Electron beam lithography apparatus, lithography method, lithography program, and manufacturing method of a semiconductor device
    12.
    发明授权
    Electron beam lithography apparatus, lithography method, lithography program, and manufacturing method of a semiconductor device 失效
    电子束光刻设备,光刻方法,光刻程序和半导体器件的制造方法

    公开(公告)号:US07482604B2

    公开(公告)日:2009-01-27

    申请号:US11430044

    申请日:2006-05-09

    IPC分类号: G21G5/00

    摘要: According to an aspect of the invention, there is provided an electron beam lithography apparatus including a first setting unit configured to set a drawing position on a semiconductor substrate based on layout information of the semiconductor substrate, a second setting unit configured to set a valid range on the semiconductor substrate based on shape information of the semiconductor substrate, a determination unit configured to determine whether or not the drawing position falls within the valid range, and an irradiation unit configured to irradiate the semiconductor substrate with an electron beam when the determination unit determines that the drawing position falls within the valid range.

    摘要翻译: 根据本发明的一个方面,提供了一种电子束光刻设备,包括:第一设定单元,被配置为基于半导体衬底的布局信息来设置半导体衬底上的绘制位置;第二设置单元,被配置为设置有效范围 基于所述半导体衬底的形状信息在所述半导体衬底上,确定单元,被配置为确定所述绘制位置是否在所述有效范围内;以及照射单元,被配置为当所述确定单元确定时照射所述半导体衬底电子束 绘图位置在有效范围内。

    Character pattern extracting method, charged particle beam drawing method, and character pattern extracting program
    13.
    发明申请
    Character pattern extracting method, charged particle beam drawing method, and character pattern extracting program 失效
    字符图案提取方法,带电粒子束绘制方法和字符图案提取程序

    公开(公告)号:US20070263921A1

    公开(公告)日:2007-11-15

    申请号:US11797531

    申请日:2007-05-04

    IPC分类号: G06K9/00

    摘要: A character pattern extracting method includes ranking character patterns whose number is larger than a maximum number of character patterns in an aperture, depending on the number of reference times in design data of a semiconductor device, extracting first extraction patterns whose number is smaller than the maximum number from the large number of read character patterns in a descending order of the reference time number, defining character patterns except the first extraction patterns out of the larger number of character patterns as candidate patterns, selecting from the candidate patterns a plurality of candidate patterns whose number corresponds to a difference between the number of extracted patterns from the maximum number, and creating combinations of the selected candidate patterns, and extracting second extraction patterns included in a combination among the combinations of candidate patterns, in which a manufacturing time of the semiconductor device is most shortened.

    摘要翻译: 字符图案提取方法包括根据半导体器件的设计数据中的参考时间的数量来排列数量大于孔径中的最大字符图案数量的字符图案,提取数量小于最大值的第一提取图案 以大量的读取字符图案的数量以参考时间数字的降序排列,将除了较大数量的字符图案之外的第一提取模式除外的字符图案作为候选图案,从候选图案中选择多个候选图案, 数字对应于从最大数量提取的图案的数量之间的差异,以及创建所选择的候选图案的组合,以及提取包括在候选图案的组合中的组合中的第二提取图案,其中半导体器件的制造时间 最缩短。

    Charged particle beam drawing equipment, method of adjusting aperture mask, and method of manufacturing semiconductor device
    14.
    发明授权
    Charged particle beam drawing equipment, method of adjusting aperture mask, and method of manufacturing semiconductor device 失效
    带电粒子束拉制设备,调整孔径掩模的方法和制造半导体器件的方法

    公开(公告)号:US07242014B2

    公开(公告)日:2007-07-10

    申请号:US11172996

    申请日:2005-07-05

    IPC分类号: H01J37/30 H01J37/256

    摘要: A charged particle beam drawing equipment includes charged particle beam source, first and second shaping aperture masks with first and second opening portions for rotation adjustment, detection section to detect charged particle beam intensity distribution in a plane parallel to the second mask, the beam being emitted from the source and passing through the opening portions, rotation angle control section to control relative rotation angle between the masks, acquisition section to acquire relative rotation angle between the masks such that deviation in relative rotation angle between the masks falls within a predetermined range based on detection results obtained by changing the relative rotation angle between the masks plural times by the control section and by detecting the beam by the detection section for each rotation angle, and instruction section to instruct the rotation angle control section such that the relative rotation angle between the masks be the acquired rotation angle.

