TREATMENT LIQUID FOR SEMICONDUCTOR WITH RUTHENIUM

    公开(公告)号:US20230207329A1

    公开(公告)日:2023-06-29

    申请号:US17801964

    申请日:2021-02-25

    CPC classification number: H01L21/32134

    Abstract: Provided is a treatment liquid for a semiconductor with ruthenium including a ligand which coordinates to ruthenium, the treatment liquid is a treatment liquid for inhibiting a ruthenium-containing gas generated when contacting a semiconductor wafer including ruthenium with the treatment liquid in a semiconductor forming process. Also provided is an inhibitor for the generation of a ruthenium-containing gas, including a compound having a carbonyl group or a heterocyclic compound. Further provided is a treatment agent for a ruthenium-containing waste liquid, including a compound having a carbonyl group or a heterocyclic compound.

    SEMICONDUCTOR TREATMENT LIQUID
    13.
    发明申请

    公开(公告)号:US20220328320A1

    公开(公告)日:2022-10-13

    申请号:US17708596

    申请日:2022-03-30

    Abstract: Provided are: a semiconductor treatment liquid containing a hypobromite ion, in which the concentration of the hypobromite ion is 0.1 μmol/L or more and less than 0.001 mol/L; a RuO4 gas generation inhibitor containing an onium salt composed of an onium ion and a bromine-containing ion, in which the hypobromite ion concentration is 0.1 μmol/L or more and less than 0.001 mol/L; and a method of producing a halogen oxyacid, the method including allowing a bromine salt, an organic alkali, and a halogen to react with each other to obtain the halogen oxyacid.

    TREATMENT LIQUID FOR SEMICONDUCTOR WAFERS

    公开(公告)号:US20220298416A1

    公开(公告)日:2022-09-22

    申请号:US17636539

    申请日:2021-08-06

    Abstract: Provided is a treatment liquid for etching a transition metal on a semiconductor wafer, the treatment liquid comprising: (A) a hypohalite ion or periodate ion; and (B) an alkylammonium salt represented by the following Formula (1). (wherein a is an integer from 6 to 20, R1, R2, and R3 are independently a hydrogen atom or an alkyl group having carbon number from 1 to 20, and X− is a bromine-containing ion), and a method of etching a transition metal by bringing the treatment liquid for semiconductor wafers into contact with the transition metal used in a semiconductor formation process.

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