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公开(公告)号：US20230163488A1
公开(公告)日：2023-05-25
申请号：US18152311
申请日：2023-01-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Juneseok LEE , Dohyuk HA , Jinsu HEO
Abstract: An antenna assembly is provided. The antenna assembly includes a first flexible printed circuit board (FPCB) for multiple first antennas, a second flexible printed circuit board (FPCB) for multiple second antennas, a metal plate including multiple holes, a first adhesive material layer for bonding between the metal plate and the first FPCB, and a second adhesive material layer for bonding between the metal plate and the second FPCB, wherein the metal plate is disposed such that the multiple first antennas are located in the multiple holes, respectively and the multiple second antennas to be located in the multiple holes, respectively.
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公开(公告)号：US20230099560A1
公开(公告)日：2023-03-30
申请号：US17754893
申请日：2020-10-14
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Dohyuk HA , Kwanghyun BAEK , Juneseok LEE , Jinsu HEO , Youngju LEE , Jungyub LEE
Abstract: The present disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting higher data transmission rates than a 4th generation (4G) communication system such as long-term evolution (LTE). An antenna module in a wireless communication system includes: a printed circuit board (PCB); a radio frequency integrated circuit (RFIC); and a plurality of antenna elements for emitting a radio frequency (RF) signal, wherein the plurality of antenna elements may be disposed in a first area of a first surface of the PCB, and the RFIC may be disposed in a second area, different from the first area, of the first surface of the PCB.
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公开(公告)号：US20190363458A1
公开(公告)日：2019-11-28
申请号：US16537919
申请日：2019-08-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Jungmin PARK , Byungchul KIM , Hyunjin KIM , Kwanghyun BAEK , Youngju LEE , Jinsu HEO
Abstract: An antenna device for providing a higher data transmission rate in a wireless communication system is provided. The antenna device includes a first radiating body mounted to a side surface of a multiple layer circuit board to transmit and receive a wireless signal and a second radiating body mounted to a top surface of the multiple layer circuit board and electrically connected to the first radiating body to transmit and receive the wireless signal together with the first radiating body.
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公开(公告)号：US20240266716A1
公开(公告)日：2024-08-08
申请号：US18384156
申请日：2023-10-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Juneseok LEE , Kwanghyun BAEK , Jungyub LEE , Dohyuk HA
CPC classification number: H01Q1/246 , H01Q1/2283 , H01Q9/16 , H01Q21/062
Abstract: A radio unit (RU) module may include: a first substrate comprising a first surface and a second surface opposite to the first surface; a radio frequency integrated circuit (RFIC); a second substrate comprising a plurality of layers that comprises a plurality of second layers that comprises at least one first layer; a plurality of antenna elements comprising a first antenna element and a second antenna element; and a plurality of conductivity members comprising a conductivity member. The RFIC may be coupled to the first surface of the first substrate. The second substrate may be coupled to the second surface of the first substrate. The plurality of antenna elements may be disposed on the at least one first layer of the second substrate. The plurality of conductivity members may be disposed across the plurality of second layers of the second substrate.
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公开(公告)号：US20240056520A1
公开(公告)日：2024-02-15
申请号：US18313722
申请日：2023-05-08
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Youngsub KIM , Jungho PARK , Kwanghyun BAEK , Jungyub LEE , Juneseok LEE , Dohyuk HA
CPC classification number: H04M1/0277 , H05K1/144 , H05K1/028 , H05K2201/041 , H05K2201/10734 , H05K2201/10098
Abstract: In various embodiments, a module for a wireless communication includes: a radiator, a plurality of resonators, a first substrate on which the radiator and the plurality of resonators are disposed, and a second substrate including a power supply. The first substrate includes a plurality of first layers. The second substrate includes a plurality of second layers. The radiator is disposed on a radiation layer of the plurality of first layers of the first substrate. The plurality of resonators is disposed on a resonance layer of the plurality of first layers of the first substrate. At least part of the plurality of resonators in the resonance layer is disposed in an area in the radiation layer, different from an area in which the radiator is disposed.
