公开(公告)号：US11715663B2

公开(公告)日：2023-08-01

申请号：US17181021

申请日：2021-02-22

Applicant: Tokyo Electron Limited

Inventor： Kenji Sugakawa ,  Yosuke Omori

IPC: B29C65/00 ,  H01L21/683 ,  B65H5/22 ,  B29C65/78

CPC classification number: H01L21/6838 ,  B65H5/226 ,  B29C65/004 ,  B29C65/782 ,  B29C65/7847 ,  B29C66/81421 ,  B29C66/81455

Abstract: A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.

公开(公告)号：US20230014665A1

公开(公告)日：2023-01-19

申请号：US17933983

申请日：2022-09-21

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Norifumi Kohama ,  Norio Wada ,  Yosuke Omori ,  Kenji Sugakawa

IPC: H01L21/67 ,  H01L21/68 ,  H01L21/683 ,  H01L21/687

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

公开(公告)号：US20210358879A1

公开(公告)日：2021-11-18

申请号：US17320338

申请日：2021-05-14

Applicant: Tokyo Electron Limited

Inventor： Kenji Sugakawa ,  Yosuke Omori

IPC: H01L23/00

Abstract: A bonding apparatus includes a holder; a pressing member; and a curvature adjuster. The holder is configured to attract and hold a substrate to be bonded. The pressing member is configured to come into contact with a central portion of the substrate attracted to and held by the holder and press the substrate to allow the central portion of the substrate to be protruded. The curvature adjuster is configured to adjust a curvature of the substrate pressed by the pressing member.

公开(公告)号：US11164842B2

公开(公告)日：2021-11-02

申请号：US16556409

申请日：2019-08-30

Applicant: Tokyo Electron Limited

Inventor： Yosuke Omori ,  Kenji Sugakawa

IPC: B32B37/00 ,  H01L23/00 ,  H01L21/20 ,  H01L21/64 ,  H01L21/67

Abstract: Deformation of substrates after the substrates are bonded can be suppressed. A bonding apparatus includes a first holding unit configured to attract and hold a first substrate from above; a second holding unit provided under the first holding unit and configured to attract and hold a second substrate from below; and a striker configured to press a central portion of the first substrate from above and bring the first substrate into contact with the second substrate. The first holding unit is configured to attract and hold a partial region of a peripheral portion of the first substrate, and the first holding unit attracts and holds the region which intersects with a direction, among directions from the central portion of the first substrate toward the peripheral portion thereof, in which a bonding region between the first substrate and the second substrate is expanded faster.

公开(公告)号：US20210035827A1

公开(公告)日：2021-02-04

申请号：US16964008

申请日：2019-01-11

Applicant: Tokyo Electron Limited

Inventor： Kimio Motoda ,  Norifumi Kohama ,  Norio Wada ,  Yosuke Omori ,  Kenji Sugakawa

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/68 ,  H01L21/687

Abstract: A substrate processing apparatus includes a holder having thereon an attraction surface configured to attract a substrate and including an outer attracting member configured to attract a peripheral portion of the substrate and an inner attracting member configured to attract a portion of the substrate inside the peripheral portion of the substrate attracted by the outer attracting member in a diametrical direction of the attraction surface; a moving device configured to move the outer attracting member with respect to the inner attracting member; and a controller configured to control a distortion, which is caused at the substrate attracted to the attraction surface, by controlling a movement of the outer attracting member with respect to the inner attracting member.

公开(公告)号：US10438920B2

公开(公告)日：2019-10-08

申请号：US15822364

申请日：2017-11-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Yoshitaka Otsuka ,  Takashi Nakamitsu ,  Yosuke Omori ,  Kenji Sugakawa

IPC: B32B41/00 ,  H01L23/00 ,  H01L21/677 ,  H01L21/67 ,  H01L21/683 ,  B32B15/01 ,  H01L21/18 ,  H01L21/20 ,  H01L21/68 ,  B32B37/10 ,  B32B37/00

Abstract: There is provided a bonding apparatus for bonding substrates together, which includes: a first holding part configured to adsorptively hold a first substrate by vacuum-drawing the first substrate on a lower surface of the first substrate; a second holding part provided below the first holding part and configured to adsorptively hold a second substrate by vacuum-drawing the second substrate on an upper surface of the second substrate; a pressing member provided in the first holding part and configured to press a central portion of the first substrate; and a plurality of substrate detection parts provided in the first holding part and configured to detect a detachment of the first substrate from the first holding part.

