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公开(公告)号：US08550801B2
公开(公告)日：2013-10-08
申请号：US13230554
申请日：2011-09-12
IPC分类号： B29C59/02
CPC分类号： B29C59/022 , B29C35/0888 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.
摘要翻译： 在一个实施例中，压印装置包括被配置为保持用于印记的模板的模板保持部分。 该装置还包括模板移动部件，其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上，或者从光固化树脂脱模模板。 该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。 该设备还包括脱模控制部件，当脱模模板从光固化树脂脱模时，该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。
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公开(公告)号：US20120061882A1
公开(公告)日：2012-03-15
申请号：US13230554
申请日：2011-09-12
IPC分类号： B29C35/08
CPC分类号： B29C59/022 , B29C35/0888 , B29C2035/0827 , B29C2059/023 , B82Y10/00 , B82Y40/00 , G03F7/0002
摘要： In one embodiment, an imprint apparatus includes a template holding part configured to hold a template for imprint. The apparatus further includes a template moving part configured to move the template to press the template onto a light curing resin on a transfer target substrate or to demold the template from the light curing resin. The apparatus further includes a light source configured to irradiate the light curing resin with light to cure the light curing resin. The apparatus further includes a demold control part configured to control a demold speed or a demold angle of the template, based on a position of a shot region from which the template is to be demolded, when demolding the template from the light curing resin.
摘要翻译： 在一个实施例中，压印装置包括被配置为保持用于印记的模板的模板保持部分。 该装置还包括模板移动部件，其构造成移动模板以将模板按压在转印目标基板上的光固化树脂上，或者从光固化树脂脱模模板。 该装置还包括配置成用光照射光固化树脂以固化光固化树脂的光源。 该设备还包括脱模控制部件，当脱模模板从光固化树脂脱模时，该脱模控制部件被配置为基于模板从其脱模的喷射区域的位置来控制模板的脱模速度或脱模角度。
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3.发明授权公开(公告)号：US08180472B2
公开(公告)日：2012-05-15
申请号：US12497349
申请日：2009-07-02
申请人： Masayuki Hatano , Tetsuro Nakasugi
发明人： Masayuki Hatano , Tetsuro Nakasugi
IPC分类号： G06F19/00
CPC分类号： G05B19/41875 , G05B2219/31265 , G05B2219/32196 , Y02P90/22
摘要： A control method for a semiconductor manufacturing apparatus, comprising: generating, as log data, a history of operation states of the semiconductor manufacturing apparatus when a wafer is processed by the semiconductor manufacturing apparatus; specifying, based on the log data, processing results in which operation states of the semiconductor manufacturing apparatus are abnormal states out of processing results after the processing of the wafer processed by the semiconductor manufacturing apparatus as abnormal processing results; creating control data for the semiconductor manufacturing apparatus based on the processing results and the abnormal processing results; and controlling the processing by the semiconductor manufacturing apparatus using the control data.
摘要翻译： 一种半导体制造装置的控制方法，包括：当半导体制造装置处理晶片时，产生作为对数数据的半导体制造装置的工作状态的历史; 基于对数数据，指定在由半导体制造装置处理的晶片处理之后的处理结果中作为异常处理结果的半导体制造装置的操作状态为异常状态的处理结果; 基于处理结果和异常处理结果创建半导体制造装置的控制数据; 以及使用控制数据来控制半导体制造装置的处理。
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4.发明授权公开(公告)号：US08118585B2
公开(公告)日：2012-02-21
申请号：US12882944
申请日：2010-09-15
申请人： Masayuki Hatano , Suigen Kyoh , Tetsuro Nakasugi
发明人： Masayuki Hatano , Suigen Kyoh , Tetsuro Nakasugi
IPC分类号： A01J21/00
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00 , G03F9/00
摘要： In one embodiment, a pattern formation method is disclosed. The method can place a liquid resin material on a workpiece substrate. The method can press a template against the resin material and measuring distance between a lower surface of a projection of the template and an upper surface of the workpiece substrate. The template includes a pattern formation region and a circumferential region around the pattern formation region. A pattern for circuit pattern formation is formed in the pattern formation region and the projection is formed in the circumferential region. The method can form a resin pattern by curing the resin material in a state of pressing the template. In addition, the method can separate the template from the resin pattern.
摘要翻译： 在一个实施例中，公开了图案形成方法。 该方法可以将液态树脂材料放置在工件基板上。 该方法可以将模板压靠树脂材料并测量模板的突起的下表面与工件基板的上表面之间的距离。 模板包括图案形成区域和围绕图案形成区域的周边区域。 在图案形成区域中形成用于电路图案形成的图案，并且在周向区域中形成突起。 该方法可以通过在压制模板的状态下固化树脂材料来形成树脂图案。 此外，该方法可以将模板与树脂图案分离。
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公开(公告)号：US20110192300A1
公开(公告)日：2011-08-11
申请号：US13023225
申请日：2011-02-08
申请人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
发明人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： According to one embodiment, an imprint method is disclosed. The method can include forming a liquid droplet of a transfer material with a volume greater than a predetermined reference volume by dropping the transfer material onto a major surface of a processing substrate. The method can include reducing the volume of the liquid droplet to be less than the reference volume by volatilizing the liquid droplet. In addition, the method can include filling the transfer material into a recess provided in a transfer surface of a template by bringing the liquid droplet having the volume reduced to be less than the reference volume into contact with the transfer surface of the template.
