公开(公告)号：US09587880B2

公开(公告)日：2017-03-07

申请号：US13905676

申请日：2013-05-30

Applicant: SEMES CO., LTD.

Inventor： Boong Kim ,  Ki Bong Kim ,  Gil Hun Song ,  Oh Jin Kwon

IPC: F26B21/12 ,  F26B5/00 ,  H01L21/67

CPC classification number: F26B21/12 ,  F26B5/005 ,  H01L21/67017 ,  H01L21/67034

Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.

Abstract translation: 提供了一种用于干燥基板的装置和方法。 该装置包括壳体，基板支撑构件，流体供应构件和排出构件。 壳体提供进行干燥处理的空间。 衬底支撑构件设置在壳体中以支撑衬底。 流体供给构件包括用于将超临界状态的处理流体供给到壳体的供给管线。 排出构件包括用于从壳体排出工艺流体的排出管线。 这里，供应管线包括用于以第一供应流量将工艺流体供应到壳体的第一供应管线和设置成以第二供应流量将工艺流体供应到壳体的第二供应管线。

公开(公告)号：US10232415B2

公开(公告)日：2019-03-19

申请号：US14725515

申请日：2015-05-29

Applicant: Semes Co., Ltd.

Inventor： Gil Hun Song ,  Ki Ryong Choi ,  Young Chol Choi ,  Giu Su Park ,  Sun Yong Park

IPC: H01L21/67 ,  B08B13/00

Abstract: A substrate-treating apparatus is disclosed. The substrate-treating apparatus may include a vessel configured to provide a treatment space therein, a substrate-supporting unit provided in the vessel to support a substrate, and a spraying member configured to spray treatment solution on the substrate loaded on the substrate-supporting unit. The vessel may have an inner side surface, on which at least one texture pattern is formed.

公开(公告)号：US20130318812A1

公开(公告)日：2013-12-05

申请号：US13905676

申请日：2013-05-30

Applicant: SEMES CO., LTD.

Inventor： Boong Kim ,  Ki Bong Kim ,  Gil Hun Song ,  Oh Jin Kwon

IPC: F26B21/12

CPC classification number: F26B21/12 ,  F26B5/005 ,  H01L21/67017 ,  H01L21/67034

Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.

Abstract translation: 提供了一种用于干燥基板的装置和方法。 该装置包括壳体，基板支撑构件，流体供应构件和排出构件。 壳体提供进行干燥处理的空间。 衬底支撑构件设置在壳体中以支撑衬底。 流体供给构件包括用于将超临界状态的处理流体供给到壳体的供给管线。 排出构件包括用于从壳体排出工艺流体的排出管线。 这里，供应管线包括用于以第一供应流量将工艺流体供应到壳体的第一供应管线和设置成以第二供应流量将工艺流体供应到壳体的第二供应管线。

公开(公告)号：US10699918B2

公开(公告)日：2020-06-30

申请号：US15484377

申请日：2017-04-11

Applicant: SEMES CO., LTD.

Inventor： Buyoung Jung ,  Jin Tack Yu ,  Gil Hun Song ,  Sun Yong Park

IPC: H01L21/67 ,  B05B1/14 ,  B08B3/08

Abstract: Provided is a substrate treating apparatus. The substrate treating apparatus comprises: a housing having a treating space therein; a spin head for supporting and rotating a substrate in the treating space; and a chemical supply unit having an injection nozzle for supplying a chemical to the substrate which is supported by the spin head, wherein the injection nozzle comprises a nozzle body, and wherein the nozzle body comprises an inner space for receiving a chemical and minute holes which are connected with the inner space for discharging the chemicals to downward.

公开(公告)号：US20180337070A1

公开(公告)日：2018-11-22

申请号：US15979956

申请日：2018-05-15

Applicant: SEMES CO., LTD.

Inventor： Byungsun Bang ,  Buyoung Jung ,  Jungbong Choi ,  Bong Joo Kim ,  Youngil Lee ,  Gil Hun Song ,  Gui Su Park ,  Kwang Ryul Kim ,  Kwang-Seop Lee ,  Jin Tack Yu

IPC: H01L21/67 ,  H01L21/02 ,  B08B7/00 ,  B08B3/04 ,  B08B3/08 ,  B08B7/04 ,  C03C23/00 ,  B23K26/402

CPC classification number: H01L21/67028 ,  B08B3/041 ,  B08B3/08 ,  B08B7/0042 ,  B08B7/04 ,  B23K26/402 ,  C03C23/0025 ,  H01L21/0206 ,  H01L21/0217

Abstract: Disclosed are a substrate treating apparatus and a substrate treating method. The substrate treating method includes removing a portion of the thin film by irradiating a laser to the substrate, and after the removing of the portion of the thin film, removing the remaining portion of the thin film by supplying a chemical to the substrate.

公开(公告)号：US11594421B2

公开(公告)日：2023-02-28

申请号：US17030514

申请日：2020-09-24

Applicant: SEMES CO., LTD.

Inventor： Youngil Lee ,  Jungbong Choi ,  Seungho Lee ,  Gui Su Park ,  Gil Hun Song ,  Seung Hoon Oh ,  Jonghan Kim

IPC: H01L21/311 ,  H01L21/67 ,  H01L21/02 ,  H01L21/306 ,  H01L21/687

Abstract: A substrate treating apparatus and a substrate treating method are provided. The substrate treating apparatus includes a support member to support a substrate, a treatment liquid nozzle to supply a treatment liquid to the substrate positioned on the support member, and a controller to control the treatment liquid nozzle such that the treatment liquid supplied to the substrate is differently discharged in a low-flow-supply section and a high-flow-supply section in which an average discharge amount per hour is more than an average discharge amount per hour in the low-flow-supply section.

公开(公告)号：US09275852B2

公开(公告)日：2016-03-01

申请号：US13905754

申请日：2013-05-30

Applicant: Semes Co., Ltd.

Inventor： KiBong Kim ,  Boong Kim ,  Gil Hun Song ,  Oh Jin Kwon

IPC: H01L21/00 ,  B08B3/04 ,  F26B5/00 ,  H01L21/02 ,  F26B21/14 ,  H01L21/67 ,  B08B7/00 ,  F26B21/12

CPC classification number: H01L21/02101 ,  B08B7/0021 ,  F26B21/12 ,  F26B21/14 ,  H01L21/67017 ,  H01L21/67034 ,  H01L21/67051

Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.

Abstract translation: 提供了一种使用超临界流体处理基板的装置。 基板处理装置包括壳体，设置在壳体内以支撑基板的支撑构件，超临界流体供应单元，超临界流体被储存在该超临界流体供应单元中，供应管将超临界流体供应单元连接到壳体以调节 从超临界流体供给单元供给到壳体中的超临​​界流体和从供给管分支以排出残留在供给管中的超临界流体的通气管。 打开或关闭排气管的切换阀设置在排气管中。