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公开(公告)号:US10037901B2
公开(公告)日:2018-07-31
申请号:US14713275
申请日:2015-05-15
Applicant: TOKYO ELECTRON LIMITED
Inventor: Kazuya Koyama , Hiromi Kiyose , Katsufumi Matsuki , Shuhei Takahashi , Hideki Nishimura , Takashi Uno , Hirotaka Maruyama
CPC classification number: H01L21/67017 , B08B9/032 , H01L21/67023
Abstract: A substrate liquid treatment apparatus includes: at least one processing unit that processes a substrate with a treatment liquid; a storage tank that stores the treatment liquid; a circulation line through which the treatment liquid discharged from the storage tank into the circulation line is returned to the storage tank; a branch supply line that is branched from the circulation line to supply the treatment liquid to the processing unit; a recovery line that returns to the storage tank the treatment liquid having been supplied to the substrate in the processing unit; a distribution line connecting the circulation line and the recovery line; and a shutoff valve, provided on the distribution line, that is opened when cleaning of the recovery line is performed.
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12.
公开(公告)号:US20140373877A1
公开(公告)日:2014-12-25
申请号:US14297723
申请日:2014-06-06
Applicant: Tokyo Electron Limited
Inventor: Shigehisa Inoue , Daisuke Nakayama , Katsufumi Matsuki , Takuro Masuzumi , Yuki Yoshida , Meitoku Aibara , Hiromi Kiyose , Takashi Uno , Hirotaka Maruyama , Kazuya Koyama , Takashi Nakazawa
CPC classification number: B08B3/02 , H01L21/67051
Abstract: Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential.
Abstract translation: 公开了一种液体处理装置和液体处理方法,其中基板由液滴形式的处理液体处理。 液体处理装置包括:第一处理液体喷射单元,被配置为将含有纯水的液滴形式的第一处理液喷射到基板的表面; 以及第二处理液体喷射单元,被配置为以液滴的形式将作为连续液体流的第二处理液体朝向由第一处理液体处理的基板的表面喷射。 第二处理液将基板表面上的ζ电位反转为负ζ电位。
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