公开(公告)号：US20240105497A1

公开(公告)日：2024-03-28

申请号：US18475593

申请日：2023-09-27

Applicant: Tokyo Electron Limited

Inventor： Yosuke Omori ,  Norifumi Kohama

IPC: H01L21/687 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

CPC classification number: H01L21/68764 ,  H01L21/67259 ,  H01L21/6838 ,  H01L24/74 ,  H01L2224/74 ,  H01L2924/401

Abstract: A substrate processing apparatus includes a holder configured to hold a substrate by attracting the substrate on an attraction surface. The attraction surface includes an outer attraction portion configured to attract an outer peripheral portion of the substrate and an inner attraction portion configured to attract a portion of the substrate at an inner side than the outer peripheral portion. The holder includes a transforming unit configured to transform the outer attraction portion relative to the inner attraction portion.

公开(公告)号：US11837574B2

公开(公告)日：2023-12-05

申请号：US17320338

申请日：2021-05-14

Applicant: Tokyo Electron Limited

Inventor： Kenji Sugakawa ,  Yosuke Omori

IPC: H01L21/84 ,  H01L23/00

CPC classification number: H01L24/75 ,  H01L24/83 ,  H01L2224/751 ,  H01L2224/7555 ,  H01L2224/83894

Abstract: A bonding apparatus includes a holder; a pressing member; and a curvature adjuster. The holder is configured to attract and hold a substrate to be bonded. The pressing member is configured to come into contact with a central portion of the substrate attracted to and held by the holder and press the substrate to allow the central portion of the substrate to be protruded. The curvature adjuster is configured to adjust a curvature of the substrate pressed by the pressing member.

公开(公告)号：US11488929B2

公开(公告)日：2022-11-01

申请号：US16347868

申请日：2017-10-11

Applicant: Tokyo Electron Limited

Inventor： Takashi Nakamitsu ,  Shuhei Matsumoto ,  Yosuke Omori

IPC: H01L21/68 ,  H01L23/00 ,  H01L21/67 ,  H01L21/683 ,  H01L21/20 ,  B23K20/00 ,  H01L21/02

Abstract: A bonding apparatus configured to bond substrates comprises a first holder configured to vacuum-exhaust a first substrate to attract and hold the first substrate on a bottom surface thereof; a second holder disposed under the first holder, and configured to vacuum-exhaust a second substrate to attract and hold the second substrate on a top surface thereof; a mover configured to move the first holder and the second holder relatively in a horizontal direction; a laser interferometer system configured to measure a position of the first holder or the second holder which is moved by the mover; a linear scale configured to measure a position of the mover; and a controller configured to control the mover based on a measurement result of the laser interferometer system and a measurement result of the liner scale.

公开(公告)号：US20210272836A1

公开(公告)日：2021-09-02

申请号：US17181021

申请日：2021-02-22

Applicant: Tokyo Electron Limited

Inventor： Kenji Sugakawa ,  Yosuke Omori

IPC: H01L21/683 ,  B65H5/22

Abstract: A bonding apparatus includes a first holder, a first transforming device, a second holder, a second transforming device, a suction device and a control device. The first holder attracts and holds a first substrate from above. The first transforming device transforms the first substrate held by the first holder such that a central portion of the first substrate is protruded downwards. The second holder is provided under the first holder, and attracts and holds a second substrate, which is to be bonded to the first substrate, from below. The second transforming device transforms the second substrate held by the second holder such that a central portion of the second substrate is protruded upwards. The suction device generates different attracting forces in multiple division regions included in an attraction region of the second substrate. The control device controls the suction device.