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公开(公告)号:US11264066B2
公开(公告)日:2022-03-01
申请号:US16999867
申请日:2020-08-21
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Shang-Chi Wu , Cheng Hung Lee , Chien-Kuo Su , Chiting Cheng , Yu-Hao Hsu , Yangsyu Lin
Abstract: The present disclosure describes various exemplary memory storage devices that can be programmed to write electronic data into one or more memory cells in a write mode of operation and/or to read the electronic data from the one or more memory cells in a read mode of operation. The various exemplary memory storage devices can select various control lines to read the electronic data from the one or more memory cells onto data lines and/or to write the electronic data from these data lines into the one or more memory cells. In some situations, these data lines are charged, also referred to as pre-charged, to a first logical value, such as a logical one, before the various exemplary memory storage devices write the electronic data into the one or more memory cells. During this pre-charging of these data lines, the various exemplary memory storage devices electrically isolate these data lines from specialized circuitry within these exemplary memory storage devices. This specialized circuitry, also referred to as a write driver, writes the electronic data onto these data lines for storage in the one or more memory cells during the write mode of operation.
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公开(公告)号:US10818677B2
公开(公告)日:2020-10-27
申请号:US16502790
申请日:2019-07-03
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Yangsyu Lin , Chi-Lung Lee , Chien-Chi Tien , Chiting Cheng
IPC: H01L27/11 , H01L27/02 , H01L27/092 , G11C11/419 , H01L23/522 , G11C11/412 , H01L23/528
Abstract: A static random access memory (SRAM) periphery circuit includes a first n-type transistor and a second n-type transistor that are disposed in a first well region of first conductivity type, the first well region occupies a first distance in a row direction equal to a bitcell-pitch of an SRAM array. The SRAM periphery circuit includes a first p-type transistor and a second p-type transistor that are disposed in a second well region of second conductivity type. The second well region occupies a second distance in the row direction equal to the bitcell-pitch of the SRAM array. The second well region is disposed adjacent to the first well region in the row direction.
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公开(公告)号:US20200020387A1
公开(公告)日:2020-01-16
申请号:US16580675
申请日:2019-09-24
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yangsyu Lin , Chiting Cheng
IPC: G11C11/417 , H01L27/11 , H01L23/528 , G11C5/14
Abstract: A dual rail device includes a first power domain circuit coupled to a first power supply through a first header control switch and a second power domain circuit coupled to a second power supply. The first and second power supplies have different steady-state voltage levels. The first power domain circuit is interfaced to the second power domain circuit. The device also includes a power detector circuit for providing a control signal for the first header control switch responsive to a voltage level of the second power supply.
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公开(公告)号:US20190004718A1
公开(公告)日:2019-01-03
申请号:US15938502
申请日:2018-03-28
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Hao HSU , Cheng Hung Lee , Chen-Lin Yang , Chiting Cheng , Fu-An Wu , Hung-Jen Liao , Jung-Ping Yang , Jonathan Tsung-Yung Chang , Wei Min Chan , Yen-Huei Chen , Yangsyu Lin , Chien-Chen Lin
IPC: G06F3/06 , G11C11/4074 , G11C16/12 , G11C16/30 , G11C5/14
Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to control minimize power consumption.
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公开(公告)号:US11675505B2
公开(公告)日:2023-06-13
申请号:US17717491
申请日:2022-04-11
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Hao Hsu , Cheng Hung Lee , Chen-Lin Yang , Chiting Cheng , Fu-An Wu , Hung-Jen Liao , Jung-Ping Yang , Jonathan Tsung-Yung Chang , Wei Min Chan , Yen-Huei Chen , Yangsyu Lin , Chien-Chen Lin
CPC classification number: G06F3/0625 , G06F3/0679 , G11C5/147 , G11C11/4074 , G11C16/12 , G11C16/30 , H04B10/03 , H04B10/27 , H04J14/0228 , H04J14/0268
Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum voltage signal from among the multiple voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum voltage signal from among the multiple voltage signals to minimize power consumption.
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公开(公告)号:US11342340B2
公开(公告)日:2022-05-24
申请号:US17080617
申请日:2020-10-26
Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
Inventor: Yangsyu Lin , Chi-Lung Lee , Chien-Chi Tien , Chiting Cheng
IPC: H01L27/11 , H01L27/02 , H01L27/092 , G11C11/419 , H01L23/522 , G11C11/412 , H01L23/528
Abstract: A static random access memory (SRAM) periphery circuit includes a first n-type transistor and a second n-type transistor that are disposed in a first well region of first conductivity type, the first well region occupies a first distance in a row direction equal to a bitcell-pitch of an SRAM array. The SRAM periphery circuit includes a first p-type transistor and a second p-type transistor that are disposed in a second well region of second conductivity type. The second well region occupies a second distance in the row direction equal to the bitcell-pitch of the SRAM array. The second well region is disposed adjacent to the first well region in the row direction.
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公开(公告)号:US11301148B2
公开(公告)日:2022-04-12
申请号:US17201931
申请日:2021-03-15
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Yu-Hao Hsu , Cheng Hung Lee , Chen-Lin Yang , Chiting Cheng , Fu-An Wu , Hung-Jen Liao , Jung-Ping Yang , Jonathan Tsung-Yung Chang , Wei Min Chan , Yen-Huei Chen , Yangsyu Lin , Chien-Chen Lin
Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption.
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公开(公告)号:US10949100B2
公开(公告)日:2021-03-16
申请号:US16685722
申请日:2019-11-15
Applicant: Taiwan Semiconductor Manufacturing Co. Ltd.
Inventor: Yu-Hao Hsu , Cheng Hung Lee , Chen-Lin Yang , Chiting Cheng , Fu-An Wu , Hung-Jen Liao , Jung-Ping Yang , Jonathan Tsung-Yung Chang , Wei Min Chan , Yen-Huei Chen , Yangsyu Lin , Chien-Chen Lin
Abstract: Various embodiments for configurable memory storage systems are disclosed. The configurable memory storages selectively choose an operational voltage signal from among multiple operational voltage signals to dynamically control various operational parameters. For example, the configurable memory storages selectively choose a maximum operational voltage signal from among the multiple operational voltage signals to maximize read/write speed. As another example, the configurable memory storages selectively choose a minimum operational voltage signal from among the multiple operational voltage signals to minimize power consumption.
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公开(公告)号:US09070432B2
公开(公告)日:2015-06-30
申请号:US14077263
申请日:2013-11-12
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor: Wei-jer Hsieh , Yangsyu Lin , Hsiao Wen Lu , Chiting Cheng , Jonathan Tsung-Yung Chang
IPC: G11C11/00 , G11C7/12 , G11C11/419
CPC classification number: G11C11/419 , G11C7/12
Abstract: A device includes a transistor switch coupled between a bit line voltage node and a ground node and a boost signal circuit coupled to a gate node of the transistor switch, where the boost signal circuit providing a boost signal responsive to a write enable signal. The device also includes a first delay element and a first capacitor in series with the first delay element. The first capacitor has a first end coupled to the bit line voltage node and a second end coupled to the gate node through the first delay element.
Abstract translation: 一种器件包括耦合在位线电压节点和接地节点之间的晶体管开关和耦合到晶体管开关的栅极节点的升压信号电路,其中升压信号电路响应于写使能信号而提供升压信号。 该装置还包括与第一延迟元件串联的第一延迟元件和第一电容器。 第一电容器具有耦合到位线电压节点的第一端和通过第一延迟元件耦合到栅极节点的第二端。
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