IC Socket
    11.
    发明申请
    IC Socket 审中-公开

    公开(公告)号:US20200153140A1

    公开(公告)日:2020-05-14

    申请号:US16682391

    申请日:2019-11-13

    Abstract: An integrated circuit socket includes a housing having a flat plate portion and a plurality of contacts disposed in the housing. The contacts each have a contact beam projecting outwardly from a first surface of the housing and a retained portion disposed in a passageway in the flat plate portion. The contact beam extends from the retained portion. The retained portion has a base portion with a flat-plate shape and a pair of side portions extending at an angle with respect to the base portion on a pair of opposite sides of the base portion. A cross-section of the retained portion parallel to the first surface has a U-shape.

    Electrical connector assembly and mounting structure thereof
    12.
    发明授权
    Electrical connector assembly and mounting structure thereof 有权
    电连接器组件及其安装结构

    公开(公告)号:US09337566B2

    公开(公告)日:2016-05-10

    申请号:US14260692

    申请日:2014-04-24

    Abstract: An electrical connector assembly is disclosed having an electrical connector positionable over an opening in a wall to form an airtight seal and an electrical connection between the inside and an outside of the wall. The electrical connector has an insulating board made of insulating material. The insulating board includes a first surface facing the wall, a second surface on the side opposite to the first surface, and a side surface extending from a peripheral edge of the first surface to a peripheral edge of the second surface. An electrical connection portion made of electrically conductive material extends from the first surface through the insulating board to the second surface to electrically connect the first surface to the second surface. A surface roughness region provided at the peripheral edge of the first surface.

    Abstract translation: 公开了一种电连接器组件,其具有可定位在壁上的开口上的电连接器,以形成气密密封以及在壁的内部和外部之间的电连接。 电连接器具有由绝缘材料制成的绝缘板。 所述绝缘板包括面对所述壁的第一表面,与所述第一表面相对的一侧上的第二表面,以及从所述第一表面的周缘延伸到所述第二表面的周边边缘的侧表面。 由导电材料制成的电连接部分从第一表面延伸穿过绝缘板到第二表面,以将第一表面电连接到第二表面。 设置在第一表面的周缘的表面粗糙度区域。

    Interposer Assembly
    13.
    发明申请
    Interposer Assembly 审中-公开

    公开(公告)号:US20190123013A1

    公开(公告)日:2019-04-25

    申请号:US16164006

    申请日:2018-10-18

    CPC classification number: H01L24/72 H01L23/49827 H01L2924/1432

    Abstract: An interposer assembly having a housing with contact positioning holes each having a first wall face and a second wall face. The interposer contact has a base portion with shoulder portions and contact arm portions. The base portion is closer to the first wall face. The contact arm portions are once bulged from both respective vertical ends of the base portion toward the first wall face and then curved toward the second wall face. The housing has a retaining protrusion and a pair of slit portions. The retaining protrusion retains the interposer contact inside the contact positioning hole. Each of the shoulder portions is inserted into the slit portion. The slit portion blocks the interposer contact from moving toward the second wall face.

    Socket having solder balls
    14.
    发明授权

    公开(公告)号:US11916328B2

    公开(公告)日:2024-02-27

    申请号:US17084120

    申请日:2020-10-29

    Abstract: A socket includes a flat-plate-shaped housing, a plurality of contacts supported by the flat-plate-shaped housing, a frame attached to the flat-plate-shaped housing and extending along the flat-plate-shaped housing, a plurality of first solder balls disposed on a lower surface of the flat-plate-shaped housing and facing a circuit board, and a plurality of second solder balls disposed on the lower surface of the flat-plate-shaped housing. The frame defines, in an in-plane direction of the flat-plate-shaped housing, a position of an electronic component having a lower surface including a plurality of pads configured to contact the contacts upon the electronic component being mounted. The first solder balls electrically connect to each of the contacts and electrically connect to the circuit board. The second solder balls are not electrically connected to the contacts.

    Interposer
    15.
    发明申请

    公开(公告)号:US20220037823A1

    公开(公告)日:2022-02-03

    申请号:US17502564

    申请日:2021-10-15

    Abstract: An interposer includes a housing having a plurality of through-holes penetrating a first surface and a second surface and a signal contact pair composed of a pair of signal contacts. Each of the signal contacts includes a base portion press-fitted in one of the through-holes, a first contact beam extending from the base portion beyond the first surface, and a second contact beam extending from the base portion beyond the second surface. The pair of signal contacts are positioned adjacently to each other widthwise and are each asymmetrical with respect to a width direction. The signal contact pair has a plane-symmetrical shape with respect to the width direction.

    Interposer assembly
    16.
    发明授权

    公开(公告)号:US10825791B2

    公开(公告)日:2020-11-03

    申请号:US16164006

    申请日:2018-10-18

    Abstract: An interposer assembly having a housing with contact positioning holes each having a first wall face and a second wall face. The interposer contact has a base portion with shoulder portions and contact arm portions. The base portion is closer to the first wall face. The contact arm portions are once bulged from both respective vertical ends of the base portion toward the first wall face and then curved toward the second wall face. The housing has a retaining protrusion and a pair of slit portions. The retaining protrusion retains the interposer contact inside the contact positioning hole. Each of the shoulder portions is inserted into the slit portion. The slit portion blocks the interposer contact from moving toward the second wall face.

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