公开(公告)号：US08085335B2

公开(公告)日：2011-12-27

申请号：US12314636

申请日：2008-12-15

申请人： Tsuyoshi Ohno ,  Hitoshi Nakanishi ,  Toshiaki Edamitsu

发明人： Tsuyoshi Ohno ,  Hitoshi Nakanishi ,  Toshiaki Edamitsu

IPC分类号： H04N5/225

CPC分类号： G02B27/0018 ,  G02B5/005 ,  G03B9/02

摘要： An image pickup apparatus includes an image-pickup optical system, three color separation prisms separating incident light guided by the image-pickup optical system into three-primary-color light components and emitting the light components, and three image pickup elements respectively receiving the three light components from the prisms so as to produce respective image signals. Of the three prisms, a first prism that first receives the incident light has an edge extending parallel to an incidence plane. The image-pickup optical system has a plate-like fixed aperture stop disposed between the first prism and a final lens, disposed closest to the first prism, of multiple lenses included in the image-pickup optical system. The fixed aperture stop has an aperture that limits the incident light. An edge section of the aperture has projections and depressions arranged at least in parallel to the edge, as viewed from an optical-axis direction of the final lens.

摘要翻译： 图像拾取装置包括：图像拾取光学系统，将由图像拾取光学系统引导的入射光分离成三原色光分量并发射光分量的三个分离棱镜，以及分别接收三原色光分量的三个摄像元件 来自棱镜的光分量，以产生各自的图像信号。 在三个棱镜中，首先接收入射光的第一棱镜具有平行于入射平面延伸的边缘。 图像拾取光学系统具有设置在第一棱镜和最靠近第一棱镜的最终透镜之间的板状固定孔径光阑，包括在图像拾取光学系统中的多个透镜。 固定孔径光阑具有限制入射光的孔径。 当从最终透镜的光轴方向观察时，孔的边缘部分具有至少平行于边缘布置的突起和凹陷。

公开(公告)号：US06847120B2

公开(公告)日：2005-01-25

申请号：US10024154

申请日：2001-12-18

申请人： Tsuyoshi Ohno

发明人： Tsuyoshi Ohno

IPC分类号： H05K3/46 ,  H01L21/60 ,  H01L21/82 ,  H01L21/822 ,  H01L23/50 ,  H01L27/04 ,  H01L23/52

CPC分类号： H01L24/81 ,  H01L23/50 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01057 ,  H01L2924/0106 ,  H01L2924/01068 ,  H01L2924/01076 ,  H01L2924/01082 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/00

摘要： A flip chip semiconductor device has a cell forming layer assigned to macro-cells and input and output cells and a pad forming layer assigned to power supply pads for the macro-cells and input and output cells and signal pads for the input and output cells, and the signal pads are arranged outside of the power supply pads, whereby a package substrate to be assembled with the flip chip semiconductor device is simplified by virtue of the signal lines on a level with the signal pads, because any power supply pad is not an obstacle against the signal lines.

摘要翻译： 倒装芯片半导体器件具有分配给宏单元和输入和输出单元的单元形成层和分配给用于宏单元的电源焊盘以及用于输入和输出单元的输入和输出单元以及信号焊盘的焊盘形成层， 并且信号焊盘被布置在电源焊盘的外部，由此，由于任何电源焊盘不是与信号焊盘水平的信号线，因此与倒装芯片半导体器件组装的封装基板被简化 障碍信号线。

公开(公告)号：US06828820B2

公开(公告)日：2004-12-07

申请号：US10435112

申请日：2003-05-08

申请人： Tsuyoshi Ohno

发明人： Tsuyoshi Ohno

IPC分类号： H03K19003

CPC分类号： H03K19/0005 ,  H04L25/0278

摘要： A method for producing a stable control signal for impedance matching is provided which is capable of suppressing variation in impedance matching data by adding a shift voltage to a voltage to be compared. A comparator compares the voltage to be compared with a reference voltage and an up-down counter performs a counting operation according to a result from the comparison. A code converting circuit converts a count value output from the up-down counter to a thermometer code used for changing an impedance of an impedance varying circuit. A change in the impedance is made in a manner that, even when the voltage to be compared gets closest to the reference voltage, a shift voltage for the comparator to make an exact comparison is fed to the voltage to be compared. An averaging circuit averages a count value and the code converting circuit converts a resulting average value to the thermometer code.

公开(公告)号：US5534785A

公开(公告)日：1996-07-09

申请号：US495149

申请日：1995-06-27

申请人： Tsutomu Yoshizaki ,  Shigeyuki Maruyama ,  Tsuyoshi Ohno

发明人： Tsutomu Yoshizaki ,  Shigeyuki Maruyama ,  Tsuyoshi Ohno

IPC分类号： H01L21/66 ,  B65D85/30 ,  G01R1/04 ,  H01L23/12 ,  H01L23/32 ,  G01R1/073 ,  G01R31/02

CPC分类号： G01R1/0483

摘要： An IC bare chip carrier installs an IC bare chip for performing a burn-in test and a functional examination of the bare chip. The carrier consists of an installing unit for installing the bare chip and an interconnecting unit for electrically interconnecting chip electrodes of the bare chip with output electrodes of the interconnecting unit, to be connected to apparatus for the burn-in test and the functional examination. The installing unit is made of aluminium nitride having an expansion rate near of material, ceramic, of the IC bare chip, for making fabrication of installing surface of the IC bare chip easy. The interconnecting unit has an air exchange mechanism by which the IC bare chip can be laid in a space, made by combining the installing unit and the interconnecting unit, constantly filled with inert gas such as nitrogen. The IC bare chip is transported anytime and anywhere as installed in the carrier without being contaminated.

摘要翻译： IC裸芯片载体安装用于进行裸芯片的老化测试和功能检查的IC裸芯片。 载体由用于安装裸芯片的安装单元和用于将裸芯片的芯片电极与互连单元的输出电极互连的互连单元连接到用于老化测试和功能检查的设备。 该安装单元由具有IC裸芯片材料（陶瓷）附近的膨胀率的氮化铝制成，用于制造IC裸芯片的安装表面。 互连单元具有空气交换机构，通过该空气交换机构，IC裸芯片可以放置在通过组合安装单元和互连单元而形成的空间中，该空间不断地填充有惰性气体例如氮气。 集成电路裸芯片随时随地运送到载体上，不受污染。