公开(公告)号：US10031875B2

公开(公告)日：2018-07-24

申请号：US14603100

申请日：2015-01-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： William R. Krenik ,  Matthew R. Webb ,  Deric W. Waters ,  Anand G. Dabak ,  Srinath Hosur

IPC: G06F13/40 ,  G06F11/30

Abstract: A switch monitoring system is provides information on sensor readings and contact closures over a one-wire network or a loop.

公开(公告)号：US20150331776A1

公开(公告)日：2015-11-19

申请号：US14603100

申请日：2015-01-22

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： William R. Krenik ,  Matthew R. Webb ,  Deric W. Waters ,  Anand G. Dabak ,  Srinath Hosur

IPC: G06F11/30 ,  G06F13/40 ,  G06F13/364

CPC classification number: G06F13/4022 ,  G06F11/3089

Abstract: A switch monitoring system is provides information on sensor readings and contact closures over a one-wire network or a loop

Abstract translation: 开关监控系统提供有关传感器读数和通过单线网络或回路的触点闭合信息

公开(公告)号：US20140144013A1

公开(公告)日：2014-05-29

申请号：US14174342

申请日：2014-02-06

Applicant: Texas Instruments Incorporated

Inventor： Edgar Rolando Zuniga-Ortiz ,  William R. Krenik

IPC: H01L29/84

CPC classification number: H01L29/84 ,  B81C1/0023 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01066 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A method of fabricating a MEMS device is disclosed. A metal layer is provided over a first surface of a substrate including over an opening. The metal layer is patterned to define a membrane segment and a pad, with the membrane segment extending at least partially across the opening. An integrated circuit chip is attached over the opening to the membrane segment and pad, with the integrated circuit separated from an extending portion of the membrane segment by a gap. The integrated circuit chip includes a conductive member so that deflection of the extending portion relative to the conductive member can be measured as a change in capacitance.

Abstract translation: 公开了一种制造MEMS器件的方法。 金属层设置在包括在开口上的衬底的第一表面上。 图案化金属层以限定膜段和垫，膜段至少部分延伸穿过开口。 集成电路芯片附着在隔膜段和衬垫的开口上，集成电路与隔膜段的延伸部分间隔开间隙。 集成电路芯片包括导电构件，使得可以测量延伸部分相对于导电构件的偏转作为电容的变化。

公开(公告)号：US20130062711A1

公开(公告)日：2013-03-14

申请号：US13670242

申请日：2012-11-06

Applicant: Texas Instruments Incorporated

Inventor： Edgar R. Zuniga-Ortiz ,  William R. Krenik

IPC: H01L27/24

CPC classification number: H01L29/84 ,  B81C1/0023 ,  H01L25/165 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/01066 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A semiconductor-centered MEMS device (100) integrates the movable microelectromechanical parts, such as mechanical elements, flexible membranes, and sensors, with the low-cost device package, and leaving only the electronics and signal-processing parts in the integrated circuitry of the semiconductor chip. The package is substrate-based and has an opening through the thickness of the substrate. Substrate materials include polymer tapes with attached metal foil, and polymer-based and ceramic-based multi-metal-layer dielectric composites with attached metal foil. The movable part is formed from the metal foil attached to a substrate surface and extends at least partially across the opening. The chip is flip-assembled to span at least partially across the membrane, and is separated from the membrane by a gap.

Abstract translation: 以半导体为中心的MEMS器件（100）将可移动的微机电部件（例如机械元件，柔性膜和传感器）与低成本的器件封装集成在一起，并且仅在电子器件和信号处理部件的集成电路中集成 半导体芯片 封装是基于基板的，并且具有通过基板的厚度的开口。 衬底材料包括具有附着金属箔的聚合物带，以及带有金属箔的聚合物基和陶瓷基多金属层介电复合材料。 可移动部分由附接到基板表面的金属箔形成并至少部分地延伸穿过开口。 芯片被翻转组装以至少跨越膜跨越，并且通过间隙与膜分离。