SEMICONDUCTOR DEVICE
    13.
    发明公开

    公开(公告)号:US20240170554A1

    公开(公告)日:2024-05-23

    申请号:US18511553

    申请日:2023-11-16

    Abstract: A semiconductor device is provided. The semiconductor device includes: an active pattern extending in a first direction on a substrate; channel layers arranged on the active pattern; a gate structure crossing the active pattern, and surrounding the plurality of channel layers, the gate structure extending in a second direction that crosses the first direction; and source/drain regions provided on the active pattern on both sides of the gate structure, and including a first epitaxial layer connected to each of side surfaces of the channel layers, and a second epitaxial layer provided on the first epitaxial layer and having a composition different from that of the first epitaxial layer. Each of the side surfaces of the plurality of channel layers has a crystal plane of (111) or (100). The first epitaxial layer extends in the second direction and has a first thickness in the first direction that is substantially constant.

    Semiconductor device
    14.
    发明授权

    公开(公告)号:US11961839B2

    公开(公告)日:2024-04-16

    申请号:US18133156

    申请日:2023-04-11

    CPC classification number: H01L27/092 H01L29/161

    Abstract: A semiconductor device including a substrate; a first active pattern on the substrate and extending in a first direction, an upper portion of the first active pattern including a first channel pattern; first source/drain patterns in recesses in an upper portion of the first channel pattern; and a gate electrode on the first active pattern and extending in a second direction crossing the first direction, the gate electrode being on a top surface and on a side surface of the at least one first channel pattern, wherein each of the first source/drain patterns includes a first, second, and third semiconductor layer, which are sequentially provided in the recesses, each of the first channel pattern and the third semiconductor layers includes silicon-germanium (SiGe), and the first semiconductor layer has a germanium concentration higher than those of the first channel pattern and the second semiconductor layer.

    SEMICONDUCTOR DEVICE
    15.
    发明申请

    公开(公告)号:US20230051602A1

    公开(公告)日:2023-02-16

    申请号:US17725180

    申请日:2022-04-20

    Abstract: A semiconductor device is provided. The semiconductor device includes: an active pattern provided on a substrate and extending in a first direction; a pair of source/drain patterns provided on the active pattern and spaced apart from each other in the first direction; a plurality of channel layers vertically stacked and spaced apart from each other on the active pattern between the pair of source/drain patterns; a gate electrode extending in a second direction between the pair of source/drain patterns, the gate electrode being provided on the active pattern and surrounding the plurality of channel layers, and the second direction intersecting the first direction; and a gate spacer provided between the plurality of channel layers, and between the gate electrode and the pair of source/drain patterns. The gate spacer includes a plurality of first spacer patterns and a plurality of second spacer patterns that are alternately stacked on sidewalls of the pair of source/drain patterns.

    Semiconductor device
    16.
    发明授权

    公开(公告)号:US11171135B2

    公开(公告)日:2021-11-09

    申请号:US16896423

    申请日:2020-06-09

    Abstract: A semiconductor device including a substrate; a first active pattern on the substrate and extending in a first direction, an upper portion of the first active pattern including a first channel pattern; first source/drain patterns in recesses in an upper portion of the first channel pattern; and a gate electrode on the first active pattern and extending in a second direction crossing the first direction, the gate electrode being on a top surface and on a side surface of the at least one first channel pattern, wherein each of the first source/drain patterns includes a first, second, and third semiconductor layer, which are sequentially provided in the recesses, each of the first channel pattern and the third semiconductor layers includes silicon-germanium (SiGe), and the first semiconductor layer has a germanium concentration higher than those of the first channel pattern and the second semiconductor layer.