    摘要翻译: 带电粒子束拉制设备包括带电粒子束源,具有用于旋转调节的第一和第二开口部分的第一和第二成形孔径掩模,用于检测平行于第二掩模的平面中的带电粒子束强度分布的检测部分, 从源极通过开口部分,旋转角度控制部分,以控制掩模之间的相对旋转角度,获取部分,以获得掩模之间的相对旋转角度,使得掩模之间的相对旋转角度的偏差落在预定范围内,基于 通过控制部分多次改变掩模之间的相对旋转角度并且通过每个旋转角度由检测部分检测光束而获得的检测结果,以及指令部分,其指示旋转角度控制部分,使得旋转角度控制部分之间的相对旋转角度 掩模是获得的旋转角度 。

    System, method and a program for correcting conditions for controlling a charged particle beam for lithography and observation, and a program and method for manufacturing a semiconductor device
    15.
    发明申请
    System, method and a program for correcting conditions for controlling a charged particle beam for lithography and observation, and a program and method for manufacturing a semiconductor device 有权
    用于校正用于光刻和观察的带电粒子束的控制条件的系统,方法和程序,以及用于制造半导体器件的程序和方法

    公开(公告)号:US20060076508A1

    公开(公告)日:2006-04-13

    申请号:US11239428

    申请日:2005-09-30

    IPC分类号: G01N23/00

    摘要: A system for correcting a charged particle beam lithography condition including: an error calculation unit configured to calculate an error in an illumination position of a charged particle beam, the charged particle beam is controlled by a lithography condition corrected by initial correction parameters; a temporary correction unit configured to calculate temporary correction parameters to decrease the error to a minimum; and a main correction unit configured to calculate main correction parameters correcting the lithography condition, by executing statistical processing using the temporary correction parameters and the initial correction parameters.

    摘要翻译: 一种用于校正带电粒子束光刻条件的系统,包括:误差计算单元,被配置为计算带电粒子束的照明位置的误差,带电粒子束由通过初始校正参数校正的光刻条件控制; 临时校正单元,被配置为计算临时校正参数以将所述误差减小到最小; 以及主校正单元,被配置为通过使用临时校正参数和初始校正参数执行统计处理来计算校正光刻条件的主要校正参数。

    Method for manufacturing photo mask, method for manufacturing semiconductor device, and program
    16.
    发明授权
    Method for manufacturing photo mask, method for manufacturing semiconductor device, and program 有权
    制造光掩模的方法,制造半导体器件的方法和程序

    公开(公告)号:US08883373B2

    公开(公告)日:2014-11-11

    申请号:US13679396

    申请日:2012-11-16

    IPC分类号: G03F1/62 G03F1/64

    CPC分类号: G03F1/62

    摘要: According to one embodiment, a method for manufacturing a photo mask, includes acquiring first data on respective shapes of a plurality of mask substrates, acquiring second data on respective shapes of a plurality of pellicles, and determining a combination of the mask substrate and the pellicle based on the first data and the second data.

    摘要翻译: 根据一个实施例,一种制造光掩模的方法包括:获取关于多个掩模基板的各个形状的第一数据,获取关于多个防护薄膜的各自形状的第二数据,以及确定掩模基板和防护薄膜组件的组合 基于第一数据和第二数据。

    MOLD AND MOLD BLANK SUBSTRATE
    17.
    发明申请
    MOLD AND MOLD BLANK SUBSTRATE 审中-公开
    模具和模具底座

    公开(公告)号:US20140072668A1

    公开(公告)日:2014-03-13

    申请号:US13731617

    申请日:2012-12-31

    IPC分类号: B29C59/02

    摘要: According to one embodiment, a mold includes a base material, a pedestal portion and a pattern portion. The base material includes a first surface and a second surface. The pedestal portion protruded from the first surface of the base material and includes a side surface. The pattern portion is provided in the pedestal portion and includes an concave-convex pattern. The pedestal portion includes a first region and a second region. The first region is provided with the concave-convex pattern. The second region is provided between the first region and the side surface. The second region has maximum height equal to maximum height of the first region. The second region has a first height of the second region on the side surface side and a second height of the second region on the first region side. The first height is lower than the second height.

