公开(公告)号：US20150003314A1

公开(公告)日：2015-01-01

申请号：US14318434

申请日：2014-06-27

Applicant: Samsung Electronics Co., Ltd. ,  Korea University of Technology and Education Industry-University Cooperation Foundation

Inventor： Min Kim ,  Yong-Hwan Kim ,  Youn-Hee Han ,  Sang-Jun Moon ,  Yong-Seok Park ,  Jin-Ho Lee ,  Dae-Kyu Choi

IPC: H04W28/02 ,  H04W4/12 ,  H04W68/02 ,  H04W36/00 ,  H04W60/00

CPC classification number: H04W68/02 ,  H04W28/08 ,  H04W76/00

Abstract: Provided is a method for offloading data traffic by a Mobility Management Entity (MME) in a wireless communication system. The method includes determining a Packet Data Network (PDN) to connect to for providing a service requested by a User Equipment (UE), upon receiving a connection request message requesting connection between the UE and the PDN from the UE, selecting a gateway disposed closest to a Radio Access Network (RAN), sending a permit message permitting a request for connection between the UE and the PDN to the UE, and setting an Evolved Packet Service (EPS) bearer for transmission and reception of data traffic related to a service requested by the UE between the UE and the gateway.

Abstract translation: 提供了一种用于在无线通信系统中由移动性管理实体（MME）卸载数据业务的方法。 该方法包括：在接收到请求UE与UE之间的连接的连接请求消息时，确定要连接的分组数据网络（PDN）以提供由用户设备（UE）请求的服务，选择最靠近的网关 向无线电接入网络（RAN）发送许可消息，允许在UE和PDN之间连接到UE的请求，并且设置演进分组业务（EPS）承载以发送和接收与所请求的业务相关的数据业务 由UE在UE和网关之间。

公开(公告)号：US20140359372A1

公开(公告)日：2014-12-04

申请号：US14185447

申请日：2014-02-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Min Kim ,  Yean-Sang You ,  Won-Gil Han ,  Ho-Am Kim ,  Byong-Joo Kim ,  Do-Hoon Lee

IPC: G05B23/02

CPC classification number: G06F11/26 ,  G01R31/025 ,  G01R31/04 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: In a method of detecting faults of operation algorithms in a wire bonding machine, individual bond parameters with respect to each of the operation algorithms of the wire bonding machine can be set based on design data including information with respect to conductive wires connected between semiconductor chips of a semiconductor package. Actual conductive wires of an actual semiconductor package can be formed using the wire bonding machine into which the design data can be inputted. Actual data with respect to actual operation algorithms of the wire bonding machine, which can form the actual conductive wires, can be obtained. The actual data can be compared with the individual bond parameters to detect the faults of the operation algorithms of the wire bonding machine. Thus, forming an abnormal conductive wire by the wire bonding machine can be prevented beforehand.

Abstract translation: 在线接合机中检测运算算法的故障的方法中，可以基于设计数据设定相关于引线键合机的各运算算法的各个结合参数，该设计数据包括关于连接在半导体芯片 半导体封装。 可以使用可以输入设计数据的引线接合机来形成实际的半导体封装的实际导线。 可以获得关于可形成实际导线的引线接合机的实际操作算法的实际数据。 实际数据可以与各自的绑定参数进行比较，以检测引线接合机的操作算法的故障。 因此，可以预先防止由引线接合机形成异常导电线。

公开(公告)号：US12038558B2

公开(公告)日：2024-07-16

申请号：US17261898

申请日：2019-06-24

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yongyi Kim ,  Min Kim ,  Yongha Kim ,  Yongjoon Choi

IPC: G02B1/115 ,  G02B1/14

CPC classification number: G02B1/115 ,  G02B1/14

Abstract: Disclosed is an electronic device. An electronic device according to various embodiments includes: a housing; a first glass plate attached to the housing and forming a portion of an external surface of the electronic device, wherein the first glass plate includes a flat portion, a curved portion extending from an edge of the flat portion, a first surface facing outwardly from the electronic device, and a second surface facing inwardly towards the electronic device; and a coating layer formed on the first surface of the first glass plate, wherein the coating layer includes a first layer having a first refractive index and containing at least one first material, and includes a second layer disposed further from the first surface than the first layer, containing at least one second material, and having a second refractive index different from the first refractive index.

