02B3/00 ,  G02B5/04

Abstract: According to an embodiment of the disclosure, an electronic device may include a housing including a rear plate including a first region having a first concavo-convex pattern formed therein, and a second region having a second concavo-convex pattern formed therein, and a processor disposed inside the housing. The first concavo-convex pattern and the second concavo-convex pattern may be integrally formed with the rear plate, and a first depth of the first concavo-convex pattern may be different from a second depth of the second concavo-convex pattern.

公开(公告)号：US20220400569A1

公开(公告)日：2022-12-15

申请号：US17811402

申请日：2022-07-08

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee LEE ,  Juncheol SHIN ,  Hangyu HWANG ,  Yucheol KIM ,  Jungmin YEO

IPC: H05K5/04 ,  C25D21/00 ,  C25D11/24

Abstract: Disclosed are an electronic device including a housing having a matte surface and a method of manufacturing the same. An electronic device according to various embodiments of the disclosure is an electronic device including a housing. The housing may include a base material including an aluminum alloy, a plurality of pits adjacently formed on a surface of the base material, and a crystal grain boundary protrusion part formed as a crystal grain boundary of the surface of the base material portion protrudes on the surface. A method of manufacturing a housing for an electronic device may include an etching step of generating irregularities on a surface of a base material including an aluminum alloy in a way to etch the base material by dipping the base material into an etching solution containing chloride ions, and an anodizing step of forming an anodizing layer on the surface of the base material by dipping, into an anodizing solution, the base material on which the etching step has been completed and applying a current to the base material by using the base material as an anode.

公开(公告)号：US20210347098A1

公开(公告)日：2021-11-11

申请号：US17283888

申请日：2019-10-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Changsu KIM ,  Sangsik NA ,  Rathore Pranveer SINGH ,  Youngjin Yl ,  Jongbae JEON ,  Donghyeon HWANG ,  Hangyu HWANG ,  Jinhyeong PARK ,  Youngik SON

IPC: B29C45/14 ,  H05K5/00 ,  H05K5/04

Abstract: A method for manufacturing an electronic device, according to one embodiment of the present invention, may comprise the operations of: inserting and injecting a polymeric material into a structure, which is a plate-shaped metal structure comprising a first surface and a second surface, the structure comprising: at least one opening penetrating the first surface and the second surface; and at least one recess having a first depth from the first surface and extending to have a repeating pattern selected from among a W-shape, a sawtooth shape, and a straight line shape, when viewed from above the first surface; and confirming that the recess is filled with the polymeric material. Various other embodiments are possible.

公开(公告)号：US20240324132A1

公开(公告)日：2024-09-26

申请号：US18731991

申请日：2024-06-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yoonhee LEE ,  Juncheol SHIN ,  Aeree KIM ,  Joungki PARK ,  Seungchang BAEK ,  Junghyun IM ,  Jinhwan JEONG ,  Sungho CHO ,  Hangyu HWANG

IPC: H05K5/04

CPC classification number: H05K5/04

Abstract: An electronic device housing and an electronic device including the same are provided. An electronic device housing includes a metal substrate, a plastic injection part formed on one area on a surface of the metal substrate, an oxide film layer formed on one area on the surface of the metal substrate, a plating layer formed on one area on the surface of the metal substrate, and a deposition layer formed on the plating layer, wherein the oxide film layer and the plating layer may be formed to be apart from each other.

公开(公告)号：US20240081499A1

公开(公告)日：2024-03-14

申请号：US18518367

申请日：2023-11-22

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jihwan CHUN ,  Hangyu HWANG ,  Jiwon PARK ,  Seungchang BAEK ,  Changhyeok SHIN ,  Sungho CHO ,  Minwoo YOO

IPC: A45C11/00 ,  H04B1/3888

CPC classification number: A45C11/00 ,  H04B1/3888 ,  A45C2011/003

Abstract: A case includes a base plate, a hole formed through the base plate, a pattern that is on one surface of the base plate and includes a plurality of crests and a plurality of troughs. The case further includes an inclined area that is between the hole and the pattern, and at least one step that is between the inclined area and the hole, in which a first angle that the inclined area forms with a central axis of the hole is greater than a second angle that is an angle of view through the hole.

公开(公告)号：US20230216942A1

公开(公告)日：2023-07-06

申请号：US18120021

申请日：2023-03-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Junghyun IM ,  Joungki PARK ,  Jinwoo PARK ,  Seungchang BAEK ,  Yoonhee LEE ,  Jungwoo CHOI ,  Sungho CHO ,  Hangyu HWANG ,  Jongchul CHOI

IPC: H04M1/02

CPC classification number: H04M1/0249 ,  H04M1/0274 ,  H04M1/0277

Abstract: An electronic device according to an embodiment may include a housing comprising: an outer portion defining at least a portion of an exterior of the electronic device and comprising a first conductive material, an inner portion comprising a second conductive material having a first melting point different from that of the first conductive material and at least partially defining a space for receiving multiple electronic components arranged inside the electronic device, and a middle portion comprising a third conductive material having a second melting point and an injection molded insulator, wherein the third conductive material of the middle portion and the first conductive material of the outer portion are coupled to form a concave-convex structure, a difference between the first melting point and the second melting point is in a first range, and the third conductive material of the middle portion is electrically connected to the second conductive material of the inner portion.

公开(公告)号：US20230111297A1

公开(公告)日：2023-04-13

申请号：US17990858

申请日：2022-11-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jungho HWANG ,  Changsu KIM ,  Sangsik NA ,  Sungho CHO ,  Hangyu HWANG ,  Junpil KIM ,  Jinho KIM ,  Jinshik LIM

IPC: G02B1/14 ,  G06F3/041

Abstract: An electronic device and housing are disclosed herein. The electronic device includes a plurality of electronic components housed within the housing. The housing includes a substrate, a transparent coating layer formed on a front surface of the substrate, a deposition layer formed on a rear surface of the substrate, wherein the front surface of the substrate includes a first protrusion extending in a first direction outwards from the substrate, wherein the rear surface of the substrate includes a second protrusion extending in a second direction opposite to the first direction, wherein the first protrusion and the second protrusion differ in at least one their respective widths, depths or pitches, and wherein a first focal length of the first protrusion and a second focal length of the second protrusion are different from each other.