    摘要翻译: 根据一个实施例,模具包括基底材料,基座部分和图案部分。 基材包括第一表面和第二表面。 所述基座部从所述基材的第一表面突出并且包括侧面。 图案部分设置在基座部分中并且包括凹凸图案。 基座部分包括第一区域和第二区域。 第一区域设置有凹凸图案。 第二区域设置在第一区域和侧面之间。 第二区域具有等于第一区域的最大高度的最大高度。 所述第二区域具有在所述第一区域侧上的所述第二区域的侧表面侧的第一高度和所述第二区域的第二高度。 第一个高度低于第二个高度。

    METHOD FOR MANUFACTURING PHOTO MASK, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM
    18.
    发明申请
    METHOD FOR MANUFACTURING PHOTO MASK, METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE, AND PROGRAM 有权
    制造摄影胶片的方法,制造半导体器件的方法和程序

    公开(公告)号:US20130130157A1

    公开(公告)日:2013-05-23

    申请号:US13679396

    申请日:2012-11-16

    IPC分类号: G03F1/62

    CPC分类号: G03F1/62

    摘要: According to one embodiment, a method for manufacturing a photo mask, includes acquiring first data on respective shapes of a plurality of mask substrates, acquiring second data on respective shapes of a plurality of pellicles, and determining a combination of the mask substrate and the pellicle based on the first data and the second data.

    摘要翻译: 根据一个实施例,一种制造光掩模的方法包括:获取关于多个掩模基板的各个形状的第一数据,获取关于多个防护薄膜的各自形状的第二数据,以及确定掩模基板和防护薄膜组件的组合 基于第一数据和第二数据。

    PATTERN FORMING APPARATUS
    19.
    发明申请
    PATTERN FORMING APPARATUS 审中-公开
    图案形成装置

    公开(公告)号:US20130077066A1

    公开(公告)日:2013-03-28

    申请号:US13428519

    申请日:2012-03-23

    IPC分类号: G03B27/74

    摘要: According to one embodiment, a pattern forming apparatus includes a stage provided under a lower surface of a substrate, a probe provided above an upper surface of the substrate, a drive unit which drives at least one of the stage and the probe, a monitor/lithography unit connected to the probe, and a control unit which controls the drive unit and the monitor/lithography unit. The control unit is configured to change a relative position between the probe and the substrate, and form a first pattern in an area direct above a second pattern after detecting the first pattern in the substrate by the probe.

    摘要翻译: 根据一个实施例,图案形成装置包括设置在基板的下表面下方的台,设置在基板的上表面上方的探针,驱动台和探针中的至少一个的驱动单元,监视器/ 连接到探针的光刻单元,以及控制驱动单元和监视器/光刻单元的控制单元。 控制单元被配置为改变探针和衬底之间的相对位置,并且在通过探针检测到衬底中的第一图案之后,在直接在第二图案之上的区域中形成第一图案。

    Control method for semiconductor manufacturing apparatus, control system for semiconductor manufacturing apparatus, and manufacturing method for semiconductor device
    20.
    发明授权
    Control method for semiconductor manufacturing apparatus, control system for semiconductor manufacturing apparatus, and manufacturing method for semiconductor device 失效
    半导体制造装置的控制方法,半导体制造装置的控制系统以及半导体装置的制造方法

    公开(公告)号:US08180472B2

    公开(公告)日:2012-05-15

    申请号:US12497349

    申请日:2009-07-02

    IPC分类号: G06F19/00

    摘要: A control method for a semiconductor manufacturing apparatus, comprising: generating, as log data, a history of operation states of the semiconductor manufacturing apparatus when a wafer is processed by the semiconductor manufacturing apparatus; specifying, based on the log data, processing results in which operation states of the semiconductor manufacturing apparatus are abnormal states out of processing results after the processing of the wafer processed by the semiconductor manufacturing apparatus as abnormal processing results; creating control data for the semiconductor manufacturing apparatus based on the processing results and the abnormal processing results; and controlling the processing by the semiconductor manufacturing apparatus using the control data.

    摘要翻译: 一种半导体制造装置的控制方法,包括:当半导体制造装置处理晶片时,产生作为对数数据的半导体制造装置的工作状态的历史; 基于对数数据,指定在由半导体制造装置处理的晶片处理之后的处理结果中作为异常处理结果的半导体制造装置的操作状态为异常状态的处理结果; 基于处理结果和异常处理结果创建半导体制造装置的控制数据; 以及使用控制数据来控制半导体制造装置的处理。