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    ADJUSTABLE SENSOR SUPPORT STRUCTURE FOR OPTIMIZING SKIN CONTACT
    11.
    发明申请
    ADJUSTABLE SENSOR SUPPORT STRUCTURE FOR OPTIMIZING SKIN CONTACT 审中-公开
    可调节传感器支持结构优化皮肤接触

    公开(公告)号：US20150265214A1

    公开(公告)日：2015-09-24

    申请号：US14284532

    申请日：2014-05-22

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Margreet De Kok ,  Lindsay Brown ,  Gert Van Heck ,  Sheldon George Phillips ,  Joseph J. Kopp, JR.

    IPC: A61B5/00 ,  H05K3/10 ,  A61B5/1455 ,  A61B5/0205 ,  A61B5/0408

    CPC classification number: A61B5/6843 ,  A61B5/0015 ,  A61B5/0205 ,  A61B5/0408 ,  A61B5/14552 ,  A61B5/681 ,  A61B5/742 ,  A61B5/7475 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/10151 ,  Y10T29/49155 ,  Y10T29/49826

    Abstract: Exemplary embodiments provide an adjustable sensor support structure for optimal skin contact. Aspects of the exemplary embodiments include a sensor array comprising a plurality of sensor units arranged on a band such that the sensor array straddles or otherwise addresses a blood vessel when worn on a measurement site of a user; and a pressure exertion apparatus attached between the sensor units and the band that exerts outward pressure on the sensor units towards the measurement site causing the sensor units to maintain contact with skin of the user independent of motion activity of the band, thereby improving contact quality, wherein the pressure exertion apparatus comprises at least one of: a flexible bridge structure, a flexible foam structure, and a sensor trampoline structure.

    Abstract translation: 示例性实施例提供了用于最佳皮肤接触的可调传感器支撑结构。 示例性实施例的方面包括传感器阵列，其包括布置在带上的多个传感器单元，使得传感器阵列在佩戴在用户的测量位置时跨过或以其他方式解决血管; 以及附着在传感器单元和带之间的压力消耗装置，所述带在传感器单元上​​朝向测量位置施加向外的压力，导致传感器单元与带的运动活动无关地保持与使用者皮肤的接触，从而提高接触质量， 其中所述压力消耗装置包括柔性桥结构，柔性泡沫结构和传感器蹦床结构中的至少一个。

    Modular Sensor Platform
    14.
    发明申请
    Modular Sensor Platform 审中-公开
    模块化传感器平台

    公开(公告)号：US20150157220A1

    公开(公告)日：2015-06-11

    申请号：US14286620

    申请日：2014-05-23

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Ram Fish ,  James Schuessler ,  Julien Penders ,  Lindsay Brown ,  Frank Settemo Nuovo ,  Sheldon George Phillips ,  Tom Torfs

    IPC: A61B5/0205 ,  A61B5/021 ,  A61B5/04 ,  A61B5/11 ,  A61B5/00 ,  A61B5/0402

    CPC classification number: A61B5/02055 ,  A61B5/0002 ,  A61B5/01 ,  A61B5/02141 ,  A61B5/0402 ,  A61B5/0533 ,  A61B5/1118 ,  A61B5/14552 ,  A61B5/681 ,  A61B5/7278 ,  A61B2560/0242 ,  A61B2560/045

    Abstract: Exemplary embodiments for reconfiguring a storage system comprise a modular sensor platform, comprising: a base module comprising, a display, a processor, a memory and a communication interface; a band removably coupled to the base module such that the band is replaceable with different types of bands; and a sensor module that collects data from a user, the sensor module in communication with the base module and removably coupled to the band such that the sensor module is replaceable with different types of sensor modules, the sensor module further comprising a plurality of sensor units that are removably coupled to the sensor module such that individual sensor units are replaceable with different types of sensor units.

    Abstract translation: 用于重新配置存储系统的示例性实施例包括模块化传感器平台，包括：基本模块，包括显示器，处理器，存储器和通信接口; 带可移除地耦合到所述基本模块，使得所述带可以用不同类型的带替换; 以及传感器模块，其从用户收集数据，所述传感器模块与所述基本模块通信并可移除地耦合到所述带，使得所述传感器模块可以用不同类型的传感器模块替换，所述传感器模块还包括多个传感器单元 其可拆卸地联接到传感器模块，使得各个传感器单元可以用不同类型的传感器单元替换。

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