摘要翻译： 根据一个实施例，公开了压印方法。 该方法可以包括通过将转印材料落到处理衬底的主表面上来形成体积大于预定参考体积的转印材料的液滴。 该方法可以包括通过挥发液滴来将液滴的体积减小到小于参考体积。 此外，该方法可以包括通过使体积减小到小于参考体积的液滴与模板的转印表面接触来将转印材料填充到设置在模板的转印表面中的凹部中。
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公开(公告)号：US08973494B2
公开(公告)日：2015-03-10
申请号：US13023225
申请日：2011-02-08
申请人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
发明人： Masayuki Hatano , Ikuo Yoneda , Tetsuro Nakasugi , Kenji Ooki
CPC分类号： G03F7/0002 , B82Y10/00 , B82Y40/00
摘要： According to one embodiment, an imprint method is disclosed. The method can include forming a liquid droplet of a transfer material with a volume greater than a predetermined reference volume by dropping the transfer material onto a major surface of a processing substrate. The method can include reducing the volume of the liquid droplet to be less than the reference volume by volatilizing the liquid droplet. In addition, the method can include filling the transfer material into a recess provided in a transfer surface of a template by bringing the liquid droplet having the volume reduced to be less than the reference volume into contact with the transfer surface of the template.
摘要翻译： 根据一个实施例，公开了压印方法。 该方法可以包括通过将转印材料落到处理衬底的主表面上来形成体积大于预定参考体积的转印材料的液滴。 该方法可以包括通过挥发液滴来将液滴的体积减小到小于参考体积。 此外，该方法可以包括通过使体积减小到小于参考体积的液滴与模板的转印表面接触来将转印材料填充到设置在模板的转印表面中的凹部中。
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7.发明授权Semiconductor manufacturing apparatus and method for manufacturing semiconductor device 有权半导体制造装置及半导体装置的制造方法公开(公告)号：US08901012B2
公开(公告)日：2014-12-02
申请号：US13599358
申请日：2012-08-30
申请人： Masayuki Hatano , Hiroshi Tokue
发明人： Masayuki Hatano , Hiroshi Tokue
CPC分类号： C23C16/52 , B82Y10/00 , B82Y40/00 , C23C16/4401 , G03F7/0002 , H01L21/6715
摘要： According to one embodiment, a semiconductor manufacturing apparatus includes a substrate stage, a transfer unit, and a control unit. A substrate is settable on the substrate stage. The transfer unit is configured to transfer a pattern having an uneven configuration onto a major surface of the substrate by attachably and removably holding a template. The pattern is provided in the transfer surface. The control unit is configured to acquire information relating to a number of foreign objects on the major surface prior to the transferring of the pattern. The control unit adds the number for a plurality of the substrates including the pattern transferred by the transfer unit. The control unit causes the transfer unit not to implement the transferring of the pattern in the case where the sum has reached the upper limit.
摘要翻译： 根据一个实施例，半导体制造装置包括基板台，转印单元和控制单元。 衬底可在衬底台上设置。 转印单元被配置为通过可附接地和可移除地保持模板将具有不均匀构造的图案转印到基板的主表面上。 转印面上设有图案。 控制单元被配置为在传送图案之前获取与主表面上的多个异物相关的信息。 控制单元添加包括由传送单元传送的图案的多个基板的数量。 在总和达到上限的情况下，控制单元使得传送单元不执行图案的传送。
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公开(公告)号：US5983933A
公开(公告)日：1999-11-16
申请号：US974550
申请日：1997-11-19
申请人： Tadahiro Ohmi , Yuji Kawano , Keiji Hirao , Hisashi Tanaka , Naoya Masuda , Yukio Minami , Masayuki Hatano , Shigeaki Tanaka , Michio Yamaji , Hiroshi Morokoshi , Michio Kuramochi , Nobukazu Ikeda , Shigeru Itoi , Michihiro Kashiwa
发明人： Tadahiro Ohmi , Yuji Kawano , Keiji Hirao , Hisashi Tanaka , Naoya Masuda , Yukio Minami , Masayuki Hatano , Shigeaki Tanaka , Michio Yamaji , Hiroshi Morokoshi , Michio Kuramochi , Nobukazu Ikeda , Shigeru Itoi , Michihiro Kashiwa
CPC分类号： F15B13/0832 , F15B13/0817 , F15B13/0871 , F15B13/0892 , F15B13/0896 , F16K27/003 , Y10T137/87249 , Y10T137/87684 , Y10T137/87917
摘要： A valve mount having two valves removably installed thereon from above as arranged in a direction comprises an inflow channel forming member having a channel in communication with an inlet of the valve disposed at one end thereof, a communication channel forming member having a channel for causing an outlet of the valve at the end to communicate with an inlet of the other valve adjacent thereto, an outflow channel forming member having a channel in communication with an outlet of the other valve, and a subchannel forming member having a channel in communication with an inlet-outlet port formed in the other valve.
