摘要:
A stack of a high-k gate dielectric and a metal gate structure includes a lower metal layer, a scavenging metal layer, and an upper metal layer. The scavenging metal layer meets the following two criteria 1) a metal (M) for which the Gibbs free energy change of the reaction Si+2/y MxOy→2x/y M+SiO2 is positive 2) a metal that has a more negative Gibbs free energy per oxygen atom for formation of oxide than the material of the lower metal layer and the material of the upper metal layer. The scavenging metal layer meeting these criteria captures oxygen atoms as the oxygen atoms diffuse through the gate electrode toward the high-k gate dielectric. In addition, the scavenging metal layer remotely reduces the thickness of a silicon oxide interfacial layer underneath the high-k dielectric. As a result, the equivalent oxide thickness (EOT) of the total gate dielectric is reduced and the field effect transistor maintains a constant threshold voltage even after high temperature processes during CMOS integration.
摘要翻译:高k栅极电介质和金属栅极结构的堆叠包括下部金属层,清除金属层和上部金属层。 清除金属层满足以下两个标准:1)反应Si + 2 / y MxOy→2x / y M + SiO2的吉布斯自由能变化为正的金属(M)2)具有更负的金属 每个氧原子吉布斯自由能用于形成氧化物,而不是下金属层的材料和上金属层的材料。 符合这些标准的清除金属层随着氧原子通过栅电极向高k栅极电介质扩散而捕获氧原子。 此外,清除金属层远远地降低了高k电介质下面的氧化硅界面层的厚度。 结果,即使在CMOS积分期间的高温处理之后,总栅极电介质的等效氧化物厚度(EOT)减小,并且场效应晶体管保持恒定的阈值电压。
摘要:
Disclosed is a process for efficiently producing pyripyropene derivatives having acyloxy at the 1-position and 11-position and hydroxyl at the 7-position. The process comprises selectively acylating hydroxyl at the 1-position and 11-position of a compound represented by formula B1 through one to three steps with an acylating agent in the presence or absence of a base.
摘要:
A quarter-gap p-type field effect transistor (PFET) formed by gate-last fabrication includes a gate stack formed on a silicon substrate, the gate stack including: a high-k dielectric layer located on the silicon substrate; and a gate metal layer located over the high-k dielectric layer, the gate metal layer including titanium nitride and having a thickness of about 20 angstroms; and a metal contact formed over the gate stack. A quarter-gap n-type field effect transistor (NFET) formed by gate-last fabrication includes a gate stack formed on a silicon substrate, the gate stack including: a high-k dielectric layer located on the silicon substrate; and a first gate metal layer located over the high-k dielectric layer, the first gate metal layer including titanium nitride; and a metal contact formed over the gate stack.
摘要:
A positioning apparatus includes a stage on which a piezoelectric element is set, a stop unit having a stop face to which the piezoelectric element set on the stage is pushed so that the piezoelectric element is positioned at a target position corresponding to an attaching part of, for example, a head suspension to which the piezoelectric element is attached, and a pushing unit to push the piezoelectric element toward the stop face, the pushing unit blowing a gas to push the piezoelectric element. The positioning apparatus is capable of correctly positioning the piezoelectric element to the target position without damaging the piezoelectric element.
摘要:
Embodiments relate to a field-effect transistor (FET) replacement gate apparatus. The apparatus includes one or more of a substrate and insulator including a base and side walls defining a trench. A high-dielectric constant (high-k) layer is formed on the base and side walls of the trench. The high-k layer has an upper surface conforming to a shape of the trench. A first layer is formed on the high-k layer and conforms to the shape of the trench. The first layer includes an aluminum-free metal nitride. A second layer is formed on the first layer and conforms to the shape of the trench. The second layer includes aluminum and at least one other metal. A third layer is formed on the second layer and conforms to the shape of the trench. The third layer includes aluminum-free metal nitride.
摘要:
In the present invention, first boosting circuits (41a to 41d) are interposed upon each of direct current power lines (La to Ld). The boosting ratios of the first boosting circuits (41a to 41d), for each iteration of a first cycle, are variably controlled during a first period so that the generated power of the corresponding solar cell strings (1a to 1d) is maximized, and the boosting ratios during a second period are controlled so as to be maintained at a uniform value. The total amount of time of the first period and the second period is made to correspond to the first cycle.
摘要:
A current collection box includes: a number of terminals enabling the connecting of at least two solar cell strings including a plurality of solar cells are connected in series; a booster for boosting individual voltages of the generated power of each of the solar cell strings inputted via the terminals; and an output circuit for collecting all of the outputs of the booster together into a single output and then outputting the single output, wherein each of the boosters starts MPPT operation, which operates so that the output power of the solar cells is controlled so as to reach a maximum value, with different periods.
摘要:
A fusing device includes a fusing roller, a compression roller, and a cam; a first link having an end as a rotation support point, another end with a contact point with the cam, and an intermediate point between the end and another end thereof; a second link having a first end, a second end, and a third end, the first end rotatably connected to the intermediate point of the first link, and the second end configured to rotatably support the compression roller; a third link having an end rotatably supported and another end rotatably connected to the third end of the second link; and an elastic compression member configured to elastically compress the compression roller against the fusing roller via the first link.
摘要:
Provided in an image pickup apparatus are an imaging optical system (12), an image pickup element (22), a fixed member (22) whose position relative to the imaging optical axis OA is fixed, a plurality of movable supporting balls (62), each movably supported with attraction of magnetic force, a movable member (41) in which the image pickup element is provided and which is movably supported by the fixed member with magnetic force through each movable supporting ball (62), a driving mechanism (44, 46, 54, 55, 56, 57) to generate driving force to relatively move the movable member with respect to the fixed member, a display unit (18), a mounting plate to mount the display unit in the casing (11), wherein the mounting plate (70) is provided with a protruding arm portion (74) protruding toward the movable member.
摘要:
A method includes forming on a surface of a semiconductor a dummy gate structure comprised of a plug; forming a first spacer surrounding the plug, the first spacer being a sacrificial spacer; and performing an angled ion implant so as to implant a dopant species into the surface of the semiconductor adjacent to an outer sidewall of the first spacer to form a source extension region and a drain extension region, where the implanted dopant species extends under the outer sidewall of the first spacer by an amount that is a function of the angle of the ion implant. The method further includes performing a laser anneal to activate the source extension and the drain extension implant. The method further includes forming a second spacer surrounding the first spacer, removing the first spacer and the plug to form an opening, and depositing a gate stack in the opening.