LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD
    12.
    发明申请
    LIQUID PROCESSING APPARATUS AND LIQUID PROCESSING METHOD 审中-公开
    液体加工设备和液体加工方法

    公开(公告)号:US20140373877A1

    公开(公告)日:2014-12-25

    申请号:US14297723

    申请日:2014-06-06

    CPC classification number: B08B3/02 H01L21/67051

    Abstract: Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential.

    Abstract translation: 公开了一种液体处理装置和液体处理方法,其中基板由液滴形式的处理液体处理。 液体处理装置包括:第一处理液体喷射单元,被配置为将含有纯水的液滴形式的第一处理液喷射到基板的表面; 以及第二处理液体喷射单元,被配置为以液滴的形式将作为连续液体流的第二处理液体朝向由第一处理液体处理的基板的表面喷射。 第二处理液将基板表面上的ζ电位反转为负ζ电位。

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