公开(公告)号：US20220324702A1

公开(公告)日：2022-10-13

申请号：US17514282

申请日：2021-10-29

Applicant: Texas Instruments Incorporated

Inventor： Scott Robert SUMMERFELT ,  Adam Joseph FRUEHLING

IPC: B81C1/00 ,  B81B7/00 ,  H01H45/02

Abstract: A micro-electromechanical system (MEMS) device includes a moveable element within a cavity. The MEMS device also includes a first layer over the cavity, the first layer having a first hole and a second hole. The first hole has a first diameter. The second hole has a second diameter. The second diameter is larger than the first diameter, and the second hole is farther from the moveable element than the first hole. The first hole is sealed with a first dielectric material. The second hole is sealed with a second dielectric material. The cavity filled with a gas at a pressure of at least approximately 10 torr.

公开(公告)号：US20190074233A1

公开(公告)日：2019-03-07

申请号：US15697505

申请日：2017-09-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen COOK

IPC: H01L23/08 ,  B81C1/00 ,  H01L21/768

CPC classification number: H01L23/08 ,  B81B2203/0315 ,  B81C1/00047 ,  B81C1/00333 ,  B81C2203/0136 ,  B81C2203/0145 ,  G04F5/14 ,  H01L21/76898

Abstract: A method for forming a sealed cavity includes bonding a non-conductive structure to a first substrate to form a non-conductive aperture into the first substrate. On a surface of the non-conductive structure opposite the first substrate, the method includes depositing a first metal layer. The method further includes patterning a first iris in the first metal layer, depositing a first dielectric layer on a surface of the first metal layer opposite the non-conductive structure, and patterning an antenna on a surface of the first dielectric layer opposite the first metal layer. The method also includes creating a cavity in the first substrate, depositing a second metal layer on a surface of the cavity, patterning a second iris in the second metal layer, and bonding a second substrate to a surface of the first substrate opposite the non-conductive structure to thereby seal the cavity.

公开(公告)号：US20250035919A1

公开(公告)日：2025-01-30

申请号：US18908271

申请日：2024-10-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  James Norman HALL

IPC: G02B26/08 ,  G02B26/06 ,  H02N1/00

Abstract: A microelectromechanical systems (MEMS) device includes a base plate including a first electrode and a second electrode and a top layer. The MEMS device also includes a perforated hinge plate supporting the top layer. The perforated hinge plate includes first and second flexural arms permitting the perforated hinge plate and the top layer to move relative to the base plate. The perforated hinge plate has a first perforation that includes the first electrode and has a footprint that is larger than a footprint of the first electrode, and the perforated hinge plate has a second perforation that includes the second electrode and has a footprint that is larger than a footprint of the second electrode. Additionally, the MEMS device includes a first support post to which the first flexural arm is connected and a second support post to which the second flexural arm is connected.

公开(公告)号：US20210215928A1

公开(公告)日：2021-07-15

申请号：US17114369

申请日：2020-12-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  James Norman HALL

IPC: G02B26/08 ,  H02N1/00 ,  G02B26/06

Abstract: A phase light modulator includes a base plate, a mirror, a perforated hinge plate, and first second support posts. The perforated hinge plate supports the mirror. The perforated hinge plate has first and second flexural arms. The perforated hinge plate is configured to move toward or away from the base plate based on application of a potential difference between the base plate and the perforated hinge plate. The first flexural arm is connected to the first support posts, and the second flexural arm is connected to the second support post.

