公开(公告)号：US20240315039A1

公开(公告)日：2024-09-19

申请号：US18483331

申请日：2023-10-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Gyeongsik EOM ,  Inho KIM ,  Chankyu KIM ,  Jumi YUN ,  Young-Ho LEE ,  Dasom JUNG ,  Wongi HONG

IPC: H10B43/40 ,  H01L25/065 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B41/40 ,  H10B43/10 ,  H10B43/27 ,  H10B43/35 ,  H10B80/00

CPC classification number: H10B43/40 ,  H01L25/0652 ,  H10B41/10 ,  H10B41/27 ,  H10B41/35 ,  H10B41/40 ,  H10B43/10 ,  H10B43/27 ,  H10B43/35 ,  H10B80/00 ,  H01L2225/06506

Abstract: A semiconductor device includes a cell area, wherein the cell area includes: a cell array area; a connection area; a gate stacking structure including a plurality of gate electrodes, wherein the gate stacking structure includes an upper structure and a lower structure; a plurality of channel structures that penetrates the gate stacking structure in the cell array area; and a plurality of gate contact portions that penetrates the gate stacking structure in the connection area, wherein a bottom gate electrode in the cell array area is in a bottom portion of the upper structure and is adjacent to a channel structure among the plurality of channel structures, and wherein a bottom insulating portion in the connection area is in the bottom portion of the upper structure and is adjacent to a gate contact portion among the plurality of gate contact portions.

公开(公告)号：US20190244960A1

公开(公告)日：2019-08-08

申请号：US16386731

申请日：2019-04-17

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghyuk PARK ,  Byoungho KWON ,  Inho KIM ,  Hyesung PARK ,  Jin-Woo BAE ,  Yanghee LEE ,  Inseak HWANG

IPC: H01L27/108

CPC classification number: H01L27/10855 ,  H01L22/30 ,  H01L22/34 ,  H01L27/10814 ,  H01L27/10817 ,  H01L27/10823 ,  H01L27/10876

Abstract: A method of fabricating a semiconductor device includes providing a substrate including a pair of first regions and a second region therebetween, forming first patterns on the respective first regions to at least partially define a stepwise portion at the second region, and forming a dummy pattern that at least partially fills the stepwise portion. The dummy pattern may be an electrically floating structure. The dummy pattern may be formed as part of forming second patterns on the respective first regions, and the dummy pattern and the second patterns may include substantially common materials. Because the dummy pattern at least partially fills the stepwise portion at the second region, the material layer covering the second patterns and the dummy pattern may omit a corresponding stepwise portion.

公开(公告)号：US20210013369A1

公开(公告)日：2021-01-14

申请号：US16727496

申请日：2019-12-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Daeyeop HAN ,  Kiwon PARK ,  Jaeyoon KIM ,  Sungjoon KIM ,  Inho KIM

IPC: H01L33/00 ,  H01L25/075

Abstract: Provided a manufacturing method of a semiconductor light emitting device including forming a plurality of light emitting cells that are separated on a first substrate, forming a first planarization layer by providing an insulating material on the plurality of light emitting cells, forming a second planarization layer by providing a photoresist on the first planarization layer to have a flat upper surface, and soft baking the photoresist, and dry etching the second planarization layer to a predetermined depth to expose a portion of the first planarization layer provided on the plurality of light emitting cells, and a portion of the second planarization layer remaining between the plurality of light emitting cells on the first planarization layer, wherein forming the second planarization layer and dry etching are repeated at least once to remove the portion of the second planarization layer provided between the plurality of light emitting cells.

公开(公告)号：US20230047372A1

公开(公告)日：2023-02-16

申请号：US17711165

申请日：2022-04-01

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Minkyun KIM ,  Donghyuk JOO ,  Inho KIM ,  Seungmi SON ,  Sungwook LEE

IPC: H01L33/46 ,  H01L33/24 ,  H01L33/40 ,  H01L33/42 ,  H01L33/62

Abstract: A semiconductor light emitting device including a substrate; a light emitting structure including a first conductivity-type semiconductor layer, an active layer, and a second conductivity-type semiconductor layer sequentially stacked on the substrate; a transparent electrode layer on the second conductivity-type semiconductor layer; a first insulating layer on the transparent electrode layer and having a plurality of first through-holes; a multilayer insulating structure on the first insulating layer and having a plurality of second through-holes overlapping the plurality of first through-holes, respectively, the multilayer insulating structure being spaced apart from an edge of the light emitting structure; a reflective electrode layer on the multilayer insulating structure and connected to the transparent electrode layer through the plurality of first through-holes and the plurality of second through-holes; and a second insulating layer between the multilayer insulating structure and the reflective electrode layer.

