公开(公告)号：US09066459B2

公开(公告)日：2015-06-23

申请号：US14008038

申请日：2012-03-29

申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

IPC分类号： H01B13/00 ,  H05K3/46 ,  H05K3/02

CPC分类号： H05K3/4611 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682

摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

摘要翻译： 使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

公开(公告)号：US20140054259A1

公开(公告)日：2014-02-27

申请号：US14008038

申请日：2012-03-29

申请人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

发明人： Ayumu Tateoka ,  Shinichi Obata ,  Toshiyuki Shimizu

IPC分类号： H05K3/46

CPC分类号： H05K3/4611 ,  H05K3/022 ,  H05K3/4658 ,  H05K3/4682

摘要： A manufacturing method of a multilayer printed wiring board in which a copper foil with carrier foil consists of at least four layers, a copper foil layer/a release layer/a heat-resistant metal layer/a carrier foil is used; a supporting substrate is manufactured by laminating an insulating layer constituting material to the surface of the carrier foil constituting the copper foil with carrier foil; a supporting substrate with build-up wiring layer is manufactured by forming a build-up wiring layer on the surface of the copper foil layer constituting the copper foil with carrier foil in the supporting substrate; the resulted supporting substrate with build-up wiring layer is separated at the release layer to manufacture a multilayered laminate; the resulted multilayered laminate is processed a necessary procedures to manufacture a multilayer printed wiring board.

摘要翻译： 使用具有载体箔的铜箔由至少四层构成的多层印刷电路板的制造方法，使用铜箔层/剥离层/耐热金属层/载体箔; 通过使用载体箔将构成材料的绝缘层层叠在构成铜箔的载体箔的表面上来制造支撑基板; 通过在支撑基板上用载体箔在构成铜箔的铜箔层的表面上形成积层布线层来制造具有堆积布线层的支撑基板; 所得到的具有积层布线层的支撑基底在剥离层处分离以制造多层层压体; 对所得到的多层层压体进行处理以制造多层印刷线路板的必要程序。

公开(公告)号：US07217464B2

公开(公告)日：2007-05-15

申请号：US10483612

申请日：2003-05-12

申请人： Akitoshi Takanashi ,  Kenichiro Iwakiri ,  Akiko Sugimoto ,  Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi

发明人： Akitoshi Takanashi ,  Kenichiro Iwakiri ,  Akiko Sugimoto ,  Junshi Yoshioka ,  Shinichi Obata ,  Makoto Dobashi

IPC分类号： B32B15/04 ,  B32B15/20 ,  B05D1/18 ,  B05D3/10 ,  C23G1/02

CPC分类号： B32B15/08 ,  C25D1/04 ,  C25D7/0614 ,  H05K3/025 ,  Y10T428/12438 ,  Y10T428/12556 ,  Y10T428/12569 ,  Y10T428/12903 ,  Y10T428/1291 ,  Y10T428/31678

摘要： The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C. For this purpose are adopted “a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which an organic adhesive interface layer is formed on a surface of carrier foil by use of an organic agent, and an electrodeposited copper foil layer is formed on the organic adhesive interface layer, characterized in that the formation of the organic adhesive interface layer on the surface of the carrier foil is performed by acid pickling the surface of the carrier foil by use of an acid pickling solution containing 50 ppm to 2000 ppm of organic agent used in the formation of the adhesive interface layer and by simultaneously causing the organic agent to be adsorbed whereby an acid pickled and adsorbed organic film is formed” and others.

摘要翻译： 本发明提供一种制造具有用于高温耐热性的载体箔的电沉积铜箔的方法，其中即使在不低于200℃的温度下进行压制加工，载体箔的剥离也容易。 为此，采用“使用有机试剂在载体箔的表面上形成有机粘合界面层的电解铜箔的高温耐热性的电解铜箔的制造方法和电沉积铜 在有机粘合剂界面层上形成箔层，其特征在于，通过使用含有50ppm的酸洗液对载体箔的表面酸洗，在载体箔的表面上形成有机粘合界面层 到2000ppm的用于形成粘合界面层的有机试剂，同时使有机试剂吸附，由此形成酸洗和吸附的有机膜“等。

公开(公告)号：US20060128419A1

公开(公告)日：2006-06-15

申请号：US11346208

申请日：2006-02-03

申请人： Hiroshi Shimizu ,  Masahiko Saito ,  Atsushi Ogino ,  Jun Maeoka ,  Nobuaki Kohinata ,  Shinichi Obata