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Patent Agency Ranking
公开(公告)号：US20230299506A1
公开(公告)日：2023-09-21
申请号：US18192910
申请日：2023-03-30
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sanghoon PARK , Kwanghyun BAEK , Juneseok LEE , Dohyuk HA , Jungho PARK , Youngju LEE , Jungyub LEE , Jinsu HEO
CPC classification number: H01Q21/28 , H01Q1/2283
Abstract: The disclosure relates to a 5th generation (5G) or pre-5G communication system for supporting a higher data transmission rate than a 4th generation (4G) communication system such as long term evolution (LTE). An antenna module is provided. The antenna module includes a plurality of antennas, a first printed circuit board (PCB) on which the plurality of antennas are disposed, a second PCB on which one or more elements for processing a radio frequency (RF) signal are disposed, and an adhesive material for bonding the first PCB and the second PCB, wherein the first PCB includes a first metal layer, a second metal layer, a dielectric, and a coupling structure plated along the first metal layer, the second metal layer, and a via hole between the first metal layer and the second metal layer, and may be disposed to provide a coupling connection through the coupling structure of the first PCB.
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公开(公告)号：US20230129937A1
公开(公告)日：2023-04-27
申请号：US18145550
申请日：2022-12-22
Applicant: Samsung Electronics Co., Ltd.
Inventor： Youngsub KIM , Sohyeon JUNG , Kwanghyun BAEK , Youngju LEE , Juneseok LEE , Dohyuk HA
Abstract: An electronic device is provided. The electronic device includes a plurality of antenna arrays, a plurality of first printed circuit board (PCB) sets corresponding to the plurality of the antenna arrays, and a second PCB including a power interface, the second PCB may include a feeding line for delivering signals to the antenna elements, a first layer formed away from a first surface of the feeding line, and a second layer formed away from a second surface of the feeding line, and the second layer may include a metamaterial for transforming impedance.
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公开(公告)号：US20230019144A1
公开(公告)日：2023-01-19
申请号：US17946688
申请日：2022-09-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Juneseok LEE , Youngsub KIM , Sanghoon PARK , Jungho PARK , Kwanghyun BAEK , Youngju LEE , Jungyub LEE , Dohyuk HA , Jinsu HEO
Abstract: The disclosure relates to a pre-5th-Generation (5G) or 5G communication system for supporting higher data rates Beyond 4th-Generation (4G) communication system, such as long term evolution (LTE). An antenna device is provided. The antenna device includes a first printed circuit board (PCB), a second PCB for a plurality of antenna elements, and a radio frequency integrated circuit (RFIC) coupled through a first surface of the first PCB. The second PCB may include a radio frequency (RF) routing layer including RF lines for the respective plurality of antenna elements. The first PCB may include a feeding structure for connecting the RF routing layer and the RFIC. The second PCB may be electrically connected to a second surface of the first PCB opposite to the first surface of the first PCB, through a first surface of the second PCB. The second PCB may be coupled to the plurality of antenna elements.
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公开(公告)号：US20210344120A1
公开(公告)日：2021-11-04
申请号：US17373000
申请日：2021-07-12
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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公开(公告)号：US20210126379A1
公开(公告)日：2021-04-29
申请号：US17062990
申请日：2020-10-05
Applicant: Samsung Electronics Co., Ltd.
Inventor： Kwanghyun BAEK , Seungtae KO , Kijoon KIM , Juho SON , Sangho LEE , Youngju LEE , Jungyub LEE , Yonghun CHEON , Dohyuk HA
IPC: H01Q21/06 , H01Q1/24 , H01Q1/42 , H04B7/0413 , H05K1/18
Abstract: A communication method and system for converging a 5th-Generation (5G) communication system for supporting higher data rates beyond a 4th-Generation (4G) system with a technology for Internet of Things (IoT) are provided. The disclosure may be applied to intelligent services based on the 5G communication technology and the IoT-related technology, such as smart home, smart building, smart city, smart car, connected car, health care, digital education, smart retail, security and safety services. According to the disclosure, an antenna module includes a first substrate layer on which at least one substrate is stacked; an antenna coupled to an upper end surface of the first substrate layer; a second substrate layer having an upper end surface coupled to a lower end surface of the first substrate layer and on which at least one substrate is stacked; and a radio frequency (RF) element coupled to a lower end surface of the second substrate layer.
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