公开(公告)号：US20210367121A1

公开(公告)日：2021-11-25

申请号：US17154632

申请日：2021-01-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho KIM ,  Yongmin Kwon ,  Sanghyun Kim ,  Jinwoo Park ,  Dongyeoul Lee ,  Dongju Lee ,  Sangbum Lee ,  Jonghyun Lee ,  Dahyun Choi

IPC: H01L33/62 ,  H01L27/15 ,  H01L33/22 ,  H01L33/38 ,  H01L33/46 ,  H01L33/50 ,  H01L33/58 ,  H01L33/64

Abstract: A light source module includes a light-emitting cell, a wiring structure provided on the light-emitting cell and connected to the light-emitting cell, a support structure that is apart from the light-emitting cell with the wiring structure therebetween in a vertical direction, a printed circuit board (PCB) that is apart from the wiring structure with the support substrate therebetween in the vertical direction and overlapping the light-emitting cell in the vertical direction, and at least one insulating film that is apart from the wiring structure in the vertical direction and covering at least one of a first surface of the support substrate, which faces the wiring structure, and a second surface of the support substrate, which faces the PCB.

公开(公告)号：US20200227419A1

公开(公告)日：2020-07-16

申请号：US16833914

申请日：2020-03-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jonghyuk PARK ,  Byoungho KWON ,  Inho KIM ,  Hyesung PARK ,  Jin-Woo BAE ,  Yanghee LEE ,  Inseak HWANG

IPC: H01L27/108 ,  H01L21/66

Abstract: Provided are a semiconductor device and a method of fabricating the same. The semiconductor device may include a semiconductor substrate including a first region and a second region, a dummy separation pattern provided on the second region of the semiconductor substrate to have a recessed region at its upper portion, a first electrode provided on the first region of the semiconductor substrate, a dielectric layer covering the first electrode, a second electrode provided on the dielectric layer, and a remaining electrode pattern provided in the recessed region. The second electrode and the remaining electrode pattern may be formed of a same material.

公开(公告)号：US20180175966A1

公开(公告)日：2018-06-21

申请号：US15819484

申请日：2017-11-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Inho KIM ,  Jongkeun SONG ,  Woosup LEE

IPC: H04K3/00 ,  G06Q20/32

CPC classification number: H04K3/825 ,  G06K19/06 ,  G06K19/06206 ,  G06K19/07336 ,  G06Q20/325 ,  H04K3/827 ,  H04M1/026

Abstract: An electronic device includes first and second antennas, a magnetic stripe transmission (MST) integrated circuit (IC), and a processor. The first antenna is disposed between first and second surfaces of the electronic device and in parallel with the first and second surfaces of the electronic device. The first antenna outputs a signal in a first direction. The second antenna is disposed between the second surface of the electronic device and the first antenna and in parallel with the first and second surfaces of the electronic device. The second antenna outputs a signal in a second direction. The MST IC controls the first and second antennas. When a payment mode is executed, the processor controls the MST IC such that one of the first and second antennas outputs an MST signal and the other of the first and second antenna outputs a jamming signal for interfering with wiretapping of the MST signal.

公开(公告)号：US20240178990A1

公开(公告)日：2024-05-30

申请号：US18520023

申请日：2023-11-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jinha HWANG ,  Inho KIM ,  Dongsun LEE ,  Jaemin RYu ,  Kyungim JUNG

IPC: H04L9/06 ,  G06F21/60

CPC classification number: H04L9/0637 ,  G06F21/602 ,  H04L9/0631

Abstract: An electronic device comprises: a first processor operating in a general non-secure environment; a second processor operating in a secure environment; a first memory allocated to the general non-secure environment; a second memory allocated to the secure environment; and a third memory shared in the general non-secure environment and the secure environment, wherein the second processor is configured to: encrypt at least a portion of secure data to generate an encrypted portion, the secure data generated by a trusted application executed in the secure environment, store the encrypted portion in the third memory, and store first information used to encrypt the at least a portion of the secure data and second information generated while encrypting the at least the portion of the secure data in the second memory, and wherein the first processor is configured to, store the encrypted portion stored in the third memory in the first memory.

公开(公告)号：US20220199679A1

公开(公告)日：2022-06-23

申请号：US17542720

申请日：2021-12-06

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Kiwon PARK ,  Geunwoo KO ,  Inho KIM ,  Sungwook LEE ,  Jonghyun LEE ,  Byungchul CHOI

IPC: H01L27/15

Abstract: A semiconductor light emitting device is provided. The semiconductor light emitting device includes a plurality of light emitting structures, each of which includes a first surface and a second surface, a plurality of embossed portions provided on the first surface; a partition wall structure provided on the first surface of the plurality of light emitting structures and including a plurality of partition walls which define a plurality of pixel spaces; and a fluorescent layer provided in the plurality of pixel spaces. A bottom surface of the partition wall structure contacts the plurality of embossed portions.

公开(公告)号：US20220172192A1

公开(公告)日：2022-06-02

申请号：US17671050

申请日：2022-02-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongwan LEE ,  Inho KIM ,  Yongseok PARK ,  Seongmin JE

IPC: G06Q20/32 ,  G06Q20/40

Abstract: An electronic device is provided. The electronic device includes a communication module, at least one processor, and a memory configured to be operatively coupled to the at least one processor, wherein the memory stores instructions configured to, when executed, cause the at least one processor to identify information on a first country in which the electronic device is located through the communication module, perform payment based on a first authentication method corresponding to the identified information on the first country in response to a first payment application execution request, and change the first authentication method to a second authentication method corresponding to information on a second country in response to detection of a change from the first country to the second country through the communication module.