公开(公告)号：US09860869B2

公开(公告)日：2018-01-02

申请号：US14318434

申请日：2014-06-27

Applicant: Samsung Electronics Co., Ltd. ,  Korea University of Technology and Education Idustry—University Cooperation Foundation

Inventor： Min Kim ,  Yong-Hwan Kim ,  Youn-Hee Han ,  Sang-Jun Moon ,  Yong-Seok Park ,  Jin-Ho Lee ,  Dae-Kyu Choi

IPC: H04W28/00 ,  H04W68/02 ,  H04W28/08 ,  H04W76/00

CPC classification number: H04W68/02 ,  H04W28/08 ,  H04W76/00

Abstract: Provided is a method for offloading data traffic by a Mobility Management Entity (MME) in a wireless communication system. The method includes determining a Packet Data Network (PDN) to connect to for providing a service requested by a User Equipment (UE), upon receiving a connection request message requesting connection between the UE and the PDN from the UE, selecting a gateway disposed closest to a Radio Access Network (RAN), sending a permit message permitting a request for connection between the UE and the PDN to the UE, and setting an Evolved Packet Service (EPS) bearer for transmission and reception of data traffic related to a service requested by the UE between the UE and the gateway.

公开(公告)号：US09674614B2

公开(公告)日：2017-06-06

申请号：US14738161

申请日：2015-06-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Ho Jin Yoon ,  Min Kim ,  Tae Myun Kim ,  Seong Min Park ,  Won Youl Bae

IPC: H04R9/02 ,  H04R9/06

CPC classification number: H04R9/025 ,  H04R9/06

Abstract: A speaker unit includes a magnet having poles and generating magnetic flux, and a yoke part forming a path of the magnetic flux and including a first yoke extending from one of the poles, a second yoke extending from another one of the poles, and magnetic gaps disposed between the first yoke and the second yoke. The speaker unit further includes a voice coil disposed between the magnetic gaps and moving when applied with an electric current, and a diaphragm generating sound pressure while vibrating according to the movement of the voice coil. The first yoke includes magnetic plates protruding toward the second yoke, and the magnetic plates have thicknesses different from each other.

公开(公告)号：US20140151437A1

公开(公告)日：2014-06-05

申请号：US14089366

申请日：2013-11-25

Applicant: Samsung Electronics Co., Ltd.

Inventor： Il-Soo Choi ,  Min Kim ,  Tae-Ho Moon ,  Ju-Young Yu ,  Sung-Bok Hong

IPC: H01L23/00

CPC classification number: H01L24/75 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68381 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/757 ,  H01L2224/759 ,  H01L2224/81024 ,  H01L2224/81815 ,  H01L2924/14 ,  H01L2924/014

Abstract: A chip mounting apparatus includes a loading unit, a combining unit and a bonding unit. The loading unit loads a circuit board having contact pads and semiconductor chips having solder balls into the chip mounting apparatus. The combining unit positions the semiconductor chip onto a respective mounting area of the circuit board and combines the solder balls of the semiconductor chip with the contact pads of the circuit board by using flux. The combining unit has a flux coater for coating the solder balls with the flux and a flux controller for automatically supplementing the flux to the flux coater. The bonding unit bonds the solder balls to the respective contact pads by a reflow process.

Abstract translation: 芯片安装装置包括加载单元，组合单元和结合单元。 装载单元将具有接触焊盘的电路板和具有焊球的半导体芯片加载到芯片安装装置中。 组合单元将半导体芯片定位在电路板的相应安装区域上，并且通过使用焊剂将半导体芯片的焊球与电路板的接触焊盘组合。 组合单元具有用于涂覆助焊剂的焊剂焊剂和用于将焊剂自动补充到焊剂涂布机的焊剂控制器的焊剂涂布机。 接合单元通过回流工艺将焊球接合到相应的接触焊盘。