Electrostatic discharge protection circuit

    公开(公告)号:US10262987B2

    公开(公告)日:2019-04-16

    申请号:US15481444

    申请日:2017-04-06

    Abstract: The present invention provides an ESD protection circuit electrically connected between a high voltage power line and a low voltage power line, and the ESD protection circuit includes a bipolar junction transistor (BJT) and a trigger source. A collector of the BJT is electrically connected to the high voltage power line, and an emitter and a base of the BJT are electrically connected to the low voltage power line. The trigger source is electrically connected between the base of the BJT and the high voltage power line.

    ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE CAPABLE OF PREVENTING LATCH-UP ISSUE CAUSED BY UNEXPECTED NOISE
    13.
    发明申请
    ELECTROSTATIC DISCHARGE PROTECTION STRUCTURE CAPABLE OF PREVENTING LATCH-UP ISSUE CAUSED BY UNEXPECTED NOISE 有权
    静电放电保护结构可防止由意外噪声引起的闭锁问题

    公开(公告)号:US20160118374A1

    公开(公告)日:2016-04-28

    申请号:US14986741

    申请日:2016-01-04

    Abstract: An electrostatic discharge protection structure comprises an isolation layer, a high voltage P-well, an N-well, a P-well, a first doped region of N-type conductivity, a second doped region of P-type conductivity, a third doped region of N-type conductivity, a fourth doped region of P-type conductivity, an anode, and a cathode. The isolation layer is disposed on a substrate. The high voltage P-well is disposed on the isolation layer. The N-well is disposed in the high voltage P-well. The P-well is disposed in the high voltage P-well, and the P-well is separated from the N-well. The first and the second doped regions are disposed in the N-well. The third and the fourth doped regions are disposed in the P-well. The anode is electrically connected to the first doped region and the second doped region, and the cathode is electrically connected to the fourth doped region.

    Abstract translation: 静电放电保护结构包括隔离层,高电压P阱,N阱,P阱,N型导电的第一掺杂区,P型导电的第二掺杂区,第三掺杂区 N型导电性区域,P型导电性的第四掺杂区域,阳极和阴极。 隔离层设置在基板上。 高压P阱设置在隔离层上。 N阱设置在高压P阱中。 P阱设置在高电压P阱中,P阱与N阱分离。 第一和第二掺杂区域设置在N阱中。 第三和第四掺杂区域设置在P阱中。 阳极电连接到第一掺杂区域和第二掺杂区域,阴极电连接到第四掺杂区域。

    SEMICONDUCTOR DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION
    14.
    发明申请
    SEMICONDUCTOR DEVICE FOR ELECTROSTATIC DISCHARGE PROTECTION 有权
    用于静电放电保护的半导体器件

    公开(公告)号:US20140284720A1

    公开(公告)日:2014-09-25

    申请号:US13848069

    申请日:2013-03-21

    Abstract: A semiconductor device includes a substrate, a gate positioned on the substrate, a drain region and a source region formed at respective two sides of the gate in the substrate, at least a first doped region formed in the drain region, and at least a first well having the first doped region formed therein. The source region and the drain region include a first conductivity type, the first doped region and the first well include a second conductivity type, and the first conductivity type and the second conductivity type are complementary to each other.

    Abstract translation: 半导体器件包括衬底,位于衬底上的栅极,形成在衬底中的栅极的相应两侧处的漏极区域和源极区域,形成在漏极区域中的至少第一掺杂区域,以及至少第一 其中形成有第一掺杂区。 源区和漏区包括第一导电类型,第一掺杂区和第一阱包括第二导电类型,并且第一导电类型和第二导电类型彼此互补。

    Electrostatic discharge protection structure capable of preventing latch-up issue caused by unexpected noise
    15.
    发明授权
    Electrostatic discharge protection structure capable of preventing latch-up issue caused by unexpected noise 有权
    静电放电保护结构能够防止由意外的噪音引起的闩锁问题

    公开(公告)号:US09443841B2

    公开(公告)日:2016-09-13

    申请号:US14986741

    申请日:2016-01-04

    Abstract: An electrostatic discharge protection structure comprises an isolation layer, a high voltage P-well, an N-well, a P-well, a first doped region of N-type conductivity, a second doped region of P-type conductivity, a third doped region of N-type conductivity, a fourth doped region of P-type conductivity, an anode, and a cathode. The isolation layer is disposed on a substrate. The high voltage P-well is disposed on the isolation layer. The N-well is disposed in the high voltage P-well. The P-well is disposed in the high voltage P-well, and the P-well is separated from the N-well. The first and the second doped regions are disposed in the N-well. The third and the fourth doped regions are disposed in the P-well. The anode is electrically connected to the first doped region and the second doped region, and the cathode is electrically connected to the fourth doped region.

    Abstract translation: 静电放电保护结构包括隔离层,高电压P阱,N阱,P阱,N型导电的第一掺杂区,P型导电的第二掺杂区,第三掺杂区 N型导电性区域,P型导电性的第四掺杂区域,阳极和阴极。 隔离层设置在基板上。 高压P阱设置在隔离层上。 N阱设置在高压P阱中。 P阱设置在高电压P阱中,P阱与N阱分离。 第一和第二掺杂区域设置在N阱中。 第三和第四掺杂区域设置在P阱中。 阳极电连接到第一掺杂区域和第二掺杂区域,阴极电连接到第四掺杂区域。

    Electrostatic discharge (ESD) protection device for an output buffer
    16.
    发明授权
    Electrostatic discharge (ESD) protection device for an output buffer 有权
    用于输出缓冲器的静电放电(ESD)保护装置

    公开(公告)号:US09325164B2

    公开(公告)日:2016-04-26

    申请号:US14492089

    申请日:2014-09-22

    CPC classification number: H02H9/046

    Abstract: An electrostatic discharge (ESD) protection device is disclosed. The ESD protection device comprises a trigger circuit, a switch, and an output buffer. When an ESD event occurs, the trigger circuit turns on the switch. One part of the current of the electrostatic discharge (ESD) event may be routed to a ground through the switch from the output buffer coupled to the output pad.

    Abstract translation: 公开了一种静电放电(ESD)保护装置。 ESD保护装置包括触发电路,开关和输出缓冲器。 当发生ESD事件时,触发电路接通开关。 静电放电(ESD)事件的一部分电流可以通过开关从连接到输出板的输出缓冲器路由到地。

    SEMICONDUCTOR DEVICE
    20.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20140319613A1

    公开(公告)日:2014-10-30

    申请号:US13873261

    申请日:2013-04-30

    Abstract: A semiconductor device includes a substrate, a gate positioned on the substrate, a drain and a source formed in the substrate at respective two sides of the gate, and a doped region formed in the source. The drain and the source comprise a first conductivity type and the doped region comprises a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other.

    Abstract translation: 半导体器件包括衬底,位于衬底上的栅极,在栅极的相应两侧在衬底中形成的漏极和源极以及形成在源极中的掺杂区域。 漏极和源极包括第一导电类型,并且掺杂区域包括第二导电类型。 第一导电类型和第二导电类型彼此互补。

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