-
公开(公告)号:US11056769B2
公开(公告)日:2021-07-06
申请号:US16661033
申请日:2019-10-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seunggil Jeon , Kyungwoo Lee , Joohyun Ahn
Abstract: An electronic device may include a housing including a conductive area, a first conductive member comprising a conductive material in electrical contact with the conductive area, a first wireless communication circuit electrically connected to the conductive area, and a second wireless communication circuit electrically connected to the first conductive member. The first wireless communication circuit transmits and/or receives a first signal having a frequency of 6 GHz or less using the conductive area, and the second wireless communication circuit transmits and/or receives a second signal having a frequency of 20 GHz or more using at least part of the first conductive member and the conductive area.
-
公开(公告)号:US11632604B2
公开(公告)日:2023-04-18
申请号:US16876376
申请日:2020-05-18
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sungbum Park , Kyungwoo Lee , Jaehyun Park , Sungku Yeo , Jeongman Lee
IPC: H04Q9/00 , G01R21/133 , H02J50/10 , H02J50/00
Abstract: A sensor device is provided. The sensor device includes an energy harvester configured to generate electric energy, a monitoring circuit, a sensor, a communication circuit, and at least one processor configured to obtain information indicating a magnitude of the generated electric energy via the monitoring circuit, obtain a sensing value via the sensor, and transmit the sensing value and the information indicating the magnitude of the generated electric energy via the communication circuit to the other electronic device.
-
公开(公告)号:US20220083110A1
公开(公告)日:2022-03-17
申请号:US17532518
申请日:2021-11-22
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ohhyuck Kwon , Jaeyoung Huh , Daesuk Kang , Seunghoon Kang , Boram Kim , Hongki Moon , Yoonsun Park , Kyungwoo Lee , Seungjoo Lee , Jonghoon Lim
IPC: G06F1/20 , H01L23/427 , G06F1/16
Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
-
公开(公告)号:US20210392722A1
公开(公告)日:2021-12-16
申请号:US17030706
申请日:2020-09-24
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Cheonyong Lim , Daehyun Kim , Sungbum Park , Youngho Ryu , Kyungwoo Lee
Abstract: According to various embodiments, an electronic device attachable to and detachable from a side of a cooking vessel that is heated based on a magnetic field generated from an induction cooktop includes: a magnetic harvester circuit configured to generate electric energy based on the magnetic field generated from the induction cooktop based on the electronic device being attached to the side of the cooking vessel; a temperature sensor configured to be driven based on the electric energy and configured to detect a temperature; and a communication circuit configured to transmit the temperature to the induction cooktop.
-
公开(公告)号:US11181955B2
公开(公告)日:2021-11-23
申请号:US16774618
申请日:2020-01-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Ohhyuck Kwon , Jaeyoung Huh , Daesuk Kang , Seunghoon Kang , Boram Kim , Hongki Moon , Yoonsun Park , Kyungwoo Lee , Seungjoo Lee , Jonghoon Lim
IPC: G06F1/20 , G06F1/16 , H01L23/427
Abstract: Disclosed is an electronic device having a thermal diffusion structure and including a housing comprising a first surface, a second surface facing the first surface, and a third surface vertical to the first surface and the second surface, a display exposed through at least part of the first surface, a battery arranged between the first surface and the second surface, a heating source arranged between the battery and the third surface in a direction vertical to the first surface and the second surface, and a first thermal diffusion member arranged vertically to the first surface and the second surface, the first thermal diffusion member including a first portion in thermal contact with at least part of the heating source and diffusing heat provided by the heating source to at least one second portion.
-
公开(公告)号:US11139565B2
公开(公告)日:2021-10-05
申请号:US16913110
申请日:2020-06-26
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Seunggil Jeon , Namwoo Kim , Seongbeom Hong , Sunghoon Moon , Kyungwoo Lee
Abstract: An electronic device is disclosed. An electronic device according to various embodiments includes: a housing having a front plate facing a first direction, a rear plate facing a second direction opposite the first direction, and a side housing surrounding a space between the front plate and the rear plate; a conductive member comprising a conductive material disposed between the front plate and the rear plate; a display viewable through the front plate; at least one antenna module including a plurality of antenna elements configured to form a beam in a third direction facing the conductive member, and disposed to be spaced apart from the conductive member in the space; and a wireless communication circuit electrically coupled to the antenna module and configured to transmit and/or receive at least one signal having a frequency in a range of 3 GHz to 100 GHz, wherein the conductive member has a first surface forming a first acute angle with a virtual line crossing centers of the antenna elements and facing in the third direction, and a second surface forming a second acute angle with the virtual line, wherein a joint of the first surface and the second surface is positioned on the virtual line.
-
-
-
-
-