公开(公告)号：US20240096767A1

公开(公告)日：2024-03-21

申请号：US17945835

申请日：2022-09-15

Applicant: Texas Instruments Incorporated

Inventor： Hank Sung ,  Dok Won Lee ,  Wai Lee ,  Sreenivasan Koduri

IPC: H01L23/495 ,  H01L21/48 ,  H01L23/00

CPC classification number: H01L23/49568 ,  H01L21/4825 ,  H01L23/49513 ,  H01L23/49555 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  G01R15/202

Abstract: An electronic device includes a metal heat slug, a semiconductor die, and a package structure. The metal heat slug has a first portion, a second portion, and a third portion, the second portion is spaced apart from the first portion, and the third portion connects the first and second portions. The semiconductor die is attached to the third portion of the metal heat slug to measure a current of the third portion of the metal heat slug, and the package structure encloses the semiconductor die and the third portion of the metal heat slug and exposes sides of the first and second portions of the metal heat slug.

公开(公告)号：US11282770B2

公开(公告)日：2022-03-22

申请号：US17039080

申请日：2020-09-30

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Nazila Dadvand ,  Sreenivasan Koduri

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  C25D3/38

Abstract: A leadless packaged semiconductor device includes a metal substrate having at least a first through-hole aperture having a first outer ring and a plurality of cuts through the metal substrate to define spaced apart metal pads on at least two sides of the first through-hole aperture. A semiconductor die that has a back side metal (BSM) layer on its bottom side and a top side with circuitry coupled to bond pads is mounted top side up on the first outer ring. A metal die attach layer is directly between the BSM layer and walls of the metal substrate bounding the first through-hole aperture that provides a die attachment that fills a bottom portion of the first through-hole aperture. Bond wires are between metal pads and the bond pads. A mold compound is also provided including between adjacent ones of the metal pads.

公开(公告)号：US20210013133A1

公开(公告)日：2021-01-14

申请号：US17039080

申请日：2020-09-30

Applicant: Texas Instruments Incorporated

Inventor： Benjamin Stassen Cook ,  Nazila Dadvand ,  Sreenivasan Koduri

IPC: H01L23/495 ,  H01L23/00 ,  H01L23/31 ,  C25D3/38

Abstract: A leadless packaged semiconductor device includes a metal substrate having at least a first through-hole aperture having a first outer ring and a plurality of cuts through the metal substrate to define spaced apart metal pads on at least two sides of the first through-hole aperture. A semiconductor die that has a back side metal (BSM) layer on its bottom side and a top side with circuitry coupled to bond pads is mounted top side up on the first outer ring. A metal die attach layer is directly between the BSM layer and walls of the metal substrate bounding the first through-hole aperture that provides a die attachment that fills a bottom portion of the first through-hole aperture. Bond wires are between metal pads and the bond pads. A mold compound is also provided including between adjacent ones of the metal pads.

公开(公告)号：US20150014832A1

公开(公告)日：2015-01-15

申请号：US13939276

申请日：2013-07-11

Applicant: Texas Instruments Incorporated

Inventor： Reynaldo Corpuz Javier ,  Sreenivasan Koduri

IPC: H01L23/495 ,  H01L23/00

CPC classification number: H01L24/85 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05664 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/4847 ,  H01L2224/48624 ,  H01L2224/48639 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48724 ,  H01L2224/48739 ,  H01L2224/48744 ,  H01L2224/48747 ,  H01L2224/48764 ,  H01L2224/48824 ,  H01L2224/48839 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/73265 ,  H01L2224/83855 ,  H01L2224/85181 ,  H01L2224/85439 ,  H01L2224/85444 ,  H01L2224/85464 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/1032 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/1062 ,  H01L2924/15162 ,  H01L2924/181 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/0665 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2924/206

Abstract: A semiconductor device (100) comprises a semiconductor chip (310) attached to the pad (302) of a planar leadframe and connected by bonding wires (411) to two leads (403) of the leadframe. The device further includes a plastic body (130) encapsulating chip and wires, the body shaped as a pentahedron with two sides (101, 102) touching at right angle, opposite body ends formed by parallel planes configured as right-angle triangles. The pad (302) and the two leads (303) are exposed from the plastic surface at one body end in order to be operable as solderable device pins positioned in the corners of the triangle.

Abstract translation: 半导体器件（100）包括附接到平面引线框架的焊盘（302）并通过接合引线（411）连接到引线框架的两个引线（403）的半导体芯片（310）。 该装置还包括封装芯片和电线的塑料本体（130），该主体成形为五面体，两面（101,102）直角接触，相对的主体端部由构成为直角三角形的平行平面形成。 衬垫（302）和两个引线（303）在一个主体端处从塑料表面露出，以便作为位于三角形角落中的可焊接的器件引脚操作。