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    Resonant line driver including energy transfer inductor for driving capacitive-load lines
    1.
    发明授权
    Resonant line driver including energy transfer inductor for driving capacitive-load lines 有权

    公开(公告)号：US10521041B2

    公开(公告)日：2019-12-31

    申请号：US14825942

    申请日：2015-08-13

    Applicant: Texas Instruments Incorporated

    Inventor： Vadim V. Ivanov ,  William R. Krenik ,  Rajarshi Mukhopadhyay ,  Baher S. Haroun

    IPC: G06F3/041 ,  G06F3/044

    Abstract: A resonant line driver for driving capacitive-loads includes a driver series-coupled to an energy transfer inductor L1, driving signal energy at a signal frequency through L1. A switch array is controlled to switch L1 between multiple electrodes according to a switching sequence, each electrode characterized by a load capacitance CL. L1 and CL form a resonator circuit in which signal energy cycles between L1 and CL at the signal frequency. The switch array switches L1 between a current electrode and a next electrode at a zero_crossing when signal energy in the energy transfer inductor is at a maximum and signal energy in the load capacitance of the current electrode is at a minimum. An amplitude control loop controls signal energy delivered to the L1CL resonator circuit, and a frequency control loop controls signal frequency/phase. In an example application, the resonant driver provides line drive for a mutual capacitance touch screen.

    RESONANT LINE DRIVER INCLUDING ENERGY TRANSFER INDUCTOR FOR DRIVING CAPACITIVE-LOAD LINES
    2.
    发明申请
    RESONANT LINE DRIVER INCLUDING ENERGY TRANSFER INDUCTOR FOR DRIVING CAPACITIVE-LOAD LINES 审中-公开
    谐振线路驱动器，包括用于驱动电容负载线的能量转移电感器

    公开(公告)号：US20160048260A1

    公开(公告)日：2016-02-18

    申请号：US14825942

    申请日：2015-08-13

    Applicant: Texas Instruments Incorporated

    Inventor： Vadim V. Ivanov ,  William R. Krenik ,  Rajarshi Mukhopadhyay ,  Baher S. Haroun

    IPC: G06F3/041 ,  G06F3/044 ,  H03K3/012

    CPC classification number: G06F3/0416 ,  G06F3/044

    Abstract: A resonant line driver for driving capacitive-loads includes a driver series-coupled to an energy transfer inductor L1, driving signal energy at a signal frequency through L1. A switch array is controlled to switch L1 between multiple electrodes according to a switching sequence, each electrode characterized by a load capacitance CL. L1 and CL form a resonator circuit in which signal energy cycles between L1 and CL at the signal frequency. The switch array switches L1 between a current electrode and a next electrode at a zero_crossing when signal energy in the energy transfer inductor is at a maximum and signal energy in the load capacitance of the current electrode is at a minimum. An amplitude control loop controls signal energy delivered to the L1CL resonator circuit, and a frequency control loop controls signal frequency/phase. In an example application, the resonant driver provides line drive for a mutual capacitance touch screen.

    Abstract translation: 用于驱动电容性负载的谐振线路驱动器包括串联耦合到能量传递电感器L1的驱动器，通过L1驱动信号频率的信号能量。 控制开关阵列以根据切换顺序在多个电极之间切换L1，每个电极的特征在于负载电容CL。 L1和CL形成谐振器电路，其中信号能量在信号频率下在L1和CL之间循环。 当能量传递电感器中的信号能量处于最大值并且当前电极的负载电容中的信号能量处于最小时，开关阵列在零交叉时在当前电极和下一个电极之间切换L1。 幅度控制环路控制传送到L1CL谐振电路的信号能量，并且频率控制环路控制信号频率/相位。 在示例应用中，谐振驱动器为互电容触摸屏提供线驱动。

    Inductive current digital-to-analog converter (DAC) and related control options
    6.
    发明授权
    Inductive current digital-to-analog converter (DAC) and related control options 有权

    公开(公告)号：US12003251B2

    公开(公告)日：2024-06-04

    申请号：US17703300

    申请日：2022-03-24

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Ariel D. Moctezuma ,  Marius Dina ,  William R. Krenik

    IPC: H03M1/74 ,  H03M1/66

    CPC classification number: H03M1/742 ,  H03M1/665

    Abstract: An inductive current digital-to-analog converter (DAC) includes: a power supply input adapted to be coupled to a power supply; a load terminal adapted to be coupled to a load; an inductor between the power supply input and the load terminal; and inductor current control circuitry. The inductor current control circuitry has: a sense signal input configured to receive a sense signal representative of the inductor current; a control code input configured to receive a control code; a set of switches having respective control terminals; and a set of control circuit outputs coupled to the respective control terminals of the set of switches. The inductor current control circuitry is configured to adjust control signals provided to the set of control circuit outputs based on the sense signal and the control code.

    Micro-electro-mechanical system having movable element integrated into leadframe-based package
    7.
    发明授权
    Micro-electro-mechanical system having movable element integrated into leadframe-based package 有权
    具有集成到基于引线框的封装中的可移动元件的微机电系统

    公开(公告)号：US08796792B2

    公开(公告)日：2014-08-05

    申请号：US13709295

    申请日：2012-12-10

    Applicant: Texas Instruments Incorporated

    Inventor： Edgar Rolando Zuniga-Ortiz ,  William R. Krenik

    IPC: H04R23/00 ,  B81B3/00 ,  B81C1/00

    CPC classification number: B81B3/0021 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L2224/16 ,  H01L2924/1461 ,  H01L2924/1815 ,  H01L2924/00

    Abstract: A MEMS may integrate movable MEMS parts, such as mechanical elements, flexible membranes, and sensors, with the low-cost device package, leaving the electronics and signal-processing parts in the integrated circuitry of the semiconductor chip. The package may be a leadframe-based plastic molded body having an opening through the thickness of the body. The movable part may be anchored in the body and extend at least partially across the opening. The chip may be flip-assembled to the leads to span across the foil, and may be separated from the foil by a gap. The leadframe may be a prefabricated piece part, or may be fabricated in a process flow with metal deposition on a sacrificial carrier and patterning of the metal layer. The resulting leadframe may be flat or may have an offset structure useful for stacked package-on-package devices.

