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公开(公告)号：US20170192558A1
公开(公告)日：2017-07-06
申请号：US15159826
申请日：2016-05-20
发明人： Kerui Xi , Tingting Cui , Zhengfang Xie
CPC分类号： G06F3/044 , G06F3/0412 , G06F3/0416
摘要： The present disclosure discloses an array substrate, touch display panel and touch display device. The array substrate comprises a substrate, a display region and a non-display region surrounding the display region. A driver chip is provided in the non-display region. The display region comprises a plurality of data lines. Each of the plurality of data lines is electrically connected to the driver chip via a respective one of a plurality of first connection lines; and a plurality of touch electrode blocks. The plurality of touch electrode blocks are electrically connected to the driver chip via a plurality of touch signal lines. In the non-display region, the plurality of touch signal lines are not overlapped with the plurality of first connection lines in a direction perpendicular to the substrate.
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公开(公告)号：US11376585B2
公开(公告)日：2022-07-05
申请号：US16457939
申请日：2019-06-29
发明人： Kerui Xi , Xiaohe Li , Feng Qin , Jine Liu , Tingting Cui , Baiquan Lin
IPC分类号： B01L3/00 , G01N27/22 , G09G3/34 , H01L27/12 , H03K17/687
摘要： A drive circuit and its drive method, and a panel and its drive method are provided. The drive circuit includes a step-up unit, a plurality of signal input terminals and a signal output terminal. The step-up unit includes a first module, a second module and a first capacitor. The first module is configured to transmit a signal of a third signal input terminal to a first electrode of the first capacitor. The second module is configured to transmit a signal of a fourth signal input terminal to a second electrode of the first capacitor at a first time period which generates a voltage difference between two electrodes of the first capacitor, and to transmit the signal of the fourth signal input terminal to the second electrode of the first capacitor at a second time period which further increases a signal of the first electrode of the first capacitor.
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13.发明授权公开(公告)号：US11334740B2
公开(公告)日：2022-05-17
申请号：US16910840
申请日：2020-06-24
发明人： Kerui Xi , Tingting Cui , Feng Qin , Xuhui Peng , Linzhi Wang
摘要： Fingerprint recognition circuit, fingerprint recognition structure, fingerprint recognition device, display panel, and display device are provided. The circuit includes: a fingerprint recognition driving transistor; a first capacitor; a driving signal input terminal; and a sensing signal output terminal. The first capacitor has a terminal electrically connected to a gate of the fingerprint recognition driving transistor and another terminal electrically connected to a ground. The driving signal input terminal is electrically connected to an input terminal of the fingerprint recognition driving transistor. An output terminal of the fingerprint recognition driving transistor is electrically connected to the sensing signal output terminal.
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公开(公告)号：US11183463B2
公开(公告)日：2021-11-23
申请号：US16456392
申请日：2019-06-28
发明人： Kerui Xi , Feng Qin , Jine Liu , Xiaohe Li , Tingting Cui
IPC分类号： H01L23/544 , H01L21/02 , H01L21/56 , H01L21/683 , H01L23/31 , H01L23/48
摘要： Chip package method and chip package structure are provided. The chip package method includes: providing a transparent substrate including a first side and a second side; coating the first side of the transparent substrate with an organic polymer material layer; depositing a protective layer on the organic polymer material layer; forming alignment parts on the protective layer; attaching a plurality of chips including metal pins; forming an encapsulating layer on the protective layer; polishing the encapsulating layer to expose the metal pins; forming a first insulating layer; forming first through holes in the first insulating layer; forming metal parts extending along sidewalls of the first through holes; and irradiating the second side of the transparent substrate by a laser to lift off the transparent substrate. The metal parts are insulated from each other and electrically connected to the metal pins.
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15.发明申请公开(公告)号：US20190393245A1
公开(公告)日：2019-12-26
申请号：US16188621
申请日：2018-11-13
发明人： Kerui Xi , Tingting Cui , Feng Qin , Jine Liu , Xiaohe Li
摘要： In an array substrate, an electronic paper display panel and a drive method thereof, and a display device, a display area includes multiple sub-display areas. A plurality of scanning lines in each sub-display area are electrically insulated from each other, corresponding scanning lines in different sub-display areas are electrically connected to each other and display time of each sub-display area is controlled through control signal lines. When a control chip and a flexible circuit board are employed, only a small number of control chips and/or flexible circuit boards, or even only one control chip and/or one flexible circuit board, may drive multiple sub-display areas to display pictures.
