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公开(公告)号:US10856399B2
公开(公告)日:2020-12-01
申请号:US16689848
申请日:2019-11-20
Applicant: TDK Electronics AG
Inventor: Pavol Kudela , Franz Rinner , Markus Puff
IPC: H01L41/107 , H05H1/24 , H01L41/04
Abstract: A device for generating an atmospheric-pressure plasma is disclosed. In an embodiment the device includes a piezoelectric transformer comprising an input region and an output region, wherein the input region is designed to convert an applied alternating voltage into a mechanical oscillation, wherein the output region is designed to convert a mechanical oscillation into a voltage, and wherein the output region adjoins the input region in a longitudinal direction, a contact element fastened to the piezoelectric transformer, the contact element being designed to apply the alternating voltage to the input region and a holder, wherein the contact element is connected to the holder by a form-fit connection, in such a manner that a movement of the piezoelectric transformer in the longitudinal direction, relative to the holder, is prevented.
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公开(公告)号:US10714458B2
公开(公告)日:2020-07-14
申请号:US16099126
申请日:2017-03-30
Applicant: TDK Electronics AG
Inventor: Thomas Feichtinger , Franz Rinner
IPC: H05K1/00 , H01L25/075 , H05K1/02 , H05K1/18 , H01L25/16
Abstract: A multi-LED system includes a carrier; and a plurality of light-emitting diodes arranged on the carrier, wherein the carrier has a main body, and a plurality of electrical components are embedded in the main body.
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公开(公告)号:US11875925B2
公开(公告)日:2024-01-16
申请号:US17594233
申请日:2020-02-25
Applicant: TDK Electronics AG
Inventor: Alfred Hofrichter , Franz Rinner
CPC classification number: H01C7/008 , H01C1/144 , H01C1/1406 , H01C1/1413 , H01C7/10 , H01G2/14
Abstract: An electrical component comprises a main body and at least one external electrode that is fastened by a connecting material to the main body. The main body and the external electrode have different coefficients of thermal expansion that determine a critical temperature which, when exceeded, results in a connection between the main body and the external electrode experiencing mechanical stresses that lead to damage to the component. The connecting material has a melting point which is lower than a critical temperature.
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公开(公告)号:US11387045B2
公开(公告)日:2022-07-12
申请号:US16976026
申请日:2019-02-15
Applicant: TDK Electronics AG
Inventor: Markus Koini , Thomas Wippel , Franz Rinner
Abstract: A multilayer component is disclosed. In an embodiment, a multilayer component includes a main body with first and second inner electrodes, wherein the first and second electrodes are alternately arranged in an interior of the main body and electrically insulated from one another and an outer contact configured to provide external contact, wherein the outer contact comprises at least two first strip-shaped conductor tracks arranged on a first surface of the main body, wherein each first conductor track is electrically connected to one of the first inner electrodes, wherein the outer contact comprises at least two second strip-shaped conductor tracks arranged on a second surface of the main body, wherein each second conductor track is electrically connected to one of the second inner electrodes, and wherein embossings in adjacent first conductor tracks or second conductor tracks are arranged offset with respect to one another.
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15.
公开(公告)号:US20200083570A1
公开(公告)日:2020-03-12
申请号:US16616793
申请日:2018-05-30
Applicant: TDK Electronics AG
Inventor: Stefan Koestner , Masahiro Oishi , Franz Rinner
Abstract: A circuit board having a power supply, an electrical device having a circuit board, and a method for producing a circuit board are disclosed. In an embodiment a circuit board includes a power supply, a carrier substrate and an energy store with a first layer stack having a first electrode layer with a first electrode, a second electrode layer with a second electrode, and an electrolyte layer arranged therebetween, which has an electrolyte, wherein the first electrode, the second electrode and the electrolyte are solid states.
