公开(公告)号：US10962888B2

公开(公告)日：2021-03-30

申请号：US15962518

申请日：2018-04-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Yu-Piao Fang

IPC: G03F7/20 ,  G06T7/68 ,  G06T7/00

Abstract: A structure includes a first periodic structure positioned on a chip, the first periodic structure comprising a material of a first layer disposed on the chip. The structure further includes a second periodic structure positioned within the region of the chip adjacent the first periodic structure, the second periodic structure comprising a second material of a second layer disposed on the chip. The structure further includes an acoustic wave transmitter device disposed on the chip and an acoustic wave receiver device disposed on the chip.

公开(公告)号：US20200279759A1

公开(公告)日：2020-09-03

申请号：US16876875

申请日：2020-05-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Yu-Piao Fang

IPC: H01L21/677 ,  G03F7/20 ,  G03F1/22 ,  H01L21/673 ,  G03F1/66

Abstract: A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

公开(公告)号：US10658215B2

公开(公告)日：2020-05-19

申请号：US15797654

申请日：2017-10-30

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Yu-Piao Fang

IPC: H01L21/673 ,  H01L21/677 ,  G03F7/20 ,  G03F1/22 ,  G03F1/66

Abstract: A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

公开(公告)号：US20190064654A1

公开(公告)日：2019-02-28

申请号：US16026309

申请日：2018-07-03

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Te-Chih Huang ,  Yu-Piao Fang

IPC: G03F1/42 ,  G03F1/22 ,  G03F1/24 ,  H01L21/027 ,  G03F7/20 ,  G01B11/27

Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.

公开(公告)号：US11955441B2

公开(公告)日：2024-04-09

申请号：US17706039

申请日：2022-03-28

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Jian-Hong Lin ,  Kuo-Yen Liu ,  Hsin-Chun Chang ,  Tzu-Li Lee ,  Yu-Ching Lee ,  Yih-Ching Wang

IPC: H01L23/00 ,  H01L23/522 ,  H01L23/58 ,  H01L27/02 ,  H01L21/768

CPC classification number: H01L23/562 ,  H01L23/522 ,  H01L23/5226 ,  H01L23/585 ,  H01L27/0248 ,  H01L21/76805 ,  H01L2224/06519 ,  H01L2224/09519 ,  H01L2224/30519 ,  H01L2224/33519

Abstract: An interconnect structure comprises a first dielectric layer, a first metal layer, a second dielectric layer, a metal via, and a second metal layer. The first dielectric layer is over a substrate. The first metal layer is over the first dielectric layer. The first metal layer comprises a first portion and a second portion spaced apart from the first portion. The second dielectric layer is over the first metal layer. The metal via has an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first metal layer, and a lower portion in the first dielectric layer. The second metal layer is over the metal via. From a top view the second metal layer comprises a metal line having longitudinal sides respectively set back from opposite sides of the first portion of the first metal layer.

公开(公告)号：US11302654B2

公开(公告)日：2022-04-12

申请号：US17018381

申请日：2020-09-11

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Jian-Hong Lin ,  Kuo-Yen Liu ,  Hsin-Chun Chang ,  Tzu-Li Lee ,  Yu-Ching Lee ,  Yih-Ching Wang

IPC: H01L21/768 ,  H01L23/00 ,  H01L23/58 ,  H01L27/02 ,  H01L23/522

Abstract: A method includes depositing a first dielectric layer over a substrate; forming a first dummy metal layer over the first dielectric layer, wherein the first dummy metal layer has first and second portions laterally separated from each other; depositing a second dielectric layer over the first dummy metal layer; etching an opening having an upper portion in the second dielectric layer, a middle portion between the first and second portions of the first dummy metal layer, and a lower portion in the first dielectric layer, wherein a width of the lower portion of the opening is greater than a width of the middle portion of the opening, and a bottom of the opening is higher than a bottom of the first dielectric layer; and forming a dummy via in the opening and a second dummy metal layer over the dummy via and the second dielectric layer.

公开(公告)号：US20210165315A1

公开(公告)日：2021-06-03

申请号：US17171119

申请日：2021-02-09

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Te-Chih Huang ,  Yu-Piao Fang

IPC: G03F1/42 ,  G03F1/22 ,  G03F1/24 ,  G03F7/20

Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.

公开(公告)号：US20190163076A1

公开(公告)日：2019-05-30

申请号：US15962518

申请日：2018-04-25

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Yu-Piao Fang

IPC: G03F7/20 ,  G06T7/00 ,  G06T7/68

Abstract: A structure includes a first periodic structure positioned on a chip, the first periodic structure comprising a material of a first layer disposed on the chip. The structure further includes a second periodic structure positioned within the region of the chip adjacent the first periodic structure, the second periodic structure comprising a second material of a second layer disposed on the chip. The structure further includes an acoustic wave transmitter device disposed on the chip and an acoustic wave receiver device disposed on the chip.

公开(公告)号：US11837486B2

公开(公告)日：2023-12-05

申请号：US17232326

申请日：2021-04-16

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Yu-Piao Fang

IPC: H01L21/677 ,  G03F7/00 ,  G03F1/22 ,  H01L21/673 ,  G03F1/66

CPC classification number: H01L21/6773 ,  G03F1/22 ,  G03F1/66 ,  G03F7/7015 ,  G03F7/70741 ,  H01L21/67353 ,  H01L21/67359 ,  H01L21/67373 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67733 ,  H01L21/67769 ,  H01L21/67772 ,  H01L21/67721 ,  H01L21/67724

Abstract: A transportation container is provided with a container body constructed of a top wall, a bottom wall, a rear wall, and two sidewalls forming a front opening for loading or unloading a reticle pod into or out of the container body; a lid for opening and closing the front opening; and a lift plate above the container body configured to connect to a carrier of an overhead hoist transfer (OHT) system.

公开(公告)号：US11835864B2

公开(公告)日：2023-12-05

申请号：US17816030

申请日：2022-07-29

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Yu-Ching Lee ,  Te-Chih Huang ,  Yu-Piao Fang

IPC: H01L23/544 ,  G03F7/00 ,  G03F1/22 ,  G03F1/24 ,  G03F1/42

CPC classification number: G03F7/70633 ,  G03F1/22 ,  G03F1/24 ,  G03F1/42 ,  H01L23/544 ,  H01L2223/54426

Abstract: An overlay mark includes a first, a second, a third, and a fourth component. The first component is located in a first region of the first overlay mark and includes a plurality of gratings that extend in a first direction. The second component is located in a second region of the first overlay mark and includes a plurality of gratings that extend in the first direction. The third component is located in a third region of the first overlay mark and includes a plurality of gratings that extend in a second direction different from the first direction. The fourth component is located in a fourth region of the first overlay mark and includes a plurality of gratings that extend in the second direction. The first region is aligned with the second region. The third region is aligned with the fourth region.