发明人： Hiroshi Shimizu ,  Masahiko Saito ,  Atsushi Ogino ,  Jun Maeoka ,  Nobuaki Kohinata ,  Shinichi Obata

IPC分类号： H04M1/00

CPC分类号： H04M1/72577 ,  H04W48/04 ,  H04W52/0229 ,  H04W52/0235 ,  H04W84/042 ,  Y02D70/144 ,  Y02D70/164

摘要： There are provided a cellular telephone device and transmitter for setting a cellular telephone to answering mode and a telephone section to sleep status when communication forbidding information is received, and restoring telephone section operation when there is no communication forbidding information and canceling silent mode and answering mode; and automatically setting silent mode and answering mode when a communication forbidding signal is received, and maintaining the telephone section operation status when there is no communication forbidding information, and canceling silent mode and answering mode.

公开(公告)号：US06788928B2

公开(公告)日：2004-09-07

申请号：US10277696

申请日：2002-10-23

申请人： Nobuaki Kohinata ,  Jun Maeoka ,  Shinichi Obata ,  Hiroshi Shimizu ,  Masahiko Saito ,  Atsushi Ogino

发明人： Nobuaki Kohinata ,  Jun Maeoka ,  Shinichi Obata ,  Hiroshi Shimizu ,  Masahiko Saito ,  Atsushi Ogino

IPC分类号： H04M166

CPC分类号： G06K9/00885 ,  H04M1/67 ,  H04M1/72519 ,  H04M2250/12

摘要： A cellular phone which is easy to use featuring a sufficient degree of safety preventing unauthorized use by conducting a minimum degree of required authentication operation which is not perceived by the user. As the user holds the cellular phone 1 by hand, the control unit 12 issues an instruction to temperature obtaining units 15 to start detecting the temperature. The temperature obtaining units measure the temperature at regular intervals, and successively transfer the obtained temperature data to a temperature comparator unit 16. The temperature comparator unit judges whether the temperature data obtained by the temperature obtaining units are lying within a predetermined condition, and issues an instruction to biodata obtaining units 19 to obtain fingerprint data of the user depending upon the result of judgement. The biodata obtaining units obtain the fingerprint data of the user and transfer the obtained fingerprint data to a biodata authentication unit 20. The biodata authentication unit compares the obtained fingerprint data with the fingerprint data of the owner stored in a biodata storage unit 21, and judges whether the user is the proper user.

摘要翻译： 容易使用的便携式电话具有足够的安全性，通过进行不被用户感知的最小程度的所需认证操作来防止未经授权的使用。 当用户手持手机1时，控制单元12向温度获取单元15发出指令以开始检测温度。 温度获取单元以规则的间隔测量温度，并将获得的温度数据连续地传送到温度比较器单元16.温度比较器单元判断由温度获取单元获得的温度数据是否在预定条件内，并发出 指示生物数据获取单元19根据判断结果获取用户的指纹数据。 生物数据获取单元获取用户的指纹数据并将获得的指纹数据传送到生物数据鉴定单元20.生物数据认证单元将获得的指纹数据与存储在生物数据存储单元21中的所有者的指纹数据进行比较，并且判断 用户是否是正确的用户。

公开(公告)号：USD494153S1

公开(公告)日：2004-08-10

申请号：US29191151

申请日：2003-10-03

申请人： Shinichi Obata ,  Satoshi Suzuki

设计人： Shinichi Obata ,  Satoshi Suzuki

公开(公告)号：USD493443S1

公开(公告)日：2004-07-27

申请号：US29191317

申请日：2003-10-07

申请人： Shinichi Obata

设计人： Shinichi Obata

公开(公告)号：USD487104S1

公开(公告)日：2004-02-24

申请号：US29179297

申请日：2003-04-09

申请人： Shinichi Obata

设计人： Shinichi Obata

公开(公告)号：USD456020S1

公开(公告)日：2002-04-23

申请号：US29137734

申请日：2001-02-28

申请人： Shinichi Obata ,  Keisuke Matsunami ,  Takashi Saito ,  Yoshiaki Suzuki

设计人： Shinichi Obata ,  Keisuke Matsunami ,  Takashi Saito ,  Yoshiaki Suzuki

公开(公告)号：USD399506S

公开(公告)日：1998-10-13

申请号：US56602

申请日：1996-07-03

申请人： Hitoshi Takahashi ,  Shinichi Obata ,  Katsuhisa Hakoda

设计人： Hitoshi Takahashi ,  Shinichi Obata ,  Katsuhisa Hakoda