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公开(公告)号:US20190210065A1
公开(公告)日:2019-07-11
申请号:US16331514
申请日:2017-09-06
Applicant: TDK Electronics AG
Inventor: Franz Rinner , Alexander Melischnig
IPC: B06B1/06 , H01L41/09 , H01L41/047 , G06F3/01
CPC classification number: B06B1/0603 , B06B1/0611 , G06F3/016 , G10K9/125 , H01L41/0471 , H01L41/0933
Abstract: An apparatus for producing haptic feedback and an electronic device are disclosed. In an embodiment an apparatus includes a piezoelectric actuator and a mechanical structure, wherein the piezoelectric actuator is configured to modify its extension in a first direction, and wherein the mechanical structure is configured to deform as a result of a change in the extension of the piezoelectric actuator in such a way that an area of the mechanical structure is moved in relation to the piezoelectric actuator in a second direction which is perpendicular to the first direction.
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公开(公告)号:US20220406493A1
公开(公告)日:2022-12-22
申请号:US17638635
申请日:2021-07-26
Applicant: TDK Electronics AG
Inventor: Hermann Grünbichler , Jaromir Kotzurek , Franz Rinner
IPC: H01C7/10 , H01C7/102 , H01C7/112 , H01C17/065 , H01C7/18
Abstract: In an embodiment a method for manufacturing a multilayer varistor includes providing a first ceramic powder for producing a first ceramic material and at least one second ceramic powder for producing a second ceramic material, wherein the ceramic powders differ from each other in concentration of monovalent elements X+ by 50 ppm≤Δc(X+)≤5000 ppm, wherein X+=(Li+, Na+, K+ or Ag+), and wherein Δc denotes a maximum concentration difference occurring between an active region and a near-surface region of the multilayer varistor, slicking of the ceramic powders and forming of green films, partially printing of a part of the green films with a metal paste to form inner electrodes, stacking printed and unprinted green films, laminating, decarbonizing and sintering the green films and applying outer electrodes.
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公开(公告)号:US11383272B2
公开(公告)日:2022-07-12
申请号:US16331514
申请日:2017-09-06
Applicant: TDK Electronics AG
Inventor: Franz Rinner , Alexander Melischnig
IPC: B06B1/06 , G06F3/01 , G10K9/125 , H01L41/047 , H01L41/09
Abstract: An apparatus for producing haptic feedback and an electronic device are disclosed. In an embodiment an apparatus includes a piezoelectric actuator and a mechanical structure, wherein the piezoelectric actuator is configured to modify its extension in a first direction, and wherein the mechanical structure is configured to deform as a result of a change in the extension of the piezoelectric actuator in such a way that an area of the mechanical structure is moved in relation to the piezoelectric actuator in a second direction which is perpendicular to the first direction.
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公开(公告)号:US20200287405A1
公开(公告)日:2020-09-10
申请号:US16607272
申请日:2018-05-16
Applicant: TDK Electronics AG
Inventor: Franz Rinner , Alexander Melischnig , Johann Pichler , Masahiro Oishi
Abstract: An electrical circuit and a method for using the electrical circuit are disclosed. In an embodiment an electrical circuit includes an energy transducer, an energy storage system, a first terminal and a second terminal, wherein the energy transducer is electrically coupled with the first and second terminals, wherein the energy storage system is electrically coupled with the first and second terminals, wherein the energy transducer is configured to charge the energy storage system at discrete time intervals, wherein the energy storage system is configured to provide energy continuously, wherein the energy transducer includes a solar cell, and wherein the energy storage system includes a solid-state storage battery.
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公开(公告)号:US10748711B2
公开(公告)日:2020-08-18
申请号:US16090200
申请日:2017-02-23
Applicant: EPCOS AG
Inventor: Juergen Konrad , Markus Koini , Franz Rinner
Abstract: The present invention relates to a capacitor assembly (1) which comprises at least one ceramic multilayer capacitor (2) comprising ceramic layers (4) and first and second electrodes (5a, 5b) arranged therebetween, and a base (3). The base (3) comprises a substrate (9) and conductor tracks (10a, 10b), wherein the conductor tracks (10a, 10b) lead from a top side (11) of the substrate (9) said top side facing toward the multilayer capacitor (2), to an underside (12) of the substrate (9), said underside facing away from the multilayer capacitor (2). The multilayer capacitor (2) is mechanically secured on the base (3). The first electrodes (5a) and the second electrodes (5c) are electrically contacted with the conductor tracks (10a, 10b).
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