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    Semiconductor package and method of manufacturing the same
    13.
    发明授权
    Semiconductor package and method of manufacturing the same 有权

    公开(公告)号：US11145611B2

    公开(公告)日：2021-10-12

    申请号：US16795795

    申请日：2020-02-20

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jongyoun Kim ,  Jungho Park ,  Seokhyun Lee ,  Yeonho Jang ,  Jaegwon Jang

    IPC: H01L23/498 ,  H01L25/065 ,  H01L23/00 ,  H01L21/768

    Abstract: A semiconductor package includes a redistribution structure including a redistribution insulating layer and a redistribution pattern, a semiconductor chip provided on a first surface of the redistribution insulation layer and electrically connected to the redistribution pattern, and a lower electrode pad provided on a second surface opposite to the first surface of the redistribution insulating layer, the lower electrode pad including a first portion embedded in the redistribution insulating layer and a second portion protruding from the second surface of the redistribution insulating layer, wherein a thickness of the first portion of the lower electrode pad is greater than a thickness of the second portion of the lower electrode pad.

    Antenna device and electronic device including same
    14.
    发明授权
    Antenna device and electronic device including same 有权

    公开(公告)号：US10224607B2

    公开(公告)日：2019-03-05

    申请号：US15217496

    申请日：2016-07-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bomyoung Kim ,  Jungho Park ,  Byungman Lim ,  Young-Jun Cho

    IPC: H01Q1/24 ,  H01Q1/48 ,  H01Q1/40 ,  H01Q21/28 ,  H01Q9/42

    Abstract: An electronic device is provided that includes a housing, a first conductive member configured to form a part of the housing, or be partially disposed within the housing, wherein the first conductive member includes a first conductive protrusion disposed toward the inside of the housing, a second conductive member configured to form another part of the housing, wherein the second conductive member includes a portion disposed adjacent to a portion of the first conductive member and a second conductive protrusion disposed toward the inside of the housing, a non-conductive member disposed between the portion of the first conductive member and the portion of the second conductive member, a coupling structure that includes a conductor and is connected between the first conductive protrusion and the second conductive protrusion, and at least one communication circuit electrically connected to the second conductive member.

    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING SAME
    15.
    发明申请
    ANTENNA DEVICE AND ELECTRONIC DEVICE INCLUDING SAME 审中-公开
    天线装置和包括它们的电子装置

    公开(公告)号：US20170047638A1

    公开(公告)日：2017-02-16

    申请号：US15217496

    申请日：2016-07-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Bomyoung KIM ,  Jungho Park ,  Byungman Lim ,  Young-Jun Cho

    IPC: H01Q1/24 ,  H04B1/40 ,  H01Q1/48

    CPC classification number: H01Q1/243 ,  H01Q1/40 ,  H01Q1/48 ,  H01Q9/42 ,  H01Q21/28

    Abstract: An electronic device is provided that includes a housing, a first conductive member configured to form a part of the housing, or be partially disposed within the housing, wherein the first conductive member includes a first conductive protrusion disposed toward the inside of the housing, a second conductive member configured to form another part of the housing, wherein the second conductive member includes a portion disposed adjacent to a portion of the first conductive member and a second conductive protrusion disposed toward the inside of the housing, a non-conductive member disposed between the portion of the first conductive member and the portion of the second conductive member, a coupling structure that includes a conductor and is connected between the first conductive protrusion and the second conductive protrusion, and at least one communication circuit electrically connected to the second conductive member.

    Abstract translation: 提供一种电子设备，其包括壳体，被配置为形成壳体的一部分的第一导电构件或部分地设置在壳体内，其中第一导电构件包括朝向壳体内部设置的第一导电突起， 第二导电构件，其被配置为形成所述壳体的另一部分，其中所述第二导电构件包括邻近所述第一导电构件的一部分设置的部分和朝向所述壳体的内部设置的第二导电突起， 所述第一导电构件的所述部分和所述第二导电构件的所述部分，包括导体并且连接在所述第一导电突起和所述第二导电突起之间的耦合结构，以及至少一个电连接到所述第二导电构件 。

    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    18.
    发明申请
    SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME 有权

    公开(公告)号：US20210407940A1

    公开(公告)日：2021-12-30

    申请号：US17474614

    申请日：2021-09-14

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jongyoun Kim ,  Jungho Park ,  Seokhyun Lee ,  Yeonho Jang ,  Jaegwon Jang

    IPC: H01L23/00 ,  H01L23/498 ,  H01L21/768 ,  H01L25/065

    Abstract: A semiconductor package includes a redistribution structure including a redistribution insulating layer and a redistribution pattern, a semiconductor chip provided on a first surface of the redistribution insulation layer and electrically connected to the redistribution pattern, and a lower electrode pad provided on a second surface opposite to the first surface of the redistribution insulating layer, the lower electrode pad including a first portion embedded in the redistribution insulating layer and a second portion protruding from the second surface of the redistribution insulating layer, wherein a thickness of the first portion of the lower electrode pad is greater than a thickness of the second portion of the lower electrode pad.

    METHOD AND APPARATUS FOR PROVIDING CONTENT BASED ON KNOWLEDGE GRAPH
    19.
    发明申请
    METHOD AND APPARATUS FOR PROVIDING CONTENT BASED ON KNOWLEDGE GRAPH 有权

    公开(公告)号：US20210089598A1

    公开(公告)日：2021-03-25

    申请号：US16928644

    申请日：2020-07-14

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Mirae Jeong ,  Hyonsok Lee ,  Jungho Park ,  Jaehun Lee ,  Taeho Hwang ,  Yunsu Lee ,  Jiyoung Kang

    IPC: G06F16/9535 ,  G06N5/02 ,  G06F16/901

    Abstract: A content recommendation is provided based on a knowledge graph using, for example, a processor and memory of a device. In some embodiments, sensors are used. The content recommendation efficiently makes user of the processor, memory and/or sensors. A knowledge graph is maintained at the device and another knowledge graph may be maintained at a server. The knowledge graph at the device is generated, for example, by obtaining log history information, generating a device knowledge graph, generating a pattern knowledge graph associated with a behavior pattern of a user, and/or updating the device knowledge graph by adding the pattern knowledge graph to the device knowledge graph. In some examples, the knowledge graph at the server is generated by a server, based on the pattern knowledge graph.

    Antenna device and electronic device including the same
    20.
    发明授权
    Antenna device and electronic device including the same 有权

    公开(公告)号：US12176620B2

    公开(公告)日：2024-12-24

    申请号：US17496326

    申请日：2021-10-07

    Applicant: SAMSUNG ELECTRONICS CO., LTD.

    Inventor： Juneseok Lee ,  Jinsu Heo ,  Youngsub Kim ,  Jungho Park ,  Kwanghyun Baek ,  Youngju Lee ,  Kyoungho Jeong ,  Dohyuk Ha

    IPC: H01Q21/06 ,  H01Q1/24 ,  H01Q9/04

    Abstract: According to various embodiments of the disclosure, an antenna device comprises: a first antenna array including an array of a plurality of first radiation patches, a communication circuit configured to transmit and/or receive a radio signal using at least one of the first radiation patches, and at least one first isolator comprising a conductor disposed in an area between two adjacent first radiation patches among the first radiation patches. The first isolator may include a first portion, a second portion disposed in parallel with the first portion, and a third portion electrically connecting the first portion with the second portion. The first portion and the second portion may be configured to generate current flows having a phase difference of 180 degrees with respect to each other.

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