PAYMENT METHOD USING BIOMETRIC AUTHENTICATION AND ELECTRONIC DEVICE THEREFOR

    公开(公告)号:US20220005046A1

    公开(公告)日:2022-01-06

    申请号:US17290579

    申请日:2019-11-01

    Abstract: Various embodiments of the disclosure relate to a payment method using biometric authentication, and an electronic device thereof. The electronic device includes a communication module configured to provide communication with a server, a processor operatively coupled to the communication module, and a memory operatively coupled to the processor and configured to store biometric information. The memory may store instructions, when executed, causing the processor to, when registered for a first time use, generate a parameter for biometric authentication verification and an encrypted password for password authentication verification and transmit the generated parameter and password to the server, in order to register, with the server, biometric authentication information for biometric authentication verification and a password for password authentication, when a payment is made, use at least one of the biometric authentication and the password authentication to authenticate a user, and when it is necessary to change the biometric authentication information registered with the server, register new biometric authentication information with the server in the process of the payment.

    SEMICONDUCTOR LIGHT-EMITTING DEVICES AND METHODS OF MANUFACTURING THE SAME

    公开(公告)号:US20210366982A1

    公开(公告)日:2021-11-25

    申请号:US17181213

    申请日:2021-02-22

    Abstract: A semiconductor light-emitting device includes a light-emitting pixel region and a pad region, and includes light-emitting structures, a partition wall structure, a passivation structure, and a fluorescent layer, positioned in the light-emitting pixel region, and a pad unit positioned in the pad region. The partition wall structure includes partition walls defining pixel spaces. The passivation structure surrounds the partition walls and includes a first passivation layer including a first insulating material and a second passivation layer including a second insulating material different from the first insulating material. The passivation structure includes a first portion on a top surface of the partition walls, a second portion on a sidewall of the partition walls, and a third portion between the light-emitting structures and the fluorescent layer. A first thickness of the first portion is less than or equal to a second thickness of the second portion.

    METHOD OF FABRICATING SEMICONDUCTOR DEVICE
    13.
    发明申请

    公开(公告)号:US20200212047A1

    公开(公告)日:2020-07-02

    申请号:US16814387

    申请日:2020-03-10

    Abstract: A method of fabricating a semiconductor device includes providing a substrate including a pair of first regions and a second region therebetween, forming first patterns on the respective first regions to at least partially define a stepwise portion at the second region, and forming a dummy pattern that at least partially fills the stepwise portion. The dummy pattern may be an electrically floating structure. The dummy pattern may be formed as part of forming second patterns on the respective first regions, and the dummy pattern and the second patterns may include substantially common materials. Because the dummy pattern at least partially fills the stepwise portion at the second region, the material layer covering the second patterns and the dummy pattern may omit a corresponding stepwise portion.

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