公开(公告)号：US20200207611A1

公开(公告)日：2020-07-02

申请号：US16813967

申请日：2020-03-10

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen Cook ,  James F. HALLAS ,  Randy LONG

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14 ,  G01M3/32 ,  G01L9/00

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

公开(公告)号：US20210199598A1

公开(公告)日：2021-07-01

申请号：US16730838

申请日：2019-12-30

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Argyrios DELLIS ,  Juan HERBSOMMER ,  Adam Joseph FRUEHLING

IPC: G01N22/00

Abstract: A system includes first and second gas cells each comprising a respective sealed interior waveguide; first transmit antenna coupled to the first gas cell to provide a first electromagnetic wave to the first gas cell along a first direction; second transmit antenna coupled to the first gas cell to provide a second electromagnetic wave to the first gas cell along a second direction opposite the first direction; third transmit antenna coupled to the second gas cell to provide a third electromagnetic wave to the second gas cell; first receive antenna coupled to the first gas cell to generate a first signal indicative of an amount of energy in first electromagnetic wave; second receive antenna coupled to the second gas cell to generate a second signal indicative of an amount of energy in second electromagnetic wave; and processor to calculate a background-free signal based on a difference between first and second signals.

公开(公告)号：US20190077656A1

公开(公告)日：2019-03-14

申请号：US15698706

申请日：2017-09-08

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Benjamin Stassen COOK ,  Kurt WACHTLER ,  Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS

IPC: B81C1/00 ,  G04F5/14

CPC classification number: B81C1/00793 ,  B81B3/0089 ,  B81B7/0038 ,  B81B2201/058 ,  B81B2203/0315 ,  G04F5/14 ,  H01L21/00

Abstract: Methods for depositing a measured amount of a species in a sealed cavity. In one example, a method for depositing molecules in a sealed cavity includes depositing a selected number of microcapsules in a cavity. Each of the microcapsules contains a predetermined amount of a first fluid. The cavity is sealed after the microcapsules are deposited. After the cavity is sealed the microcapsules are ruptured to release molecules of the first fluid into the cavity.

公开(公告)号：US20190071306A1

公开(公告)日：2019-03-07

申请号：US15697525

申请日：2017-09-07

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen COOK ,  Adam Joseph FRUEHLING

IPC: B81C1/00 ,  H01L23/08 ,  H01L21/768

CPC classification number: B81C1/00047 ,  B81B2203/0315 ,  B81C1/00539 ,  G04F5/14 ,  H01L21/76898 ,  H01L23/08

Abstract: An illustrate method (and device) includes etching a cavity in a first substrate (e.g., a semiconductor wafer), forming a first metal layer on a first surface of the first substrate and in the cavity, and forming a second metal layer on a non-conductive structure (e.g., glass). The method also may include removing a portion of the second metal layer to form an iris to expose a portion of the non-conductive structure, forming a bond between the first metal layer and the second metal layer to thereby attach the non-conductive structure to the first substrate, sealing an interface between the non-conductive structure and the first substrate, and patterning an antenna on a surface of the non-conductive structure.

公开(公告)号：US20190071304A1

公开(公告)日：2019-03-07

申请号：US15696245

申请日：2017-09-06

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Simon Joshua JACOBS ,  Benjamin Stassen COOK ,  James F. HALLAS ,  Randy LONG

IPC: B81B7/00 ,  H03L7/26 ,  G01L7/08 ,  G04F5/14

Abstract: An electronic device includes a package substrate, a circuit assembly, and a housing. The circuit assembly is mounted on the package substrate. The circuit assembly includes a first sealed cavity formed in a device substrate. The housing is mounted on the package substrate to form a second sealed cavity about the circuit assembly.

公开(公告)号：US20230246320A1

公开(公告)日：2023-08-03

申请号：US17587373

申请日：2022-01-28

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Adam Joseph FRUEHLING ,  Juan Alejandro HERBSOMMER ,  Bichoy Waguih BAHR ,  Argyrios DELLIS

IPC: H01P5/02 ,  H01P11/00 ,  H01L23/66

CPC classification number: H01P5/02 ,  H01P11/001 ,  H01L23/66 ,  H01L2223/6627

Abstract: In a described example, an apparatus includes a first substrate having a first side, a second side, and a coupling interface across a portion of the first side. The coupling interface including an arrangement of subwavelength periodic structures formed in the first substrate. A second substrate is coupled to a portion of the second side of the first substrate to form a sealed cavity aligned with the coupling interface.