公开(公告)号：US20240237549A1

公开(公告)日：2024-07-11

申请号：US18610212

申请日：2024-03-19

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jin-Yan Chiou ,  Wei-Chuan Tsai ,  Hsin-Fu Huang ,  Yen-Tsai Yi ,  Hsiang-Wen Ke

IPC: H10N50/80 ,  G11C11/16 ,  H01F10/32 ,  H01F41/32 ,  H10N50/01 ,  H10N50/85

CPC classification number: H10N50/80 ,  G11C11/161 ,  H10N50/01 ,  H01F10/3254 ,  H01F41/32 ,  H10N50/85

Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a contact hole in the first IMD layer; forming a bottom electrode layer in the contact hole; forming a magnetic tunneling junction (MTJ) stack on the bottom electrode layer; and removing the MTJ stack and the bottom electrode layer to form a MTJ on a bottom electrode. Preferably, the bottom electrode protrudes above a top surface of the first IMD layer.

公开(公告)号：US11968906B2

公开(公告)日：2024-04-23

申请号：US16882552

申请日：2020-05-25

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jin-Yan Chiou ,  Wei-Chuan Tsai ,  Hsin-Fu Huang ,  Yen-Tsai Yi ,  Hsiang-Wen Ke

IPC: H10N50/80 ,  G11C11/16 ,  H10N50/01 ,  H10N50/85 ,  H01F10/32 ,  H01F41/32

CPC classification number: H10N50/80 ,  G11C11/161 ,  H10N50/01 ,  H01F10/3254 ,  H01F41/32 ,  H10N50/85

Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a contact hole in the first IMD layer; forming a bottom electrode layer in the contact hole; forming a magnetic tunneling junction (MTJ) stack on the bottom electrode layer; and removing the MTJ stack and the bottom electrode layer to form a MTJ on a bottom electrode. Preferably, the bottom electrode protrudes above a top surface of the first IMD layer.

公开(公告)号：US20230387280A1

公开(公告)日：2023-11-30

申请号：US17851048

申请日：2022-06-28

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yen-Tsai Yi ,  Wei-Chuan Tsai ,  Jin-Yan Chiou ,  Hsiang-Wen Ke

IPC: H01L29/778 ,  H01L29/20 ,  H01L29/08 ,  H01L29/66

CPC classification number: H01L29/7783 ,  H01L29/2003 ,  H01L29/0847 ,  H01L29/66462

Abstract: A method for fabricating high electron mobility transistor (HEMT) includes the steps of forming a buffer layer on a substrate, forming a barrier layer on the buffer layer, forming a p-type semiconductor layer on the barrier layer, forming a titanium nitride (TiN) layer on the p-type semiconductor layer as a nitrogen to titanium (N/Ti) ratio of the TiN layer is greater than 1, forming a passivation layer on the TiN layer and the barrier layer, removing the passivation layer to form an opening, forming a gate electrode in the opening, and then forming a source electrode and a drain electrode adjacent to two sides of the gate electrode on the buffer layer.

公开(公告)号：US12183801B2

公开(公告)日：2024-12-31

申请号：US17510394

申请日：2021-10-26

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jin-Yan Chiou ,  Wei-Chuan Tsai ,  Yen-Tsai Yi ,  Hsiang-Wen Ke

IPC: H01L29/45 ,  H01L29/40

Abstract: A method for fabricating semiconductor device includes the steps of first forming a gate structure on a substrate, forming a source/drain region adjacent to two sides of the gate structure, forming an epitaxial layer on the source/drain region, forming an interlayer dielectric (ILD) layer on the gate structure, forming a contact hole in the ILD layer to expose the epitaxial layer, forming a low stress metal layer in the contact hole, forming a barrier layer on the low stress metal layer, and forming an anneal process to form a first silicide layer and a second silicide layer.

公开(公告)号：US12089504B2

公开(公告)日：2024-09-10

申请号：US17361331

申请日：2021-06-29

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yen-Tsai Yi ,  Wei-Chuan Tsai ,  Jin-Yan Chiou ,  Hsiang-Wen Ke

IPC: H10N50/80 ,  H10B61/00 ,  H10N50/01

CPC classification number: H10N50/80 ,  H10B61/00 ,  H10N50/01

Abstract: A method for fabricating a magnetic random access memory (MRAM) device includes the steps of first forming a magnetic tunneling junction (MTJ) stack on a substrate, forming a first top electrode on the MTJ stack, and then forming a second top electrode on the first top electrode. Preferably, the first top electrode includes a gradient concentration while the second top electrode includes a non-gradient concentration.

公开(公告)号：US20240237550A1

公开(公告)日：2024-07-11

申请号：US18611753

申请日：2024-03-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Jin-Yan Chiou ,  Wei-Chuan Tsai ,  Hsin-Fu Huang ,  Yen-Tsai Yi ,  Hsiang-Wen Ke

IPC: H10N50/80 ,  G11C11/16 ,  H01F10/32 ,  H01F41/32 ,  H10N50/01 ,  H10N50/85

CPC classification number: H10N50/80 ,  G11C11/161 ,  H10N50/01 ,  H01F10/3254 ,  H01F41/32 ,  H10N50/85

Abstract: A method for fabricating a semiconductor device includes the steps of: forming a first inter-metal dielectric (IMD) layer on a substrate; forming a contact hole in the first IMD layer; forming a bottom electrode layer in the contact hole; forming a magnetic tunneling junction (MTJ) stack on the bottom electrode layer; and removing the MTJ stack and the bottom electrode layer to form a
MTJ on a bottom electrode. Preferably, the bottom electrode protrudes above a top surface of the first IMD layer.

公开(公告)号：US20240088293A1

公开(公告)日：2024-03-14

申请号：US17960146

申请日：2022-10-05

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chun-Ya Chiu ,  Ssu-I Fu ,  Chin-Hung Chen ,  Jin-Yan Chiou ,  Wei-Chuan Tsai ,  Yu-Hsiang Lin

IPC: H01L29/78 ,  H01L21/265 ,  H01L21/324 ,  H01L29/66

CPC classification number: H01L29/7847 ,  H01L21/26506 ,  H01L21/324 ,  H01L29/665

Abstract: An n-type metal oxide semiconductor transistor includes a gate structure, two source/drain regions, two amorphous portions and a silicide. The gate structure is disposed on a substrate. The two source/drain regions are disposed in the substrate and respectively located at two sides of the gate structure, wherein at least one of the source/drain regions is formed with a dislocation. The two amorphous portions are respectively disposed in the two source/drain regions. The silicide is disposed on the two source/drain regions, wherein at least one portion of the silicide overlaps the two amorphous portions.

公开(公告)号：US20220122915A1

公开(公告)日：2022-04-21

申请号：US17073413

申请日：2020-10-19

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yen-Tsai Yi ,  Wei-Chuan Tsai ,  Jin-Yan Chiou ,  Hsiang-Wen Ke

IPC: H01L23/535 ,  H01L23/522 ,  H01L23/532 ,  H01L21/321 ,  H01L21/768

Abstract: A semiconductor structure includes a substrate; a first inter-layer dielectric (ILD) layer on the substrate; an etch stop layer on the first ILD layer; a second inter-layer dielectric (ILD) layer on the etch stop layer; and a copper damascene interconnect layer disposed in the first ILD layer. A tungsten via structure is disposed in the second ILD layer and the etch stop layer, and is electrically connected to the copper damascene interconnect layer. The tungsten via structure includes a tungsten layer and a barrier layer surrounding the tungsten layer. An intermetallic layer is disposed between the barrier layer and the copper damascene interconnect layer.