公开(公告)号：US10166492B2

公开(公告)日：2019-01-01

申请号：US15195225

申请日：2016-06-28

Applicant: Semes Co., Ltd.

Inventor： Jaehyeok Yu ,  Jae-Youl Kim ,  Oh Jin Kwon

IPC: B01D19/00

Abstract: A bubble removing unit is disclosed including a body having an inner space, through which a liquid flows, in an interior thereof, a liquid introducing pipe through which the liquid is supplied to the body, a liquid discharging pipe through which the liquid, from which bubbles are removed, is discharged from the body, a bubble discharging pipe through which the bubbles are discharged from the inner space, and a rod-shaped bar situated in the inner space and a length of which extends in a lengthwise direction of the body, wherein a variable cross-section part situated between the liquid introducing pipe and the liquid discharging pipe and a cross-section of which varies along the lengthwise direction of the body is provided in the inner space of the body.

公开(公告)号：US20150380279A1

公开(公告)日：2015-12-31

申请号：US14744563

申请日：2015-06-19

Applicant: SEMES CO., LTD.

Inventor： Oh Jin Kwon ,  Seong-Soo Kim

IPC: H01L21/67

CPC classification number: H01L21/67051

Abstract: Disclosed is a substrate treating apparatus which includes a treating container having a treating space therein and including a plurality of collecting vessels surrounding the treating space and provided such that inlets for inputting a fluid in the treating space are vertically stacked on each other, a support unit supporting a substrate in the treating space, a solution supply unit supplying a treating solution to the substrate supported by the support unit, and elevation units respectively joined with the collecting vessels and lifting up and down the collecting vessels. Each of the elevation units includes a base having a ring shape and joined with a corresponding collecting vessel, an elevation load joined with the base, and a driver lifting up and down the elevation load.

Abstract translation: 公开了一种基板处理装置，其包括处理容器，其中具有处理空间，并且包括围绕处理空间的多个收集容器，并且设置成使得在处理空间中输入流体的入口彼此垂直堆叠，支撑单元 在处理空间中支撑基板，将处理溶液供给到由支撑单元支撑的基板的解决方案供应单元，以及分别与收集容器连接并提升收集容器的升降单元。 每个高度单元包括具有环形并与相应的收集容器连接的基座，与基座接合的仰角载荷和升高和升高升降载荷的驾驶员。

公开(公告)号：US12125720B2

公开(公告)日：2024-10-22

申请号：US17553868

申请日：2021-12-17

Applicant: SEMES CO., LTD.

Inventor： Oh Jin Kwon

IPC: H01L21/67 ,  H05B45/12 ,  H05B45/14 ,  H05B45/52 ,  H01L21/02

CPC classification number: H01L21/67115 ,  H01L21/67023 ,  H05B45/12 ,  H05B45/14 ,  H05B45/52 ,  H01L21/02348

Abstract: The inventive concept provides a light treating member for performing a light treatment on a substrate. The light treating member comprises a circuit unit comprising a plurality of LED module units connected in series, each LED module unit comprising a plurality of identical LED modules connected with each other in parallel.

公开(公告)号：US11705350B2

公开(公告)日：2023-07-18

申请号：US16705065

申请日：2019-12-05

Applicant: SEMES CO., LTD.

Inventor： Sun Mi Kim ,  Jisu Hong ,  Moonsik Choi ,  Oh Jin Kwon

IPC: H01L21/67 ,  H01L21/027

CPC classification number: H01L21/6715 ,  H01L21/0273 ,  H01L21/67051

Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

公开(公告)号：US20220206399A1

公开(公告)日：2022-06-30

申请号：US17404240

申请日：2021-08-17

Applicant: SEMES Co., Ltd.

Inventor： Oh Jin Kwon ,  Ji Su Hong ,  Sun Mi Kim

IPC: G03F7/20

Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.

公开(公告)号：US10991603B2

公开(公告)日：2021-04-27

申请号：US16556025

申请日：2019-08-29

Applicant: SEMES CO., LTD.

Inventor： Oh Jin Kwon ,  Chong-Min Ryu ,  Young Ho Choo

IPC: H01L21/67 ,  H01L21/02

Abstract: A method for treating a substrate includes a mixing step of preparing an ozone treatment fluid containing an ozone gas and a substrate treating step of treating a surface of the substrate using the ozone treatment fluid. In the substrate treating step, light is irradiated to the substrate by a lamp.

公开(公告)号：US09587880B2

公开(公告)日：2017-03-07

申请号：US13905676

申请日：2013-05-30

Applicant: SEMES CO., LTD.

Inventor： Boong Kim ,  Ki Bong Kim ,  Gil Hun Song ,  Oh Jin Kwon

IPC: F26B21/12 ,  F26B5/00 ,  H01L21/67

CPC classification number: F26B21/12 ,  F26B5/005 ,  H01L21/67017 ,  H01L21/67034

Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.

Abstract translation: 提供了一种用于干燥基板的装置和方法。 该装置包括壳体，基板支撑构件，流体供应构件和排出构件。 壳体提供进行干燥处理的空间。 衬底支撑构件设置在壳体中以支撑衬底。 流体供给构件包括用于将超临界状态的处理流体供给到壳体的供给管线。 排出构件包括用于从壳体排出工艺流体的排出管线。 这里，供应管线包括用于以第一供应流量将工艺流体供应到壳体的第一供应管线和设置成以第二供应流量将工艺流体供应到壳体的第二供应管线。