公开(公告)号：US20230094448A1

公开(公告)日：2023-03-30

申请号：US17490223

申请日：2021-09-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Baher HAROUN ,  Swaminathan SANKARAN ,  Argyrios DELLIS ,  Sachin KALIA

IPC: H03B1/02 ,  H03B5/32 ,  H05B1/02 ,  H05B3/06

Abstract: In an example, a system includes a BAW resonator. The system also includes a first heater configured to heat the BAW resonator, where the first heater is controlled by a first control loop. The system includes a circuit coupled to the BAW resonator. The system also includes a second heater configured to heat the circuit, where the second heater is controlled by a second control loop.

公开(公告)号：US20230035350A1

公开(公告)日：2023-02-02

申请号：US17389935

申请日：2021-07-30

Applicant: Texas Instruments Incorporated

Inventor： Bichoy BAHR ,  Michael Henderson PERROTT ,  Baher HAROUN ,  Swaminathan SANKARAN

IPC: H03B5/32 ,  G06F1/04

Abstract: An oscillator circuit includes a first BAW oscillator, a first coupling stage, a second BAW oscillator, and a second coupling stage. The first BAW oscillator is configured to generate a first output signal at a frequency. The first coupling stage is coupled to the first BAW oscillator, and is configured to amplify the first output signal. The second BAW oscillator is coupled to the first coupling stage, and is configured to generate a second output signal at the frequency. The second output signal differs in phase from the first output signal. The second coupling stage is coupled to the first BAW oscillator and the second BAW oscillator, and is configured to amplify the second output signal and drive the first BAW oscillator.

公开(公告)号：US20240006466A1

公开(公告)日：2024-01-04

申请号：US17855346

申请日：2022-06-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Swaminathan SANKARAN ,  Benjamin COOK ,  Baher S. HAROUN

IPC: H01L49/02 ,  H01F27/36 ,  H03B5/32

CPC classification number: H01L28/10 ,  H01F27/36 ,  H03B5/326

Abstract: An integrated circuit includes a semiconductor substrate, a metal layer, an inductor in the metal layer, and a shield above the inductor. The metal layer is a first metal layer; and the shield may be is in a second metal layer above the first metal layer. The shield may include a plurality of metal strips substantially perpendicular to metal lines of the inductor.

公开(公告)号：US20230271222A1

公开(公告)日：2023-08-31

申请号：US17682576

申请日：2022-02-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Yanbo HE ,  Bichoy BAHR ,  Swaminathan SANKARAN

IPC: B06B1/02

CPC classification number: B06B1/0292

Abstract: In accordance with at least one example of the description, a device includes a substrate and a linear array of transducer elements across the substrate and forming a cavity region. The cavity region is bounded by a first termination region and a second termination region. The linear array of transducer elements includes a transducer element having a front-end-of-line (FEOL) portion that is formed by a FEOL process and a back-end-of-line (BEOL) portion that is formed by an n-layer BEOL process. The BEOL portion of the transducer element includes a ferroelectric capacitor and a conductive element. The conductive element is formed by metal layer-n of the n-layer BEOL process, where n denotes an integer greater than 3.

公开(公告)号：US20210214212A1

公开(公告)日：2021-07-15

申请号：US17135305

申请日：2020-12-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR ,  Benjamin COOK

IPC: B81B3/00 ,  B81C1/00

Abstract: A device includes a substrate having first and second layers and an insulator layer between the first and second layers. A microelectromechanical system (MEMS) structure is provide on a portion of the second layer. A trench is formed in the second layer and around at least a part of a periphery of the portion of the second layer. An undercut is formed in the insulator layer and adjacent to the portion of the second layer. The undercut separates the portion of the second layer from the first layer. First and second pinholes extend from a plane of the insulator layer and in the first layer. The first and second pinholes are in fluid communication with the undercut and the trench.

