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    COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS
    11.
    发明申请
    COVERS FOR SEMICONDUCTOR PACKAGE COMPONENTS 有权

    公开(公告)号：US20220181223A1

    公开(公告)日：2022-06-09

    申请号：US17116936

    申请日：2020-12-09

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

    IPC: H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

    Abstract: In some examples, a semiconductor package comprises a semiconductor die; an operational component on an active surface of the semiconductor die; and a cover coupled to the active surface of the semiconductor die and covering the operational component. The cover comprises a monolithic structure including a vertical portion and a horizontal portion. A hollow area is between the cover and the operational component. The package also includes a mold compound covering the semiconductor die and the cover.

    METAL-LINED PACKAGE CAVITY FOR FLUID SENSORS
    15.
    发明申请
    METAL-LINED PACKAGE CAVITY FOR FLUID SENSORS 有权

    公开(公告)号：US20250076093A1

    公开(公告)日：2025-03-06

    申请号：US18459056

    申请日：2023-08-31

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Sebastian MEIER ,  Rujuta MUNJE ,  Tobias Bernhard FRITZ ,  Sreenivasan Kalyani KODURI

    IPC: G01F1/64 ,  G01F1/002

    Abstract: In examples, a sensing device comprises a semiconductor die including a device side and a fluid sensor in the device side. The device comprises a metal ring forming an opening over the fluid sensor, the metal ring having a top surface, a bottom surface, and an inner surface extending between the top surface and the bottom surface, and the bottom surface being on the device side. At least a portion of the inner surface abuts the device side being plated with a noble metal. The device includes a mold compound covering the semiconductor die and a first portion of the metal ring, in which a second portion of the metal ring having the top surface protrudes out of the mold compound and provides at least one of a cartridge interface or a tube interface.

    SENSOR PACKAGE CAVITIES WITH POLYMER FILMS
    16.
    发明申请
    SENSOR PACKAGE CAVITIES WITH POLYMER FILMS 有权

    公开(公告)号：US20230030266A1

    公开(公告)日：2023-02-02

    申请号：US17937194

    申请日：2022-09-30

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

    IPC: H01L23/31 ,  H01L23/29

    Abstract: In examples, a sensor package includes a semiconductor die, a sensor on the semiconductor die, and a mold compound covering the semiconductor die. The mold compound includes a sensor cavity over the sensor. The sensor package includes a polymer film member on the sensor and circumscribed by a wall of the mold compound forming the sensor cavity. The polymer film member is exposed to an exterior environment of the sensor package.

    PROXIMITY SENSOR
    17.
    发明申请
    PROXIMITY SENSOR 有权

    公开(公告)号：US20220189912A1

    公开(公告)日：2022-06-16

    申请号：US17121198

    申请日：2020-12-14

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Sreenivasan Kalyani KODURI ,  Leslie Edward STARK

    IPC: H01L25/04 ,  H01L33/62 ,  G01S17/08 ,  H01L25/075

    Abstract: A method of manufacturing a sensor device includes obtaining a semiconductor die structure comprising a transmitter and a receiver. Then, a first sacrificial stud is affixed to the transmitter and a second sacrificial stud is affixed to the receiver. The semiconductor die is affixed to a lead frame, and pads on the semiconductor die structure are wirebonded to the lead frame. The lead frame, the semiconductor die structure, and the wirebonds are encapsulated in a molding compound, while the tops of the first and second sacrificial studs are left exposed. The first and second sacrificial studs prevent the molding compound from encapsulating the transmitter and the receiver, and are removed to expose the transmitter in a first cavity and the receiver in a second cavity. In some examples, the semiconductor die structure includes a first semiconductor die comprising the transmitter and a second semiconductor die comprising the receiver.

    NANOWIRE INTERFACES
    19.
    发明申请
    NANOWIRE INTERFACES 审中-公开

    公开(公告)号：US20200321303A1

    公开(公告)日：2020-10-08

    申请号：US16843580

    申请日：2020-04-08

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Sreenivasan Kalyani KODURI ,  Benjamin Stassen COOK ,  Ralf Jakobskrueger MUENSTER

    IPC: H01L23/00 ,  H01L23/495 ,  H01L21/78 ,  H01L23/31

    Abstract: In some examples, a system comprises a first component having a first surface, a first set of nanoparticles coupled to the first surface, and a first set of nanowires extending from the first set of nanoparticles. The system also comprises a second component having a second surface, a second set of nanoparticles coupled to the second surface, and a second set of nanowires extending from the second set of nanoparticles. The system further includes an adhesive positioned between the first and second surfaces. The first and second sets of nanowires are positioned within the adhesive.

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