摘要翻译： 具有两个可自由拆卸地安装在其上的阀的阀座具有一个流入通道形成构件，该流入通道形成构件具有与设置在其一端的阀的入口连通的通道;连通通道形成构件，具有通道， 所述阀的端部的出口与与其相邻的另一阀的入口连通，具有与所述另一个阀的出口连通的通道的流出通道形成构件，以及具有与入口连通的通道的子通道形成构件 - 出口端口形成在另一个阀门中。
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公开(公告)号：US5737162A
公开(公告)日：1998-04-07
申请号：US693351
申请日：1996-08-06
申请人： Hiroki Ito , Takashi Moriyama , Kenji Kamei , Suenobu Hamano , Etsuo Nitta , Kazuhiko Arai , Naoaki Takeji , Koji Takahata , Masayuki Hatano
发明人： Hiroki Ito , Takashi Moriyama , Kenji Kamei , Suenobu Hamano , Etsuo Nitta , Kazuhiko Arai , Naoaki Takeji , Koji Takahata , Masayuki Hatano
CPC分类号： H01H33/596 , H01H33/143
摘要： An objective of this invention is to provide a DC circuit breaking device having functions for transmitting direct currents to an electric power system and interrupting direct currents to the electric power system under abnormal conditions such as grounding and short-circuits, where the DC circuit breaking device can minimize the capacity of a condenser for the commuting circuit while rapidly changing the arc voltage to cause arc currents to be quickly extended and vibrated in order to interrupt direct currents in a short arc time. This DC circuit breaking device includes a main DC circuit breaker for interrupting the transmission of direct currents to an electric power system and a DC circuit breaker that is connected in series to the main DC circuit breaker and which is smaller than the main DC circuit breaker. The circuit breaking device also includes a commutation circuit that is connected in parallel to the DC circuit breaker and the small DC circuit breaker which are connected together in series and which is constituted by a reactor and a condenser. The circuit breaking device also includes a surge absorber for absorbing a surged voltage applied to for the condenser.
摘要翻译： 本发明的目的是提供一种直流断路装置，其具有在直流断路装置等异常条件下向电力系统发送直流电流和中断到电力系统的直流的功能。 可以最小化通勤电路的电容器的容量，同时快速改变电弧电压，使电弧电流迅速延伸和振动，以便在短时间内中断直流电流。 该DC断路装置包括用于中断与电力系统的直流的传输的主DC断路器和与主DC断路器串联连接并且小于主DC断路器的DC断路器。 断路装置还包括与DC断路器和小型DC断路器并联连接的换向电路，它们串联连接在一起并且由反应器和冷凝器构成。 断路装置还包括用于吸收施加到冷凝器的浪涌电压的浪涌吸收器。
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公开(公告)号：US08420422B2
公开(公告)日：2013-04-16
申请号：US13041917
申请日：2011-03-07
申请人： Masafumi Asano , Ryoichi Inanami , Masayuki Hatano
发明人： Masafumi Asano , Ryoichi Inanami , Masayuki Hatano
IPC分类号： H01L21/00
CPC分类号： H01L22/20 , B82Y10/00 , B82Y40/00 , G03F7/0002 , H01L22/12
摘要： According to the embodiments, a distribution of a recess portion shape is calculated based on a result obtained by measuring the recess portion shape of a first projection and recess pattern formed on a surface of a template. Next, a distribution of an application amount of a curing agent to a processing target layer is calculated based on the distribution of the recess portion shape, and the curing agent is applied to the processing target layer based on this distribution of the application amount of the curing agent. Next, a second projection and recess pattern is formed by transferring the first projection and recess pattern onto the curing agent by causing the curing agent to cure in a state where the first projection and recess pattern is in contact with the curing agent.
摘要翻译： 根据实施例，基于通过测量形成在模板的表面上的第一突起和凹部图案的凹部形状获得的结果来计算凹部形状的分布。 接下来，基于凹部形状的分布计算固化剂的涂布量到处理对象层的分布，并且基于该涂布量的分布将固化剂施加到处理对象层 固化剂。 接下来，通过使固化剂在第一突起和凹部图案与固化剂接触的状态下固化而将第一突起和凹陷图案转印到固化剂上形成第二突起和凹陷图案。
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