    Method of operating electronic handwriting and electronic device for supporting the same
    17.
    发明授权
    Method of operating electronic handwriting and electronic device for supporting the same 有权
    操作电子手写及电子装置的方法

    公开(公告)号:US09588678B2

    公开(公告)日:2017-03-07

    申请号:US14474016

    申请日:2014-08-29

    CPC classification number: G06F3/04883 G06K9/00416

    Abstract: A method of operating electronic handwriting includes receiving at least two handwriting strokes from a touch screen, determining whether the at least two handwriting strokes overlap each other, selecting at least one of the overlapped handwriting strokes into a group, and recognizing a handwriting stroke belonging to the group. An electronic device for recognizing handwriting includes at least one of a touch device configured to receive a handwriting strokes, a storage configured to store information comprising the at least one handwriting stroke, and a controller configured to determine whether at least two handwriting strokes overlap each other, select at least one of the overlapped handwriting strokes into a group, and perform text recognition on a handwriting strokes belonging to the group.

    Abstract translation: 操作电子手写的方法包括从触摸屏接收至少两个手写笔划,确定所述至少两个手写笔划是否彼此重叠,将重叠的手写笔画中的至少一个选择为一组,以及识别属于 群组。 用于识别笔迹的电子设备包括被配置为接收手写笔划的触摸设备中的至少一个,被配置为存储包括至少一个笔迹笔划的信息的存储器以及被配置为确定至少两个手写笔划是否彼此重叠的控制器 将重叠的手写笔画中的至少一个选择为组,并对属于该组的笔迹笔划执行文本识别。

    INTEGRATED CIRCUIT DEVICES
    18.
    发明公开

    公开(公告)号:US20240322039A1

    公开(公告)日:2024-09-26

    申请号:US18421001

    申请日:2024-01-24

    Abstract: The integrated circuit device includes a fin-type active region extending in a first direction, a channel region on the fin-type active region, a gate line on the channel region and extending in a second direction, and a source/drain region on the fin-type active region and in contact with the channel region, wherein the source/drain region includes a plurality of semiconductor layers including a first semiconductor layer that includes a portion in contact with the channel region and a portion in contact with the fin-type active region, a second semiconductor layer on the first semiconductor layer, and a third semiconductor layer on the second semiconductor layer, a germanium (Ge) content ratio in the first semiconductor layer is greater than or equal to 10 at % and less than 100 at %, and the Ge content ratio in the first semiconductor layer decreases towards a boundary with the second semiconductor layer.

    INTEGRATED CIRCUIT DEVICE
    19.
    发明公开

    公开(公告)号:US20240321885A1

    公开(公告)日:2024-09-26

    申请号:US18476688

    申请日:2023-09-28

    CPC classification number: H01L27/092 H01L21/823814 H01L21/823871

    Abstract: An integrated circuit device includes a first transistor comprising a first conductivity type, which includes a first channel region and a first source/drain region, a second transistor comprising a second conductivity type, which includes a second channel region and a second source/drain region, a first contact structure that contacts the first source/drain region and comprising a first length, and the first contact structure extends from above the first source/drain region and beyond an uppermost surface of the first channel region by a first vertical distance, and a second contact structure that contacts the second source/drain region and having a second length that is greater than the first length, the second contact extends from above the second source/drain region and beyond an uppermost surface of the second channel region by a second vertical distance, which is greater than the first vertical distance.

    Semiconductor device
    20.
    发明授权

    公开(公告)号:US11978805B2

    公开(公告)日:2024-05-07

    申请号:US18110961

    申请日:2023-02-17

    Abstract: A semiconductor device includes first active patterns on a PMOSFET section of a logic cell region of a substrate, second active patterns on an NMOSFET section of the logic cell region, third active patterns on a memory cell region of the substrate, fourth active patterns between the third active patterns, and a device isolation layer that fills a plurality of first trenches and a plurality of second trenches. Each of the first trenches is interposed between the first active patterns and between the second active patterns. Each of the second trenches is interposed between the fourth active patterns and between the third and fourth active patterns. Each of the third and fourth active patterns includes first and second semiconductor patterns that are vertically spaced apart from each other. Depths of the second trenches are greater than depths of the first trenches.

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