公开(公告)号：US20200212872A1

公开(公告)日：2020-07-02

申请号：US16232259

申请日：2018-12-26

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Baher HAROUN ,  Bichoy BAHR

IPC: H03H9/02 ,  H03H9/17

Abstract: A voltage sensor device includes an oscillator unit, the oscillator unit having a tunable bulk acoustic wave (BAW) resonator device and an oscillator core. The voltage sensor device also includes a frequency analyzer configured to obtain frequency measurements for the oscillator unit and to determine a voltage sense value based on a comparison of at least some of the obtained frequency measurements. The voltage sensor device also includes an output interface configured to store or output voltage sense values determined by the frequency analyzer.

公开(公告)号：US20250096449A1

公开(公告)日：2025-03-20

申请号：US18966756

申请日：2024-12-03

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Benjamin Stassen COOK ,  Scott R. SUMMERFELT

IPC: H01P3/12 ,  H01L23/31 ,  H01L25/18 ,  H05K1/18

Abstract: In some examples, a package includes a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry in the first surface. The package also includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors and a connector coupling the circuitry to the acoustic waveguide.

公开(公告)号：US20240283404A1

公开(公告)日：2024-08-22

申请号：US18653277

申请日：2024-05-02

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Udit RAWAT ,  Bichoy BAHR ,  Swaminathan SANKARAN

IPC: H03B5/24 ,  G01S13/88 ,  H03H9/02

CPC classification number: H03B5/24 ,  G01S13/88 ,  H03H9/02007

Abstract: An apparatus comprises a piezoelectric resonator, a first active inductor circuit, and a second active inductor circuit. The piezoelectric resonator includes a first resonator terminal and a second resonator terminal. The first active inductor circuit is coupled between the first resonator terminal and a power supply terminal, the first active inductor circuit having a first impedance that reduces with a first frequency where the first frequency is at or above 1 GHz. The second active inductor circuit is coupled between the second resonator terminal and the power supply terminal, the second active inductor circuit having a second impedance that reduces with a second frequency where the second frequency is at or above 1 GHz.

公开(公告)号：US20240039500A1

公开(公告)日：2024-02-01

申请号：US17877206

申请日：2022-07-29

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hakhamanesh MANSOORZARE ,  Ting-Ta YEN ,  Jeronimo SEGOVIA-FERNANDEZ ,  Bichoy BAHR

IPC: H03H3/007 ,  H03H9/10

CPC classification number: H03H3/0076 ,  H03H9/1057 ,  H03H2009/02283

Abstract: A micro-mechanical resonator die includes: micro-mechanical resonator die layers; a cavity formed in at least one of the micro-mechanical resonator die layers; and a micro-mechanical resonator suspended in the cavity. The micro-mechanical resonator includes: a base; a first resonator portion extending from the base along a first plane; and a second resonator portion extending from the base along a second plane. The first resonator portion is configured to operate in an out-of-plane flexural mode that displaces at least part of the first resonator portion out of the first plane. The second resonator portion is configured to operate in an out-of-plane flexural mode that displaces at least part of the second resonator portion out of the second plane and out-of-phase relative to the first resonator portion.

公开(公告)号：US20220399628A1

公开(公告)日：2022-12-15

申请号：US17347365

申请日：2021-06-14

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Bichoy BAHR ,  Benjamin Stassen COOK ,  Scott R. SUMMERFELT

IPC: H01P3/12 ,  H05K1/18 ,  H01L25/18 ,  H01L23/31

Abstract: In some examples, a package comprises a semiconductor die having a first surface and a second surface opposing the first surface, the semiconductor die including circuitry formed in the first surface. The package includes an acoustic waveguide in the semiconductor die, the acoustic waveguide including an array of capacitors. The array of capacitors includes a transducer portion and a diffraction grating portion. The transducer portion is configured to convert signals between electrical signals and acoustic waves, and the diffraction grating portion is configured to direct the acoustic waves toward and receive the acoustic waves from the second surface.