公开(公告)号：US20240332912A1

公开(公告)日：2024-10-03

申请号：US18521217

申请日：2023-11-28

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/40 ,  G02B27/01 ,  H01S5/00

CPC classification number: H01S5/4075 ,  G02B27/0172 ,  H01S5/0064 ,  H01S5/4093 ,  G02B2027/0178

Abstract: A laser assembly includes a plurality of laser light sources, a plurality of laser light source bases having main surfaces on which the laser light sources are placed and arranged apart from each other, an optical waveguide layer having at least an optical waveguide configured to guide laser light output from the laser light sources, an optical waveguide substrate having a main surface on which the optical waveguide layer is provided, and a plurality of metal films (M) configured to bond the laser light source bases with the optical waveguide substrate. The plurality of metal films (M) correspond to the plurality of laser light source bases and are arranged apart from each other.

公开(公告)号：US20240283215A1

公开(公告)日：2024-08-22

申请号：US18524007

申请日：2023-11-30

Applicant: TDK CORPORATION

Inventor： Takashi HONDA ,  Takashi AOYAGI ,  Makoto FUKUDA ,  Tsuyoshi KOMAKI ,  Ryohei FUKUZAKI

IPC: H01S5/02315 ,  H01S5/00

CPC classification number: H01S5/02315 ,  H01S5/0071

Abstract: What is provided is a subcarrier and a laser module in which, when an optical semiconductor element is formed on the subcarrier, blocking of an irradiation surface of the optical semiconductor element by a structure formed by melting is curbed.
This subcarrier is a subcarrier for a laser module including a wafer portion that is constituted of a base and a protective layer formed on a surface of the base, a first metal layer that is formed on the protective layer, a eutectic layer that is formed on the first metal layer, and a second metal layer that is formed on the eutectic layer. The wafer portion has a recessed portion formed in a region overlapping the eutectic layer in a width direction, that is, a region on an outward side of the first metal layer in a longitudinal direction.

公开(公告)号：US20240126015A1

公开(公告)日：2024-04-18

申请号：US18377602

申请日：2023-10-06

Applicant: TDK CORPORATION

Inventor： Hajime UTSUNOMIYA ,  Yasuhiro TAKAGI ,  Hiroki HARA ,  Atsushi SHIMURA ,  Jiro YOSHINARI ,  Takashi KIKUKAWA ,  Tsuyoshi KOMAKI ,  Hideaki FUKUZAWA

IPC: G02B6/293

CPC classification number: G02B6/29344

Abstract: This optical coupler for coupling a plurality of visible light beams having different wavelengths includes: a substrate made of a material different from lithium niobate; and an optical coupling function layer formed on a main surface of the substrate. The optical coupling function layer includes: two multimode-interference-type optical coupling parts; optical-input-side waveguides and an optical-output-side waveguide connected to one multimode-interference-type optical coupling part, and optical-input-side waveguides and an optical-output-side waveguide connected to the other multimode-interference-type optical coupling part. The multimode-interference-type optical coupling parts, the optical-input-side waveguides, and the optical-output-side waveguides are made of a lithium niobate film.