    Abstract translation: MEMS可以利用低成本器件封装集成可移动MEMS部件，例如机械元件，柔性膜和传感器，将电子器件和信号处理部件留在半导体芯片的集成电路中。 封装可以是具有通过主体厚度的开口的引线框架的塑料模制体。 可移动部分可以锚定在主体中并且至少部分地延伸穿过开口。 芯片可以被翻转组装到引线跨越箔片，并且可以通过间隙与箔片分离。 引线框架可以是预制件部件，或者可以以牺牲载体上的金属沉积和金属层的图案化的工艺流程制造。 所得到的引线框架可以是平坦的，或者可以具有对于堆叠的封装封装器件有用的偏移结构。

    TOUCH-SENSITIVE INTERFACE AND METHOD USING ORTHOGONAL SIGNALING
    8.
    发明申请
    TOUCH-SENSITIVE INTERFACE AND METHOD USING ORTHOGONAL SIGNALING 有权
    触觉敏感接口和使用正交信号的方法

    公开(公告)号：US20140055413A1

    公开(公告)日：2014-02-27

    申请号：US14072080

    申请日：2013-11-05

    Applicant: Texas Instruments Incorporated

    Inventor： William R. Krenik ,  Anand Dabak

    IPC: G06F3/044

    CPC classification number: G06F3/044 ,  G06F3/0418

    Abstract: A touch screen system includes a capacitive touch screen (1) including a plurality of row conductors (7-1, 2 . . . n) and a column conductor (5-1). A plurality of cotemporaneous orthogonal excitation signals (S1(t), S2 (t) . . . Sn(t)) are simultaneously driven onto the row conductors, respectively. The capacitively coupled signals on the column conductor may be influenced by a touch (10) on the capacitive touch screen. Receiver circuitry (50) includes a sense amplifier (21-1) coupled to generate an amplifier output signal (r1(t)) in response to signals capacitively coupled onto the column conductor. WHT-based circuitry (35) determines amounts of signal contribution capacitively coupled by each of the excitation signals, respectively, to the amplifier output signal.

    Abstract translation: 触摸屏系统包括电容式触摸屏（1），其包括多个行导体（7-1,2 .n）和列导体（5-1）。 多个同时正交激励信号（S1（t），S2（t）... Sn（t））分别同时被驱动到行导体上。 列导体上的电容耦合信号可能受到电容式触摸屏上的触摸（10）的影响。 接收器电路（50）包括响应于电容耦合到列导体上的信号而耦合以产生放大器输出信号（r1（t））的读出放大器（21-1）。 基于WHT的电路（35）确定分别通过每个激励信号电容耦合到放大器输出信号的信号贡献量。

    MICRO-ELECTRO-MECHANICAL SYSTEM HAVING MOVABLE ELEMENT INTEGRATED INTO LEADFRAME-BASED PACKAGE
    10.
    发明申请
    MICRO-ELECTRO-MECHANICAL SYSTEM HAVING MOVABLE ELEMENT INTEGRATED INTO LEADFRAME-BASED PACKAGE 有权
    具有可移动元件的微电子机械系统集成到基于引脚的封装

    公开(公告)号：US20130099333A1

    公开(公告)日：2013-04-25

    申请号：US13709295

    申请日：2012-12-10

    Applicant: TEXAS INSTRUMENTS INCORPORATED

    Inventor： Edgar Rolando Zuniga-Ortiz ,  William R. Krenik

    IPC: B81B3/00

    CPC classification number: B81B3/0021 ,  B81C1/00238 ,  B81C2203/0792 ,  H01L2224/16 ,  H01L2924/1461 ,  H01L2924/1815 ,  H01L2924/00

    Abstract: A MEMS may integrate movable MEMS parts, such as mechanical elements, flexible membranes, and sensors, with the low-cost device package, leaving the electronics and signal-processing parts in the integrated circuitry of the semiconductor chip. The package may be a leadframe-based plastic molded body having an opening through the thickness of the body. The movable part may be anchored in the body and extend at least partially across the opening. The chip may be flip-assembled to the leads to span across the foil, and may be separated from the foil by a gap. The leadframe may be a prefabricated piece part, or may be fabricated in a process flow with metal deposition on a sacrificial carrier and patterning of the metal layer. The resulting leadframe may be flat or may have an offset structure useful for stacked package-on-package devices.

    Abstract translation: MEMS可以利用低成本器件封装集成可移动MEMS部件，例如机械元件，柔性膜和传感器，将电子器件和信号处理部件留在半导体芯片的集成电路中。 封装可以是具有通过主体厚度的开口的引线框架的塑料模制体。 可移动部分可以锚定在主体中并且至少部分地延伸穿过开口。 芯片可以被翻转组装到引线跨越箔片，并且可以通过间隙与箔片分离。 引线框架可以是预制件部件，或者可以以牺牲载体上的金属沉积和金属层的图案化的工艺流程制造。 所得到的引线框架可以是平坦的，或者可以具有对于堆叠的封装封装器件有用的偏移结构。

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