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公开(公告)号:US20240222157A1
公开(公告)日:2024-07-04
申请号:US18608043
申请日:2024-03-18
Applicant: Tokyo Electron Limited
Inventor: Song yun Kang , Toshitake Tsuda , Kenji Sekiguchi , Syuhei Yonezawa , Koji Kagawa
IPC: H01L21/67 , H01L21/02 , H01L21/306 , H01L21/311
CPC classification number: H01L21/6708 , H01L21/02087 , H01L21/02129 , H01L21/02343 , H01L21/30604 , H01L21/31144 , H01L21/67051
Abstract: A substrate processing method includes holding a substrate on which a boron-containing silicon film is formed; supplying an oxidative aqueous solution including hydrofluoric acid and nitric acid to the held substrate; and etching the boron-containing silicon film of the substrate with the oxidative aqueous solution.
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公开(公告)号:US10181559B2
公开(公告)日:2019-01-15
申请号:US15841998
申请日:2017-12-14
Applicant: TOKYO ELECTRON LIMITED
Inventor: Takuya Kubo , Song yun Kang
Abstract: There is provided an workpiece etching method executed in manufacturing a magneto-resistive effect element, the workpiece including first and second multilayer films, the first multilayer film including first and second magnetic layers and a tunnel barrier layer formed between the first and second magnetic layers, and the second multilayer film being a multilayer film constituting a pinning layer in the magneto-resistive effect element. The method includes: etching the first multilayer film; generating plasma of a first gas including hydrocarbon and noble gases inside a chamber of a plasma processing apparatus to etch the second multilayer film inside the chamber; and generating plasma of a second gas including gas containing carbon and oxygen, an oxygen gas and a noble gas and not containing hydrogen inside the chamber to remove a carbon-containing deposit formed on the workpiece in the generating the plasma of the first gas.
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公开(公告)号:US09611545B2
公开(公告)日:2017-04-04
申请号:US14417196
申请日:2013-06-19
Applicant: TOKYO ELECTRON LIMITED , NATIONAL UNIVERSITY CORPORATION TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY
Inventor: Song yun Kang , Yoshinao Kumagai , Akinori Koukitu
IPC: C23C16/40 , B05C19/06 , C23C16/448 , H01L21/02 , C23C16/52
CPC classification number: C23C16/407 , B05C19/06 , C23C16/4488 , C23C16/52 , H01L21/02554 , H01L21/0262
Abstract: A ZnO film production method includes: disposing a substrate on an installation base; and, while supplying chlorine gas from a chlorine gas supply source to a first raw material storing part R1 and supplying oxygen gas from a third gas supply source (oxygen gas supply source) G3 into a reaction container, controlling heating units (heaters H1, H2 and H3) with a control device CONT such that temperature T1 of the first raw material storing part R1, temperature T2 of a second raw material storing part R2 and temperature T3 of the installation base on which the substrate is disposed satisfy a relationship of T1
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