Abstract:
In a nitride-based semiconductor device, an undoped gallium nitride (GaN) layer is formed on an aluminum gallium nitride (AlGaN) layer, and a silicon carbon nitride (SixC1-xN) functional layer is formed on the undoped GaN layer.
Abstract:
A nitride based heterojunction semiconductor device includes a gallium nitride (GaN) layer disposed on a substrate, an aluminum (Al)-doped GaN layer disposed on the GaN layer, a Schottky electrode disposed in a first area on the Al-doped GaN layer, an AlGaN layer disposed in a second area on the Al-doped GaN layer, and an ohmic electrode disposed on the AlGaN layer. The first area is different from the second area.
Abstract:
An analog-to-digital converter (ADC) includes a first comparator configured to generate a first comparison signal on a basis of a first asynchronous clock signal generated from a sampling clock signal, and a second comparator configured to generate a second comparison signal on a basis of a second asynchronous clock signal generated by a first comparison operation completion signal. The ADC includes a first control logic configured to output a first control signal on a basis of the first comparison signal and a second control logic configured to output a second control signal on a basis of the second comparison signal. The ADC includes a first reference signal adjusting circuit configured to adjust a first reference signal on a basis of the first control signal and a second reference signal adjusting circuit configured to adjust a second reference signal on a basis of the second control signal.
Abstract:
Provided is a power device. The power device may include a two-dimensional electron gas (2-DEG) layer in a portion corresponding to a gate electrode pattern since a second nitride layer is further formed on a lower portion of the gate electrode pattern after a first nitride layer is formed and thus, may be capable of performing a normally-OFF operation. Accordingly, the power device may adjust generation of the 2-DEG layer based on a voltage of a gate, and may reduce power consumption. The power device may regrow only the portion corresponding to the gate electrode pattern or may etch a portion excluding the portion corresponding to the gate electrode pattern and thus, a recess process may be omissible, a reproducibility of the power device may be secured, and a manufacturing process may be simplified.