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公开(公告)号：US10514813B2
公开(公告)日：2019-12-24
申请号：US15813809
申请日：2017-11-15
发明人： Kerui Xi , Tingting Cui
IPC分类号： G06F3/046 , G06F3/0354 , G06F3/041 , G09G3/34
摘要： An electronic paper display panel, a touch detecting method thereof and an electronic device are provided. The electronic paper display panel includes: a first substrate and a pixel electrode array which is arranged on the first substrate; an inductance coil array disposed between the first substrate and the pixel electrode array and including a plurality of inductance coils arranged in array, each inductance coil has an input terminal and an output terminal; a plurality of driving lines arranged with the plurality of inductance coils respectively, each driving line is electrically connected to the input terminal of the corresponding inductance coil; and a plurality of touch lines arranged with the plurality of inductance coils respectively, each touch line is electrically connected to the output terminal of the corresponding inductance coil.
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公开(公告)号：US12057324B2
公开(公告)日：2024-08-06
申请号：US18090918
申请日：2022-12-29
发明人： Xuhui Peng , Kerui Xi , Tingting Cui , Feng Qin , Jie Zhang
IPC分类号： H01L21/48 , H01L21/56 , H01L23/00 , H01L23/498
CPC分类号： H01L21/4853 , H01L21/486 , H01L21/4896 , H01L21/561 , H01L23/49816 , H01L23/49822 , H01L24/81 , H01L24/96 , H01L24/97 , H01L2924/37001
摘要： A semiconductor package includes a semiconductor element, a wiring structure, an encapsulation structure, and a solder ball. The semiconductor element includes a plurality of pins. A side of the wiring structure is electrically connected to the plurality of pins of the semiconductor element. The wiring structure includes at least two first wiring layers. A first insulating layer is disposed between adjacent two first wiring layers of the at least two first wiring layers. The first insulating layer includes a plurality of first through-holes. The adjacent two first wiring layers are electrically connected to each other through the plurality of first through-holes. The encapsulation structure at least partially surrounds the semiconductor element. The solder ball is located on a side of the wiring structure away from the semiconductor element. The solder ball is electrically connected to the at least two first wiring layers.
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公开(公告)号：US11901324B2
公开(公告)日：2024-02-13
申请号：US17451621
申请日：2021-10-20
发明人： Kerui Xi , Feng Qin , Jine Liu , Xiaohe Li , Tingting Cui
CPC分类号： H01L24/20 , H01L23/3135 , H01L24/13 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/13023 , H01L2224/2101
摘要： Chip package structure is provided. The chip package structure includes: a chip, the chip including metal pins; an organic polymer material layer, the organic polymer material layer being located on a side of the metal pins away from the chip, the organic polymer material layer including a first via hole, and the organic polymer material layer including a first surface away from the chip; metal parts, at least a portion of the metal parts being located in the first via hole, the metal parts and metal pins being electrically connected, the metal parts including a second surface away from the chip, and the second surface and the first surface being flush to each other; and an encapsulating layer, the encapsulating layer being located on a side of the metal parts away from the organic polymer material layer.
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公开(公告)号：US11826755B2
公开(公告)日：2023-11-28
申请号：US17363792
申请日：2021-06-30
发明人： Kerui Xi , Feng Qin , Xiangjian Kong , Jiubin Zhou , Guicai Wang , Yajie Wang , Tingting Cui
CPC分类号： B01L3/502715 , B01L3/50273 , G01N27/228 , G09G3/348 , H01L27/124 , H01L27/1255 , H03K17/687 , H05B45/30 , B01L2400/0427 , G09G2300/0426
摘要： A panel includes a substrate, an array layer and an electrode array layer. The array layer is on a side of the substrate; the electrode array layer is on a side of the array layer away from the substrate; and the array layer includes an active layer, a gate metal layer and a source/drain metal layer. The substrate includes drive units arranged in an array, scan line groups, data lines extending in a second direction; and common signal lines extending in the second direction. The scan line group includes first scan lines and second scan lines, extending in a first direction. The first direction is perpendicular with the second direction. The electrode array layer includes drive electrodes arranged in an array; the drive electrodes correspond to the drive units; and the drive unit includes a first transistor, a second transistor, a third transistor, a first capacitor and a second capacitor.
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公开(公告)号：US11824262B2
公开(公告)日：2023-11-21
申请号：US17361356
申请日：2021-06-29
发明人： Kerui Xi , Xuhui Peng , Feng Qin , Tingting Cui , Baiquan Lin
CPC分类号： H01Q1/005 , H01Q5/371 , H01Q21/065
摘要： Provided are an antenna, a phase shifter, and a communication device. The antenna includes a first metal electrode, a second metal electrode, and a photo-sensitive layer. The first metal electrode and the second metal electrode are respectively located on two opposite sides of the photo-sensitive layer. The first metal electrode includes multiple transmission electrodes. The multiple transmission electrodes are configured to transmit electrical signals. The photo-sensitive layer includes at least one photo-sensitive unit and the at least one photo-sensitive unit overlaps the transmission electrodes. The antenna provides more possibilities for large-scale commercialization.
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