公开(公告)号：US11205611B1

公开(公告)日：2021-12-21

申请号：US16901310

申请日：2020-06-15

Applicant: Texas Instruments Incorporated

Inventor： Vijaylaximi Khanolkar ,  Sreeram Subramanyam Nasum ,  Tarunvir Singh

IPC: H01L23/49 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/492

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

公开(公告)号：US20210391240A1

公开(公告)日：2021-12-16

申请号：US16901310

申请日：2020-06-15

Applicant: Texas Instruments Incorporated

Inventor： Vijaylaximi Khanolkar ,  Sreeram Subramanyam Nasum ,  Tarunvir Singh

IPC: H01L23/495 ,  H01L23/492 ,  H01L21/56 ,  H01L23/00

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

公开(公告)号：US20240136989A1

公开(公告)日：2024-04-25

申请号：US17972518

申请日：2022-10-23

Applicant: Texas Instruments Incorporated

Inventor： Harsh Sheokand ,  Tarunvir Singh ,  Anant Kamath ,  Suvadip Banerjee

IPC: H03F3/45

CPC classification number: H03F3/45654 ,  H03F3/45183 ,  H03F2203/45526

Abstract: A system includes an operational amplifier which includes a first amplifier input, a second amplifier input and an amplifier output. The system includes a first switch which includes a first terminal and includes a second terminal coupled to the first amplifier input. The system includes a second switch which includes a first terminal coupled to the first amplifier input and a second terminal coupled to the second amplifier input. The system includes a first bias current source coupled between the first amplifier input and a common potential and includes a second bias current source coupled between the first terminal of the first switch and the common potential. The system includes a feedback path between the amplifier output and the first amplifier input.

公开(公告)号：US11715707B2

公开(公告)日：2023-08-01

申请号：US16730856

申请日：2019-12-30

Applicant: Texas Instruments Incorporated

Inventor： Sreeram SubramanyamNasum ,  Vijaylaxmi Khanolkar ,  Tarunvir Singh

IPC: H01L23/64 ,  H01L23/495

CPC classification number: H01L23/642 ,  H01L23/4952 ,  H01L23/49503 ,  H01L23/49575

Abstract: Described examples include an apparatus including a package substrate having a die attach pad and a first semiconductor die on the die attach pad, the first semiconductor die including a transmitter. The apparatus also includes an assembly having a first plate coupled to the transmitter, a second plate separated from the first plate by a dielectric and a second semiconductor die on the die attach pad, the second semiconductor die including a receiver coupled to the second plate.

公开(公告)号：US11688672B2

公开(公告)日：2023-06-27

申请号：US17527994

申请日：2021-11-16

Applicant: Texas Instruments Incorporated

Inventor： Vijaylaxmi Khanolkar ,  Sreeram Subramanyam Nasum ,  Tarunvir Singh

IPC: H01L23/49 ,  H01L23/495 ,  H01L23/00 ,  H01L21/56 ,  H01L23/492

CPC classification number: H01L23/49589 ,  H01L21/565 ,  H01L23/492 ,  H01L23/49541 ,  H01L23/49575 ,  H01L24/46 ,  H01L24/85

Abstract: An electronic device having a package structure with conductive leads, first and second dies in the package structure, as well as first and second conductive plates electrically coupled to the respective first and second dies and having respective first and second sides spaced apart from and directly facing one another with a portion of the package structure extending between the first side of the first conductive plate and the second side of the second conductive plate to form a capacitor. No other side of the first conductive plate directly faces a side of the second conductive plate, and no other side of the second conductive plate directly faces a side of the first conductive plate.

公开(公告)号：US11677315B2

公开(公告)日：2023-06-13

申请号：US17103176

申请日：2020-11-24

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Srinivasa Rao Madala ,  Suvadip Banerjee ,  Sudhir Komarla Adinarayana ,  Tarunvir Singh

IPC: H02M3/24 ,  H02M1/44 ,  H02M3/335

CPC classification number: H02M1/44 ,  H02M3/24 ,  H02M3/33515

Abstract: A system includes a switching converter, an input voltage source coupled to an input of the switching converter, and a load coupled to an output of the switching converter. The system also includes a load sense circuit coupled to the load and configured to provide a load sense signal. The system also includes an oscillator coupled to the switching converter and configured to provide a spread spectrum modulated (SSM) clock signal to the switching converter, wherein a frequency of the SSM clock signal varies as a function of the load sense signal.