OSCILLATOR WITH ACTIVE INDUCTOR
    13.
    发明公开

    公开(公告)号:US20240283404A1

    公开(公告)日:2024-08-22

    申请号:US18653277

    申请日:2024-05-02

    CPC classification number: H03B5/24 G01S13/88 H03H9/02007

    Abstract: An apparatus comprises a piezoelectric resonator, a first active inductor circuit, and a second active inductor circuit. The piezoelectric resonator includes a first resonator terminal and a second resonator terminal. The first active inductor circuit is coupled between the first resonator terminal and a power supply terminal, the first active inductor circuit having a first impedance that reduces with a first frequency where the first frequency is at or above 1 GHz. The second active inductor circuit is coupled between the second resonator terminal and the power supply terminal, the second active inductor circuit having a second impedance that reduces with a second frequency where the second frequency is at or above 1 GHz.

    GAIN INVARIANT BIDIRECTIONAL PHASE SHIFTER
    14.
    发明公开

    公开(公告)号:US20240072402A1

    公开(公告)日:2024-02-29

    申请号:US17899445

    申请日:2022-08-30

    CPC classification number: H01P1/185 H01P5/18 H03F3/245 H03F2200/451

    Abstract: A bidirectional phase shifter includes a differential quadrature hybrid coupler, a switch network, and a differential reflection type phase shifter (RTPS). The differential quadrature hybrid coupler includes a first phase input/output (I/O) port, an inverse first phase I/O port, a second phase I/O port, and an inverse second phase I/O port. The switch network is coupled to the first phase I/O port, the inverse first phase I/O port, the second phase I/O port, and the inverse second phase I/O port. The differential RTPS including a differential I/O port coupled to the switch network.

    ON-CHIP DIRECTIONAL COUPLER
    15.
    发明申请

    公开(公告)号:US20220407210A1

    公开(公告)日:2022-12-22

    申请号:US17349022

    申请日:2021-06-16

    Abstract: An on-chip directional coupler includes a first linear conductive trace, a second linear conductive trace, and a conductive loop. The first linear conductive trace including an end and a coupled port. The second linear conductive trace is spaced apart from and parallel to the first linear conductive trace. The second linear conductive trace includes an end and an isolated port. The conductive loop includes a first end conductively coupled to the end of the first linear conductive trace, and a second end conductively coupled to the end of the second linear conductive trace.

    INTEGRATED CIRCUIT BACKSIDE RADIATION/RESONATOR

    公开(公告)号:US20220406738A1

    公开(公告)日:2022-12-22

    申请号:US17732822

    申请日:2022-04-29

    Abstract: An integrated circuit (IC) includes a semiconductor substrate having a first surface and a second surface opposite the first surface. A through wafer trench (TWT) extends from the first surface of the semiconductor substrate to the second surface of the semiconductor substrate. Dielectric material is in the TWT. An interconnect region has layers of dielectric on the first surface of the substrate. The interconnect region has a conductive transmit patch. An antenna is formed, at least in part, by the dielectric material in the TWT and the transmit patch in the interconnect region. The antenna is configured to transmit or receive electromagnetic radiation between the transmit patch and the second surface of the semiconductor substrate through the dielectric material within the trench.

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